摘要:
A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.
摘要:
Electrically conductive compositions are provided. The compositions contain a nonconducting polymeric component and an electrically conducting polymeric component. The electrically conducting component is conducting because it is protonated. These compositions are new since the protonated conductive polymer is insoluble and, therefore, without using the methods of this docket the protonated electrically conductive polymer cannot be substantially uniformly dispersed in the dielectric polymer to form an electrically conductive body. In one embodiment the nonprotonated polymer is mixed in a solvent containing the dielectric polymer and a protonating agent. The solution is exposed to energy such as heat which causes the protonating agent to release a proton which interacts with the nonprotonated polymer to make it conducting. Simultaneously, the heating volatilizes the solvent quickly enough to prevent the protonated polymer from falling out of solution to form an electrically conductive body. In another embodiment the protonating agent is the dielectric polymer which is a carboxylic acid which provides the proton to protonate the polymer to the conducting state. In an application of these compositions paint is electrostatically or electrochemically deposited onto the composition.
摘要:
A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance. The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material. In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity (2) that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction.
摘要:
The present invention provides a wiring module containing a plurality of laminated polymer layers containing defined electronic circuitry which can be thermoformed into desired three dimensional shapes without damaging the internal wiring at the region of thermoform stress. More particularly, the invention provides a thermoformed, three dimensional wiring module prepared by thermoforming a laminate comprising a plurality of laminated, thermoformable polymer insulating layers containing conductive wiring circuitry on at least one surface of the layers, the layers being assembled to form conductive interconnect paths within the module, the module further characterized in that the conductive wiring circuitry is present only on internal low stress layers of the laminate at the region of thermoformed bends present in the module.
摘要:
A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.
摘要:
Structures containing a dielectric material (2) having a polymeric reactive ion etch (RIE) barrier (14) embedded therein. The preferred dielectric materials are polymers, preferably polyimide materials. The RIE etch barrier (14) is a copolymer having an aromatic component having high thermal stability and having a cross-linking component selected from metallocyclobutane, metallobutene and vinyl groups. The etch barrier (14) is deposited as a solvent free liquid which can fill gaps (30) between the dielectric material and electrical conductors embedded therein. The liquid polymer is cured to a solid insoluble state. The structures with electrical conductors embedded therein are useful for electronic applications.
摘要:
Electrically conductive compositions are provided. The compositions contain a nonconducting polymeric component and an electrically conducting polymeric component. The electrically conducting component is conducting because it is protonated. These compositions are new since the protonated conductive polymer is insoluble and, therefore, without using the methods of this docket the protonated electrically conductive polymer cannot be substantially uniformly dispersed in the dielectric polymer to form an electrically conductive body. In one embodiment the nonprotonated polymer is mixed in a solvent containing the dielectric polymer and a protonating agent. The solution is exposed to energy such as heat which causes the protonating agent to release a proton which interacts with the nonprotonated polymer to make it conducting. Simultaneously, the heating volatilizes the solvent quickly enough to prevent the protonated polymer from falling out of solution to form an electrically conductive body. In another embodiment the protonating agent is the dielectric polymer which is a carboxylic acid which provides the proton to protonate the polymer to the conducting state. In an application of these compositions paint is electrostatically or electrochemically deposited onto the composition.