Abstract:
An immersion upper layer film composition is provided which exhibits sufficient transparency for the exposure wavelength 248 nm(KrF) and 193 nm(ArF), can form a protective film on the photoresist film without being intermixed with the photoresist film, is not eluted into water used during immersion exposure to maintain a stable film, and can be easily dissolved in an alkaline developer. The composition applied to coat on the photoresist film when using an immersion exposure device which is irradiated through water provided between a lens and the photoresist film, the composition comprises a resin forming a water-stable film during irradiation and being dissolved in a subsequent developer, and a solvent containing a monovalent alcohol having 6 or less carbon atoms, and the resin contains a resin component having an alcoholic hydroxyl group on the side chain containing a fluoroalkyl group on at least the carbon atom of ±-position.
Abstract:
Disclosed is an upper film-forming composition which enables to form a coating film on a photoresist without causing intermixing with the photoresist film and to maintain a stable coating film without dissolving into a medium used during immersion exposure. The upper film-forming composition is also capable to form an upper layer which enables to obtain a pattern shape that is not inferior to the one obtained by a process other than immersion exposure, namely a dry exposure and can be easily dissolved in an alkaline developer. Also disclosed is a copolymer containing a repeating unit having a group represented by the general formula (1) below, a repeating unit having a group represented by the general formula (2) below, at least one repeating unit (I) selected from repeating units having a carboxyl group, and a repeating unit (II) having a sulfo group, and having a weight average molecular weight of 2,000-100,000 determined by gel permeation chromatography. (1) (2) At least one of R
Abstract:
A radiation-sensitive resin composition that not only excels in fundamental properties as resist, such as sensitivity and resolution, but also with respect to both of line-and-space pattern and isolated space pattern, realizes extensive depth of focus (DOF) and is less in the line width change attributed to alteration of baking temperature, the limit line width free from any phenomenon of line pattern collapse of the radiation-sensitive resin composition being small. Further, there is provided a lactone copolymer being useful as a resin component of the radiation-sensitive resin composition. This lactone copolymer is represented by a copolymer of compound of the following formula (1-1), compound of the following formula (2-1) and compound of the following formula (3-1). This radiation-sensitive resin composition comprises the lactone copolymer (a) and radiation-sensitive acid generating agent (b).