公开(公告)号：EP1806618A1

公开(公告)日：2007-07-11

申请号：EP05799121.8

申请日：2005-10-28

申请人： JSR Corporation

发明人： ITO, Atsushi, c/o JSR CORPORATION ,  YOKOYAMA, Ken-ichi, c/o JSR CORPORATION ,  INOMATA, Katsumi, c/o JSR CORPORATION ,  IWANAGA, Shin-ichiro, c/o JSR CORPORATION

IPC分类号： G03F7/023 ,  C08F212/08 ,  C08F212/14 ,  C08G8/38 ,  G03F7/004 ,  H01L21/027

CPC分类号： C08F212/14 ,  C08F8/12 ,  C08F212/12 ,  C08F2220/281 ,  C08G8/38 ,  C08J5/18 ,  C08K5/28 ,  C08L25/18 ,  C08L61/06 ,  C09D125/18 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0751 ,  G03F7/40 ,  C08F112/14 ,  C08L2666/14 ,  C08F212/08

摘要： Disclosed is a positive photosensitive insulating resin composition which comprises: (A) a copolymer comprising (A1) 10 to 99 mol% of a structural unit of the formula (1) and (A2) 90 to 1 mol% of a structural unit of the formula (2); (B) a quinone diazide group-containing compound; (C) at least one compound selected from the group consisting of (C1) an aromatic compound containing a methylol group and/or an alkoxy methyl group (except for aromatic compounds containing an amino group), (C2) an aromatic aldehyde compound, (C3) an aliphatic aldehyde compound, (C4) an alkyl-etherified amino group-containing compound and (C5) an epoxy group-containing compound; (D) a solvent; and (E) an adhesion assistant. Disclosed also is a cured product obtainable from the composition.

wherein Ra and Rb are each an alkyl group having 1 to 4 carbon atoms, alkoxy group or aryl group, Rb and Rc are each hydrogen or a methyl group, n is an integer of 0 to 3 and m is an integer of 1 to 3.
The cured product has excellent resolution, electrical insulating properties, thermal shock resistance, adhesion and other properties.

摘要翻译： 公开了一种正型感光性绝缘性树脂组合物，其包含：（A）包含（A1）10〜99摩尔％的式（1）和（A2）的结构单元的共聚物，90〜1摩尔％的结构单元 公式（2）; （B）含醌二叠氮基的化合物; （C）至少一种选自（C1）含有羟甲基和/或烷氧基甲基的芳族化合物（除了含有氨基的芳香族化合物以外）的化合物，（C2）芳族醛化合物，（ C3）脂族醛化合物，（C4）含烷基醚化氨基化合物和（C5）含环氧基化合物; （D）溶剂; 和（E）粘附助剂。 还公开了可从该组合物获得的固化产物。 其中Ra和Rb各自为具有1至4个碳原子的烷基，烷氧基或芳基，Rb和Rc各自为氢或甲基，n为0-3的整数，m为1至3的整数 固化产品具有优异的分辨率，电绝缘性能，耐热冲击性，附着力等特性。

公开(公告)号：EP1806618B1

公开(公告)日：2010-06-09

申请号：EP05799121.8

申请日：2005-10-28

申请人： JSR Corporation

发明人： ITO, Atsushi, c/o JSR CORPORATION ,  YOKOYAMA, Ken-ichi, c/o JSR CORPORATION ,  INOMATA, Katsumi, c/o JSR CORPORATION ,  IWANAGA, Shin-ichiro, c/o JSR CORPORATION

IPC分类号： G03F7/023 ,  C08F212/08 ,  C08F212/14 ,  C08G8/38 ,  G03F7/075 ,  G03F7/40 ,  G03F7/022

CPC分类号： C08F212/14 ,  C08F8/12 ,  C08F212/12 ,  C08F2220/281 ,  C08G8/38 ,  C08J5/18 ,  C08K5/28 ,  C08L25/18 ,  C08L61/06 ,  C09D125/18 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0751 ,  G03F7/40 ,  C08F112/14 ,  C08L2666/14 ,  C08F212/08

摘要： Disclosed is a positive photosensitive insulating resin composition characterized by containing a copolymer (A) composed of 10-99 mol% of a structural unit (A1) represented by the general formula (1) below and 90-1 mol% of a structural unit (A2) represented by the general formula (2) below; a compound (B) having a quinonediazide group; at least one compound (C) selected from the group consisting of aromatic compounds (C1) containing a methylol group and/or an alkoxymethyl group (excluding aromatic compounds containing an amino group), aromatic aldehyde compounds (C2), aliphatic aldehyde compounds (C3), alkyl etherified amino group-containing compounds (C4) and epoxy group-containing compounds (C5); a solvent (D); and an adhesion improver (E). Also disclosed is a cured product of such a positive photosensitive insulating resin composition. (In the formulae, Ra and Rc respectively represent an alkyl group having 1-4 carbon atoms, an alkoxy group or an aryl group; Rb and Rd respectively represent a hydrogen atom or a methyl group; n represents an integer of 0-3; and m represents an integer of 1-3.) The cured product is excellent in various characteristics such as resolution, electrical insulation, thermal shock resistance and adhesiveness.

公开(公告)号：EP1471540A1

公开(公告)日：2004-10-27

申请号：EP02790898.7

申请日：2002-12-26

申请人： JSR Corporation

发明人： ITO, Nobuyuki, c/o JSR CORPORATION ,  MASUKO, Hideaki, c/o JSR CORPORATION ,  HASEGAWA, Satomi, c/o JSR CORPORATION ,  ITO, Atsushi, c/o JSR CORPORATION ,  INOMATA, Katsumi, c/o JSR CORPORATION

IPC分类号： H01B3/00 ,  G03F7/004 ,  G03F7/022

CPC分类号： G03F7/0226 ,  G03F7/0047 ,  G03F7/022 ,  G03F7/027 ,  G03F7/033

摘要： A photosensitive composition for forming a dielectric of the present invention comprising inorganic particles, an alkali developable resin and additives, wherein the additives comprise a compound having a quinonediazido group (C1), a compound containing at least two alkyletherified amino groups in the molecule (C2) and a thermal acid generator (C3), or wherein the inorganic particles comprise inorganic superfine particles (A-I) having a mean particle diameter of less than 0.05µm and inorganic fine particles (A-II) having a mean particle diameter of not less than 0.05µm.
The composition can be calcined at low temperatures to form a dielectric layer with high dimensional precision, said layer having a high dielectric constant and a low dielectric loss. Also provided are a dielectric and an electronic part prepared from the composition.