摘要:
An integrally molded, combined fuel cell electrode and matrix is provided having a matrix layer (2) containing 3 to 20 weight percent polytetrafluoroethylene (PTFE) and 80 to 97 weight percent inorganic powder, the matrix being integral with an electrode layer (1) of PTFE containing a catalyst. The electrode layer preferably is 40 to 90 weight percent of electrically conductive fine powder, on which the catalyst has been supported, and 10 to 60 weight percent PTFE. In the method for manufacture of the fuel cell electrode and matrix, the layers are laminated by rolling and reduced simultaneously to their final thicknesses.
摘要:
A process is provided for manufacturing a composite of a sheet of expanded, porous polytetrafluoroethylene (PTFE) impregnated with another resin, the other resin being impregnated within the pores of the expanded PTFE. The other resin imparts desired characteristics to the composite such as high thermal resistance and low dielectric constant which make it useful as substrates for printed circuit boards. The composite is useful as a dielectric generally and as an adhesive.
摘要:
An integrally molded, combined fuel cell electrode and matrix is provided having a matrix layer (2) containing 3 to 20 weight percent polytetrafluoroethylene (PTFE) and 80 to 97 weight percent inorganic powder, the matrix being integral with an electrode layer (1) of PTFE containing a catalyst. The electrode layer preferably is 40 to 90 weight percent of electrically conductive fine powder, on which the catalyst has been supported, and 10 to 60 weight percent PTFE. In the method for manufacture of the fuel cell electrode and matrix, the layers are laminated by rolling and reduced simultaneously to their final thicknesses.
摘要:
A process is provided for manufacturing a composite of a sheet of expanded, porous polytetrafluoroethylene (PTFE) impregnated with another resin, the other resin being impregnated within the pores of the expanded PTFE. The other resin imparts desired characteristics to the composite such as high thermal resistance and low dielectric constant which make it useful as substrates for printed circuit boards. The composite is useful as a dielectric generally and as an adhesive.