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    DARK FIELD INSPECTION SYSTEM WITH RING ILLUMINATION
    1.
    发明公开
    DARK FIELD INSPECTION SYSTEM WITH RING ILLUMINATION 审中-公开

    公开(公告)号：EP2457251A4

    公开(公告)日：2017-11-08

    申请号：EP10802700

    申请日：2010-07-16

    Applicant: KLA-TENCOR CORP

    Inventor： ZHAO GUOHENG ,  VAEZ-IRAVANI MEHDI ,  YOUNG SCOTT ,  BHASKAR KRIS

    IPC: G01N21/95 ,  G01N21/88

    CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/8822

    Abstract: A dark field inspection system that minimizes the speckle noise due to sample surface roughness can include a plurality of beam shaping paths for generating a composite, focused illumination line on a wafer. Each beam shaping path can illuminate the wafer at an oblique angle. The plurality of beam shaping paths can form a ring illumination. This ring illumination can reduce the speckle effect, thereby improving SNR. An objective lens can capture scattered light from the wafer and an imaging sensor can receive an output of the objective lens. Because the wafer illumination occurs at oblique angles, the objective lens can have a high NA, thereby improving optical resolution of the imaging sensor, and the resulting signal level.

    IMPROVED SAMPLE INSPECTION SYSTEM
    3.
    发明公开
    IMPROVED SAMPLE INSPECTION SYSTEM 有权
    VERBESSERTESPRÜFSYSTEMFÜRPROBEN

    公开(公告)号：EP1023582A4

    公开(公告)日：2000-11-29

    申请号：EP98947155

    申请日：1998-09-18

    Applicant: KLA TENCOR CORP

    Inventor： VAEZ-IRAVANI MEHDI ,  STOKOWSKI STANLEY ,  ZHAO GUOHENG

    IPC: G01N21/956 ,  G01J3/44 ,  G01N21/00 ,  G01N21/21 ,  G01N21/47 ,  G01N21/88 ,  G01N21/94 ,  G01N21/95 ,  H01L21/66 ,  G01B7/34 ,  G01B11/24 ,  G01N21/86

    CPC classification number: G01J3/44 ,  G01J3/0216 ,  G01J3/0229 ,  G01N21/21 ,  G01N21/47 ,  G01N21/474 ,  G01N21/8806 ,  G01N21/94 ,  G01N21/9501 ,  G01N2021/8825 ,  G01N2021/8845 ,  G01N2021/8848 ,  G01N2201/065

    Abstract: A curved mirrored surface (78) is used to collect radiation scattered by a sample surface (76a) and originating from a normal illumination beam (70) and an oblique illumination beam (90). The collected radiation is focused to a detector (80). Scattered radiation originating from the normal and oblique illumination beams may be distinguished by employing radiation at two different wavelengths, by intentionally introducing an offset between the spots illuminated by the two beams or by switching the normal and oblique illumination beams (70, 90) on and off alternately. Beam position error caused by change in sample height may be corrected by detecting specular reflection of an oblique illumination beam and changing the direction of illumination in response thereto. Butterfly-shaped spatial filters may be used in conjunction with curved mirror radiation collectors (78) to restrict detection to certain azimuthal angles.

    Abstract translation: 使用弯曲镜像表面（78）来收集由样本表面（76a）散射并且源自正常照明光束（70）和斜向照明光束（90）的辐射。 所收集的辐射被聚焦到检测器（80）。 通过采用两个不同波长的辐射，通过有意地在由两个光束照射的光点之间引入偏移或者通过将正常照明光束和倾斜照明光束（70,90）切换到其上，并且通过使用两个不同波长的辐射来区分源自正常照明光束和倾斜照明光束的散射辐射 交替关闭。 可以通过检测倾斜照明光束的镜面反射并响应于此改变照明方向来校正由样本高度变化引起的光束位置误差。 蝴蝶形空间滤波器可以与曲面镜辐射收集器（78）结合使用，以将检测限制在某些方位角。

    WAFER INSPECTION
    4.
    发明公开
    WAFER INSPECTION 有权

    公开(公告)号：EP2652776A4

    公开(公告)日：2018-01-17

    申请号：EP11849418

    申请日：2011-12-07

    Applicant: KLA-TENCOR CORP

    Inventor： ZHAO GUOHENG ,  LEONG JENN-KUEN ,  VAEZ-IRAVANI MEHDI

    IPC: G01N21/95 ,  H01L21/66

    CPC classification number: G01N21/9501 ,  G01N21/21 ,  G01N21/47 ,  G01N21/8806 ,  G01N2201/06113 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.

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