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1.发明公开VENTED VIAS FOR VIA IN PAD TECHNOLOGY ASSEMBLY PROCESS YIELD IMPROVEMENTS 审中-公开BREATHING接触孔关于改进装配方法使用接触孔连接面技术
公开(公告)号：EP1430756A1
公开(公告)日：2004-06-23
申请号：EP02773693.3
申请日：2002-09-30
Applicant: INTEL CORPORATION
Inventor： MCCORMICK, Carolyn , SATO, Daryl , BOGGS, David , JESSUP, Rebecca , DUNGAN, John
CPC classification number: H05K3/3436 , H01L2924/15151 , H05K1/113 , H05K1/116 , H05K3/0094 , H05K2201/09381 , H05K2201/0959 , H05K2201/09663 , H05K2201/10636 , H05K2201/10689 , H05K2201/10734 , H05K2203/0455 , H05K2203/1178 , Y02P70/611 , Y02P70/613
Abstract: An apparatus that includes a substrate, one or more via in pads (202) in the substrate; and one or more vents (204) in at least one of the one or more via in pads (202).
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