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1.发明授权Flexible circuit board assembly with common heat spreader and method of manufacture 失效与它们的共同的散热性和制造方法柔性电路板组件
公开(公告)号：EP0632685B1
公开(公告)日：1997-11-19
申请号：EP94108592.0
申请日：1994-06-01
发明人： Cutting, Lawrence Richard , Gaynes, Michael Anthony , Johnson, Eric Arthur , Milkovich, Cynthia Susan , Perkins, Jeffrey Scott , Pierson, Mark Vincent , Poetzinger, Steven Eugene , Zalesinski, Jerzy
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/021 , H05K1/0298 , H05K1/182 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/3415 , H05K3/3452 , H05K3/4691 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
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2.发明公开Flexible circuit board assembly with common heat spreader and method of manufacture 失效柔性电路板组件与它们的共同的散热性和制造方法。
公开(公告)号：EP0632685A3
公开(公告)日：1995-05-17
申请号：EP94108592.0
申请日：1994-06-01
发明人： Cutting, Lawrence Richard , Gaynes, Michael Anthony , Johnson, Eric Arthur , Milkovich, Cynthia Susan , Perkins, Jeffrey Scott , Pierson, Mark Vincent , Poetzinger, Steven Eugene , Zalesinski, Jerzy
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/021 , H05K1/0298 , H05K1/182 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/3415 , H05K3/3452 , H05K3/4691 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： Disclosed are multi-layer substrates for flexible circuit boards and flexible circuit board assemblies and their methods of manufacture. More particularly multi-layer flexible circuit board substrates are described for attaching components including chips and heat spreaders to form a three-dimensional circuit board assembly.
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3.发明公开Flexible circuit board assembly with common heat spreader and method of manufacture 失效柔性电路板组件与它们的共同的散热性和制造方法。
公开(公告)号：EP0632685A2
公开(公告)日：1995-01-04
申请号：EP94108592.0
申请日：1994-06-01
发明人： Cutting, Lawrence Richard , Gaynes, Michael Anthony , Johnson, Eric Arthur , Milkovich, Cynthia Susan , Perkins, Jeffrey Scott , Pierson, Mark Vincent , Poetzinger, Steven Eugene , Zalesinski, Jerzy
CPC分类号： H05K7/20454 , H01L21/4857 , H01L21/4867 , H01L23/3672 , H01L23/5387 , H01L2224/16 , H01L2924/01078 , H01L2924/01322 , H05K1/021 , H05K1/0298 , H05K1/182 , H05K1/189 , H05K3/0061 , H05K3/1216 , H05K3/3415 , H05K3/3452 , H05K3/4691 , H05K2201/0154 , H05K2201/09063 , H05K2201/096 , H05K2201/09745 , H05K2201/1056 , H05K2201/2009 , H05K2203/1394 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： Disclosed are multi-layer substrates for flexible circuit boards and flexible circuit board assemblies and their methods of manufacture.
More particularly multi-layer flexible circuit board substrates are described for attaching components including chips and heat spreaders to form a three-dimensional circuit board assembly.摘要翻译： 公开的是用于柔性电路板和柔性电路板组件和它们的制造方法的多层基板。 更具体地多层柔性电路板基板中描述用于附连包括芯片和散热器，以形成一个三维电路板组件的组件。
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