Patent search ap:("IBM") AND inv:"REDDY SRINIVASA N" Page 1

1.

发明公开
MULTILAYER CERAMIC SUBSTRATE WITH SINGLE VIA ANCHORED PAD AND METHOD OF FORMING 审中-公开
Title translation: 与单个接触孔的固定垫和方法多层陶瓷基板

公开(公告)号：EP1704593A4

公开(公告)日：2010-06-23

申请号：EP05722439

申请日：2005-01-12

Applicant: IBM

Inventor： REDDY SRINIVASA N , FAROOQ MUKTA G , PRETTYMAN KEVIN M

IPC: H01L23/06 , H01L23/10 , H01L23/15 , H01L23/498 , H05K1/00 , H05K1/03 , H05K1/11

CPC classification number: H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H05K1/0298 , H05K1/0306 , H05K1/113 , H05K2201/096 , H01L2924/00

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