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    CIRCUIT BOARD AND MOTHER LAMINATED BODY
    1.
    发明授权
    CIRCUIT BOARD AND MOTHER LAMINATED BODY 有权

    公开(公告)号：EP2410827B1

    公开(公告)日：2018-09-19

    申请号：EP10753334.1

    申请日：2010-02-03

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： KATO Noboru

    IPC: H05K3/46 ,  H01L23/12 ,  H05K1/02

    CPC classification number: H05K1/118 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/141 ,  H05K3/4632 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2924/00

    Abstract: A circuit board to be mounted on a printed circuit board and a mother laminated body are provided, the circuit board being capable of suppressing detachment thereof from the printed circuit board even if the printed circuit board is deformed. A laminated body (11) is configured by induing insulation layers (16) composed of a flexible material that are stacked on one another. External electrodes are provided on a bottom surface of the laminated body (11). Ground conductors (18a, 18b) are provided in the laminated body (11) and harder than the insulation layers (16). The laminated body (11) includes a flexible region (E2) and a rigid region (E1) that is adjacent to the flexible region (E2) when viewed in a plan from a z-axis direction, The rigid region (E1) is defined by the ground conductors (18a, 18b) when viewed in a plan from the z-axis direction, The external electrodes are provided within the flexible region (E2) when viewed in a plan from the z-axis direction.

    CARTE DE CIRCUIT IMPRIMÉ FLEXIBLE, ET MODULE LUMINEUX POUR VÉHICULE AUTOMOBILE COMPORTANT UNE TELLE CARTE DE CIRCUIT IMPRIMÉ
    3.
    发明公开
    CARTE DE CIRCUIT IMPRIMÉ FLEXIBLE, ET MODULE LUMINEUX POUR VÉHICULE AUTOMOBILE COMPORTANT UNE TELLE CARTE DE CIRCUIT IMPRIMÉ 有权
    印花柔性电路卡和发光模块机动车，这样的柔性印刷电路卡包括

    公开(公告)号：EP3160215A1

    公开(公告)日：2017-04-26

    申请号：EP16193702.4

    申请日：2016-10-13

    Applicant: VALEO VISION

    Inventor： BADIA, Olivier

    IPC: H05K1/02 ,  B60Q1/00

    CPC classification number: H05K1/0281 ,  B60Q1/0088 ,  B60Q1/04 ,  B60Q1/076 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/046 ,  H05K2201/09009 ,  H05K2201/10121 ,  H05K2201/2009

    Abstract: Carte de circuit imprimé flexible, configurée pour recevoir des composants électroniques, comportant un élément flexible (10), électriquement isolant, configuré pour porter des pistes conductrices de connexion des composants, l'élément flexible étant en outre configuré pour être courbé selon une courbure (11), la carte comportant en outre un élément de renforcement (22), électriquement isolant, solidaire mécaniquement de l'élément flexible (10), s'étendant d'un côté de la courbure, et comportant deux parties :
    - une première partie (220) étant sensiblement plane,
    - une deuxième partie (221) présentant une courbure prédéfinie, disposée du côté de la courbure (11) de l'élément flexible (10),
    l'élément de renforcement (22) étant disposé de sorte à laisser une partie libre (11) pour l'élément flexible (10) pour être courbée selon ladite courbure.

    Abstract translation: 增强元件被布置以便留下一个自由部分柔性元件被弯曲gemäß到曲率。

    Low profile flexible cable lighting assemblies and methods of making same
    9.
    发明公开
    Low profile flexible cable lighting assemblies and methods of making same 有权
    薄型柔性电缆照明组件及其制造方法

    公开(公告)号：EP2700867A8

    公开(公告)日：2014-05-28

    申请号：EP13187742.5

    申请日：2008-12-19

    Applicant: 3M Innovative Properties Company

    Inventor： Hayes, Earl J. ,  Puetter, Jens J.

    IPC: F21S4/00 ,  F21V31/04 ,  F21Y101/02

    CPC classification number: H05K1/189 ,  B29C33/38 ,  B29C45/14418 ,  B29C45/14655 ,  B29C45/14836 ,  F21S4/10 ,  F21V31/04 ,  F21Y2115/10 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y10S362/80 ,  Y10T29/49169

    Abstract: The present invention relates to a method of making a cable lighting assembly, said method comprising providing a flexible electrical cable (47) comprising an electrical conductor (45) insulated by electrical insulation; providing a light emitting diode (43) comprising a light emitting die mounted on a heat slug (53) and electrically connected to an anode lead (55) and a cathode lead (57); said method further comprising removing a portion of the electrical insulation to expose at least one surface mounting area on the surface of the electrical conductor (45) of the flexible electrical cable (47), soldering the heat slug (53) of the light emitting diode (3) to the mounting area of the conductor (45) on which either the anode lead (55) or the cathode lead (57) is soldered.

    Abstract translation: 制造电缆照明组件的方法技术领域本发明涉及一种制造电缆照明组件的方法，所述方法包括提供包括通过电绝缘绝缘的电导体（45）的柔性电缆（47） 提供发光二极管（43），所述发光二极管（43）包括安装在散热块（53）上并且电连接到阳极引线（55）和阴极引线（57）的发光裸片; 所述方法还包括去除电绝缘的一部分以暴露柔性电缆（47）的电导体（45）的表面上的至少一个表面安装区域，焊接发光二极管的散热块（53） （3）连接到其上焊接有阳极引线（55）或阴极引线（57）的导体（45）的安装区域。

    Electric circuit apparatus and manufacturing method therefor
    10.
    发明公开
    Electric circuit apparatus and manufacturing method therefor 审中-公开
    Elektrische Schaltvorrichtung und Herstellungsverfahrendafür

    公开(公告)号：EP2688373A2

    公开(公告)日：2014-01-22

    申请号：EP13168141.3

    申请日：2013-05-16

    Applicant: FUJITSU LIMITED

    Inventor： Kurashina, Mamoru ,  Mizutani, Daisuke ,  Fukumori, Taiga

    IPC: H05K1/02 ,  H05K3/34

    CPC classification number: H05K1/144 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/147 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/4697 ,  H05K2201/0154 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126

    Abstract: An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board that is disposed on a back side of the first-circuit-board, the second-circuit-board including on the front side of the second-circuit-board a second-electrode associated with the first-through-hole; a semiconductor device that is disposed on the front side of the first-circuit-board, the semiconductor device including on a back side a third-electrode-associated with the first-electrode, and a fourth-electrode-associated with the second-electrode; a first-bonding-material that bonds the first-electrode and the-third-electrode; a second-bonding-material that bonds the second-electrode and the fourth-electrode while passing through the first-through-hole; and a support body that is disposed between the first-electrode and the second-circuit-board and that supports the first-circuit-board.

    Abstract translation: 电路装置包括：第一电路基板，包括第一通孔，第一电极设置在第一电路板的前侧; 布置在所述第一电路板的背面上的第二电路板，所述第二电路板在所述第二电路板的前侧包括与所述第一电路板相关联的第二电极， 孔; 设置在所述第一电路板的前侧的半导体器件，所述半导体器件在背面包括与所述第一电极相关联的第三电极，以及与所述第二电极相关联的第四电极 ; 键合第一电极和第三电极的第一键合材料; 第二接合材料，其在穿过所述第一通孔时接合所述第二电极和所述第四电极; 以及支撑体，其设置在所述第一电极和所述第二电路板之间并且支撑所述第一电路板。

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