公开(公告)号：EP1806618A1

公开(公告)日：2007-07-11

申请号：EP05799121.8

申请日：2005-10-28

申请人： JSR Corporation

发明人： ITO, Atsushi, c/o JSR CORPORATION ,  YOKOYAMA, Ken-ichi, c/o JSR CORPORATION ,  INOMATA, Katsumi, c/o JSR CORPORATION ,  IWANAGA, Shin-ichiro, c/o JSR CORPORATION

IPC分类号： G03F7/023 ,  C08F212/08 ,  C08F212/14 ,  C08G8/38 ,  G03F7/004 ,  H01L21/027

CPC分类号： C08F212/14 ,  C08F8/12 ,  C08F212/12 ,  C08F2220/281 ,  C08G8/38 ,  C08J5/18 ,  C08K5/28 ,  C08L25/18 ,  C08L61/06 ,  C09D125/18 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0751 ,  G03F7/40 ,  C08F112/14 ,  C08L2666/14 ,  C08F212/08

摘要： Disclosed is a positive photosensitive insulating resin composition which comprises: (A) a copolymer comprising (A1) 10 to 99 mol% of a structural unit of the formula (1) and (A2) 90 to 1 mol% of a structural unit of the formula (2); (B) a quinone diazide group-containing compound; (C) at least one compound selected from the group consisting of (C1) an aromatic compound containing a methylol group and/or an alkoxy methyl group (except for aromatic compounds containing an amino group), (C2) an aromatic aldehyde compound, (C3) an aliphatic aldehyde compound, (C4) an alkyl-etherified amino group-containing compound and (C5) an epoxy group-containing compound; (D) a solvent; and (E) an adhesion assistant. Disclosed also is a cured product obtainable from the composition.

wherein Ra and Rb are each an alkyl group having 1 to 4 carbon atoms, alkoxy group or aryl group, Rb and Rc are each hydrogen or a methyl group, n is an integer of 0 to 3 and m is an integer of 1 to 3.
The cured product has excellent resolution, electrical insulating properties, thermal shock resistance, adhesion and other properties.

摘要翻译： 公开了一种正型感光性绝缘性树脂组合物，其包含：（A）包含（A1）10〜99摩尔％的式（1）和（A2）的结构单元的共聚物，90〜1摩尔％的结构单元 公式（2）; （B）含醌二叠氮基的化合物; （C）至少一种选自（C1）含有羟甲基和/或烷氧基甲基的芳族化合物（除了含有氨基的芳香族化合物以外）的化合物，（C2）芳族醛化合物，（ C3）脂族醛化合物，（C4）含烷基醚化氨基化合物和（C5）含环氧基化合物; （D）溶剂; 和（E）粘附助剂。 还公开了可从该组合物获得的固化产物。 其中Ra和Rb各自为具有1至4个碳原子的烷基，烷氧基或芳基，Rb和Rc各自为氢或甲基，n为0-3的整数，m为1至3的整数 固化产品具有优异的分辨率，电绝缘性能，耐热冲击性，附着力等特性。

公开(公告)号：EP1739487A1

公开(公告)日：2007-01-03

申请号：EP05710408.5

申请日：2005-02-18

申请人： JSR Corporation

发明人： SAKAI, Hiroko c/o JSR CORPORATION ,  OHTA, Masaru, c/o JSR CORPORATION ,  INOMATA, Katsumi, c/o JSR CORPORATION ,  IWANAGA, Shin-ichiro, c/o JSR CORPORATION

IPC分类号： G03F7/11 ,  H05K3/34

CPC分类号： H01L24/12 ,  G03F7/033 ,  G03F7/11 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/06102 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/14 ,  H05K3/3484 ,  H05K2203/0568 ,  H05K2203/0577 ,  Y10T428/31855 ,  H01L2924/00014

摘要： A negative radiation-sensitive two-layer laminated film for forming bumps includes a lower layer that includes a composition including a polymer (A) with a specific structural unit and an organic solvent (B). A process for forming bumps uses the laminated film.
The negative radiation-sensitive two-layer laminated film for forming bumps permits excellent printing of a solder paste, is patternable with good configuration, and is easily peeled from a substrate. The bump-forming process using the laminated film provides the same effects.

摘要翻译： 用于形成凸块的负辐射敏感性双层叠层膜包括下层，其包括具有特定结构单元的聚合物（A）和有机溶剂（B）的组合物。 用于形成凸块的方法使用层压膜。 用于形成凸块的负辐射敏感性双层层压膜允许焊膏的良好印刷，具有良好构造的图案化，并且容易从基板剥离。 使用层压膜的凸块形成工艺提供相同的效果。

公开(公告)号：EP1806618B1

公开(公告)日：2010-06-09

申请号：EP05799121.8

申请日：2005-10-28

申请人： JSR Corporation

发明人： ITO, Atsushi, c/o JSR CORPORATION ,  YOKOYAMA, Ken-ichi, c/o JSR CORPORATION ,  INOMATA, Katsumi, c/o JSR CORPORATION ,  IWANAGA, Shin-ichiro, c/o JSR CORPORATION

IPC分类号： G03F7/023 ,  C08F212/08 ,  C08F212/14 ,  C08G8/38 ,  G03F7/075 ,  G03F7/40 ,  G03F7/022

CPC分类号： C08F212/14 ,  C08F8/12 ,  C08F212/12 ,  C08F2220/281 ,  C08G8/38 ,  C08J5/18 ,  C08K5/28 ,  C08L25/18 ,  C08L61/06 ,  C09D125/18 ,  G03F7/0226 ,  G03F7/0233 ,  G03F7/0751 ,  G03F7/40 ,  C08F112/14 ,  C08L2666/14 ,  C08F212/08

摘要： Disclosed is a positive photosensitive insulating resin composition characterized by containing a copolymer (A) composed of 10-99 mol% of a structural unit (A1) represented by the general formula (1) below and 90-1 mol% of a structural unit (A2) represented by the general formula (2) below; a compound (B) having a quinonediazide group; at least one compound (C) selected from the group consisting of aromatic compounds (C1) containing a methylol group and/or an alkoxymethyl group (excluding aromatic compounds containing an amino group), aromatic aldehyde compounds (C2), aliphatic aldehyde compounds (C3), alkyl etherified amino group-containing compounds (C4) and epoxy group-containing compounds (C5); a solvent (D); and an adhesion improver (E). Also disclosed is a cured product of such a positive photosensitive insulating resin composition. (In the formulae, Ra and Rc respectively represent an alkyl group having 1-4 carbon atoms, an alkoxy group or an aryl group; Rb and Rd respectively represent a hydrogen atom or a methyl group; n represents an integer of 0-3; and m represents an integer of 1-3.) The cured product is excellent in various characteristics such as resolution, electrical insulation, thermal shock resistance and adhesiveness.

公开(公告)号：EP1471540A1

公开(公告)日：2004-10-27

申请号：EP02790898.7

申请日：2002-12-26

申请人： JSR Corporation

发明人： ITO, Nobuyuki, c/o JSR CORPORATION ,  MASUKO, Hideaki, c/o JSR CORPORATION ,  HASEGAWA, Satomi, c/o JSR CORPORATION ,  ITO, Atsushi, c/o JSR CORPORATION ,  INOMATA, Katsumi, c/o JSR CORPORATION

IPC分类号： H01B3/00 ,  G03F7/004 ,  G03F7/022

CPC分类号： G03F7/0226 ,  G03F7/0047 ,  G03F7/022 ,  G03F7/027 ,  G03F7/033

摘要： A photosensitive composition for forming a dielectric of the present invention comprising inorganic particles, an alkali developable resin and additives, wherein the additives comprise a compound having a quinonediazido group (C1), a compound containing at least two alkyletherified amino groups in the molecule (C2) and a thermal acid generator (C3), or wherein the inorganic particles comprise inorganic superfine particles (A-I) having a mean particle diameter of less than 0.05µm and inorganic fine particles (A-II) having a mean particle diameter of not less than 0.05µm.
The composition can be calcined at low temperatures to form a dielectric layer with high dimensional precision, said layer having a high dielectric constant and a low dielectric loss. Also provided are a dielectric and an electronic part prepared from the composition.

公开(公告)号：EP1469346B1

公开(公告)日：2015-08-05

申请号：EP03700565.9

申请日：2003-01-15

申请人： JSR Corporation

发明人： INOMATA, Katsumi, c/o JSR CORPORATION ,  NISHIOKA, Takashi, c/o JSR CORPORATION ,  ITOU, Atsushi, c/o JSR CORPORATION ,  SUZUKI, Masayoshi, c/o JSR CORPORATION ,  IWANAGA, Shin-ichirou, c/o JSR CORPORATION

IPC分类号： G03F7/022 ,  G03F7/004 ,  G03F7/023

CPC分类号： G03F7/0226 ,  G03F7/0047 ,  G03F7/0233 ,  G03F7/0236

公开(公告)号：EP1469346A1

公开(公告)日：2004-10-20

申请号：EP03700565.9

申请日：2003-01-15

申请人： JSR Corporation

发明人： INOMATA, Katsumi, c/o JSR CORPORATION ,  NISHIOKA, Takashi, c/o JSR CORPORATION ,  ITOU, Atsushi, c/o JSR CORPORATION ,  SUZUKI, Masayoshi, c/o JSR CORPORATION ,  IWANAGA, Shin-ichirou, c/o JSR CORPORATION

IPC分类号： G03F7/022 ,  G03F7/004 ,  H01L21/027

CPC分类号： G03F7/0226 ,  G03F7/0047 ,  G03F7/0233 ,  G03F7/0236

摘要： Positive photosensitive insulating resin compositions of the invention contain at least (A) an alkali soluble resin having a phenolic hydroxyl group, (B) a compound having a quinonediazido group, (C) crosslinked fine particles, (D) a compound containing at least two alkyletherified amino groups in the molecule, and (F) a solvent. The resin compositions have excellent resolution, electrical insulating properties and thermal shock properties. Cured products of the invention are obtained by curing these resin compositions, and they show good adhesive properties.

摘要翻译： 本发明的正性感光性绝缘性树脂组合物至少含有（A）具有酚性羟基的碱溶性树脂，（B）具有醌二叠氮基的化合物，（C）交联微粒，（D）含有至少两个 分子中的烷基醚化的氨基，和（F）溶剂。 树脂组合物具有优异的分辨率，电绝缘性能和热冲击性能。 通过固化这些树脂组合物获得本发明的固化产物，它们显示出良好的粘合性能。