摘要:
Disclosed is a method of manufacturing a printed circuit panel. The method is carried out without a cleanroom, but in a clean room environment. The first step is to place a thin, non-rigid panel in a suitable fixture system, for example, for transfer and also for processing. The system includes a peripheral frame fixture for surrounding and supporting the in-process circuit panel layer, and a a loading chuck for mounting the in-process circuit panel layer in the peripheral frame fixture. The peripheral frame fixture includes a bottom plate (175) having a central opening to expose the circuit panel layer, a top frame (179) having a corresponding central opening to expose the opposite surface of the circuit panel layer, and compressive means, as screws, bolts, or the like, for applying a z-axis compressive force to the bottom plate, the top frame, and a panel layer therebetween. The loading chuck includes a peripheral edge for receiving the bottom plate of the peripheral frame fixture. A vacuum table is within the area bounded by the peripheral edge of the loading chuck and the peripheral frame of the peripheral frame fixture, and is coplanar with them. The vacuum table includes slidable bearing surfaces (131), with vacuum apertures (133) for drawing a vacuum to hold the panel in place, and slide actuators for moving the slidable bearing surfaces to apply x-y-axis tension to a panel on the bearing surfaces. The fixtured panel is then placed in an air tight transfer container, which has a substantially contaminant free atmosphere. The walls of the transfer container are fabricated out of substantially particulate free, unfilled polymers, such as polycarbonate. One of the end walls is an access wall. The access wall has an opening surrounded by a ferromagnetic gasket. This gasketed opening is adapted to receive a ferromagnetic door panel. The transfer container has a sealed door at one end. The transfer container is then brought into a sealable, substantially airtight interlock with a process enclosure. This process enclosure also has a substantially contaminant free atmosphere, and a sealed door at one end. An airtight seal is formed between the transfer container and the process enclosure, and also between the surfaces of the two doors. This is to avoid introducing surface contaminants into the process enclosure and transfer container atmospheres. Next, the two doors are opened simultaneously. This is to allow the transfer of at least one panel and its fixture from the transfer container into the process enclosure. Inside the process enclosure the panel is transferred to a process station for a manufacturing process. Finally, the panel and its fixture are transferred from the process enclosure into the transfer container. This may be the same container or a different container. The doors of the process enclosure and the transfer container are then closed and sealed. Also disclosed is a manufacturing system having isolated islands of "clean room" environment connected by inter-process transfer containers for transfering in-process workpieces. The system has airlock transfer ports between the process enclosures and the inter-process transfer containers. The make and break airlock transfer ports have facing sealable doors in the process enclosure and the transfer container. These doors are in air sealable facing recesses of the process enclosure and the transfer container. At least one peripheral gasket surrounds the recesses and the pair of doors. This provides a substantially clean room environment in the airlock. The sealable door in the interprocess transfer container is fabricated of a ferromagnetic material and is seated on a ferromagnetic gasket, while the sealable door in the process enclosure has a controllable electromagnetic clamp.
摘要:
Disclosed are multi-layer substrates for flexible circuit boards and flexible circuit board assemblies and their methods of manufacture. More particularly multi-layer flexible circuit board substrates are described for attaching components including chips and heat spreaders to form a three-dimensional circuit board assembly.
摘要:
Disclosed are multi-layer substrates for flexible circuit boards and flexible circuit board assemblies and their methods of manufacture. More particularly multi-layer flexible circuit board substrates are described for attaching components including chips and heat spreaders to form a three-dimensional circuit board assembly.
摘要:
Disclosed is a method of manufacturing a printed circuit panel. The method is carried out without a cleanroom, but in a clean room environment. The first step is to place a thin, non-rigid panel in a suitable fixture system, for example, for transfer and also for processing. The system includes a peripheral frame fixture for surrounding and supporting the in-process circuit panel layer, and a a loading chuck for mounting the in-process circuit panel layer in the peripheral frame fixture. The peripheral frame fixture includes a bottom plate (175) having a central opening to expose the circuit panel layer, a top frame (179) having a corresponding central opening to expose the opposite surface of the circuit panel layer, and compressive means, as screws, bolts, or the like, for applying a z-axis compressive force to the bottom plate, the top frame, and a panel layer therebetween. The loading chuck includes a peripheral edge for receiving the bottom plate of the peripheral frame fixture. A vacuum table is within the area bounded by the peripheral edge of the loading chuck and the peripheral frame of the peripheral frame fixture, and is coplanar with them. The vacuum table includes slidable bearing surfaces (131), with vacuum apertures (133) for drawing a vacuum to hold the panel in place, and slide actuators for moving the slidable bearing surfaces to apply x-y-axis tension to a panel on the bearing surfaces. The fixtured panel is then placed in an air tight transfer container, which has a substantially contaminant free atmosphere. The walls of the transfer container are fabricated out of substantially particulate free, unfilled polymers, such as polycarbonate. One of the end walls is an access wall. The access wall has an opening surrounded by a ferromagnetic gasket. This gasketed opening is adapted to receive a ferromagnetic door panel. The transfer container has a sealed door at one end. The transfer container is then brought into a sealable, substantially airtight interlock with a process enclosure. This process enclosure also has a substantially contaminant free atmosphere, and a sealed door at one end. An airtight seal is formed between the transfer container and the process enclosure, and also between the surfaces of the two doors. This is to avoid introducing surface contaminants into the process enclosure and transfer container atmospheres. Next, the two doors are opened simultaneously. This is to allow the transfer of at least one panel and its fixture from the transfer container into the process enclosure. Inside the process enclosure the panel is transferred to a process station for a manufacturing process. Finally, the panel and its fixture are transferred from the process enclosure into the transfer container. This may be the same container or a different container. The doors of the process enclosure and the transfer container are then closed and sealed. Also disclosed is a manufacturing system having isolated islands of "clean room" environment connected by inter-process transfer containers for transfering in-process workpieces. The system has airlock transfer ports between the process enclosures and the inter-process transfer containers. The make and break airlock transfer ports have facing sealable doors in the process enclosure and the transfer container. These doors are in air sealable facing recesses of the process enclosure and the transfer container. At least one peripheral gasket surrounds the recesses and the pair of doors. This provides a substantially clean room environment in the airlock. The sealable door in the interprocess transfer container is fabricated of a ferromagnetic material and is seated on a ferromagnetic gasket, while the sealable door in the process enclosure has a controllable electromagnetic clamp.
摘要:
Method and apparatus utilizing the known technique of extrusion to form a plurality of very small pins, with diameters of 0,5 mm or smaller, in a substrate (14) of electrically nonconductive material. The number of pins is 360 or more, and the electrically conductive material described in the extrusion process is copper. A pin die (12) is formed with the same number and pattern of holes as are in a blank substrate, and it is positioned over an extrusion die (13) with matching orifices (19, 20) that is fixed on an extrusion press (46). A head die (11) presses the blank substrate firmly on the pin die during the extrusion operation, and when completed, the pins are sheared and the substrate is ejected as a new blank is positioned to repeat the cycle.
摘要:
A substrate is provided with vias communicating with surface contacts or bumps. Joining material paste is forced through holes in a screen onto an area array of the contacts on the substrate then the screen is biased against the substrate as the paste is heated and cooled to transfer the joining material onto the contacts. Alternately, joining material paste is forced into the screen and then a substrate is placed onto the screen with an area array of bump contacts of the substrate in contact with the solder paste, and then the paste is heated and cooled to transfer the material onto the bumps. The joining material may be a solder paste, conductive adhesive paste, or transient liquid bond paste. The substrate may be a semiconductor chip substrate, flexible or rigid organic substrate, or a metal substrate coated to form a dielectric surface. Also, the substrate may be a computer chip, chip carrier substrate or a circuit board substrate. The process may be used to produce flip chips, ball grid array modules, column grid array modules, circuit boards, and attachment structures of the preceding components including information handling systems.
摘要:
A method of testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O, power, and ground contacts. In the method of the invention a chip test fixture system is provided. The chip test fixture system has contacts corresponding to the contacts on the semiconductor chip. The carrier contacts have dendritic surfaces. The chip contacts are brought into electrically conductive contact with the conductor pads on the chip test fixture system. Test signal input vectors are applied to the inputs of the semiconductor chip, and output signal vectors are recovered from the semiconductor chip. After testing the chip is removed from the substrate.
摘要:
Method and apparatus utilizing the known technique of extrusion to form a plurality of very small pins, with diameters of 0,5 mm or smaller, in a substrate (14) of electrically nonconductive material. The number of pins is 360 or more, and the electrically conductive material described in the extrusion process is copper. A pin die (12) is formed with the same number and pattern of holes as are in a blank substrate, and it is positioned over an extrusion die (13) with matching orifices (19, 20) that is fixed on an extrusion press (46). A head die (11) presses the blank substrate firmly on the pin die during the extrusion operation, and when completed, the pins are sheared and the substrate is ejected as a new blank is positioned to repeat the cycle.