Electrically conductive polymeric materials and use thereof
    4.
    发明公开
    Electrically conductive polymeric materials and use thereof 失效
    Elektrischleitfähige聚合物Materialien und ihre Verwendung。

    公开(公告)号:EP0528178A2

    公开(公告)日:1993-02-24

    申请号:EP92112140.6

    申请日:1992-07-16

    摘要: Electrically conductive compositions are provided. The compositions contain a nonconducting polymeric component and an electrically conducting polymeric component. The electrically conducting component is conducting because it is protonated. These compositions are new since the protonated conductive polymer is insoluble and, therefore, without using the methods of this docket the protonated electrically conductive polymer cannot be substantially uniformly dispersed in the dielectric polymer to form an electrically conductive body. In one embodiment the nonprotonated polymer is mixed in a solvent containing the dielectric polymer and a protonating agent. The solution is exposed to energy such as heat which causes the protonating agent to release a proton which interacts with the nonprotonated polymer to make it conducting. Simultaneously, the heating volatilizes the solvent quickly enough to prevent the protonated polymer from falling out of solution to form an electrically conductive body. In another embodiment the protonating agent is the dielectric polymer which is a carboxylic acid which provides the proton to protonate the polymer to the conducting state. In an application of these compositions paint is electrostatically or electrochemically deposited onto the composition.

    摘要翻译: 提供导电组合物。 组合物含有不导电聚合物组分和导电聚合物组分。 导电组分是导电的,因为它是质子化的。 这些组合物是新的,因为质子化的导电聚合物是不溶的,因此,在不使用该方案的情况下,质子化的导电聚合物不能基本均匀地分散在电介质聚合物中以形成导电体。 在一个实施方案中,将非质子化聚合物在包含电介质聚合物和质子化剂的溶剂中混合。 溶液暴露于诸如热的能量,其导致质子化剂释放与非质子化聚合物相互作用以使其导通的质子。 同时,加热使溶剂快速挥发,以防止质子化聚合物从溶液中脱落而形成导电体。 在另一个实施方案中,质子化剂是介电聚合物,其是提供质子以将聚合物质子化至导电状态的羧酸。 在这些组合物的应用中,涂料被静电或电化学沉积在组合物上。

    Method for manufacturing a polyimide
    5.
    发明公开
    Method for manufacturing a polyimide 失效
    Verfahren zur Herstellung eines Polyimids。

    公开(公告)号:EP0465858A1

    公开(公告)日:1992-01-15

    申请号:EP91109594.1

    申请日:1991-06-11

    IPC分类号: B01J19/12 C08G73/10 H05B6/80

    摘要: A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance. The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material. In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity (2) that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction.

    摘要翻译: 公开了一种用于通过将含有挥发性物质的材料暴露于微波辐射进行物理过程和化学反应的方法和装置,其中当暴露于这种辐射时所述材料的形态将改变。 随着材料的形态发生变化,随着时间的推移调整所述辐射的功率以最大化辐射的影响,以便在基本上不含所述挥发性物质的最小时间内产生产物。 该方法和装置也可用于对不含挥发性物质的材料进行这种处理或反应。 在一个实施方案中,公开了一种用于通过在可调谐的微波谐振腔(2)中将前体暴露于微波辐射中的方法从溶剂中的前体制备聚酰亚胺的方法和装置,所述微调谐振腔在二次化期间被调谐以实现系统的临界耦合。 控制微波功率以除去溶剂并获得所需的反应水平。

    Thermoformed three dimensional wiring module
    6.
    发明公开
    Thermoformed three dimensional wiring module 失效
    热成型仪

    公开(公告)号:EP0730394A1

    公开(公告)日:1996-09-04

    申请号:EP96102032.8

    申请日:1996-02-13

    IPC分类号: H05K1/00

    摘要: The present invention provides a wiring module containing a plurality of laminated polymer layers containing defined electronic circuitry which can be thermoformed into desired three dimensional shapes without damaging the internal wiring at the region of thermoform stress. More particularly, the invention provides a thermoformed, three dimensional wiring module prepared by thermoforming a laminate comprising a plurality of laminated, thermoformable polymer insulating layers containing conductive wiring circuitry on at least one surface of the layers, the layers being assembled to form conductive interconnect paths within the module, the module further characterized in that the conductive wiring circuitry is present only on internal low stress layers of the laminate at the region of thermoformed bends present in the module.

    摘要翻译: 本发明提供了一种布线模块,其包含多个层压的聚合物层,其包含限定的电子电路,其能够热成型为期望的三维形状,而不会在热成形应力区域内损坏内部布线。 更具体地说,本发明提供一种热成型的三维布线模块,其通过在层的至少一个表面上热成型包含多个层压的,可热成形的聚合物绝缘层,包含导电布线电路而制成,所述层被组装以形成导电互连路径 在模块内,模块的特征还在于导电布线电路仅存在于模块中存在的热成型弯曲区域的层压板的内部低应力层上。