公开(公告)号：EP3062590A4

公开(公告)日：2017-05-24

申请号：EP14855585

申请日：2014-10-23

Applicant: KYOCERA CORP

Inventor： MURAKAMI KENSAKU

IPC: H05K1/11 ,  H01L23/13

CPC classification number: H01L23/49811 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49838 ,  H01L24/05 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/181 ,  H05K3/403 ,  H05K3/4629 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/0969 ,  H01L2924/00012

Abstract: This wiring board (1) is provided with: an insulating base (11) that has a lateral surface having an incision part (12); an electrode (13) that is provided on the inner surface of the incision part (12); and a wiring conductor (15) that is provided within the insulating base (11) or on the surface of the insulating base (11) and is electrically connected to the electrode (13) via a connection conductor (14). The width of the incision part (12) is larger than the depth thereof, and the connection conductor (14) is connected to the electrode (13) at an end of the incision part (12) in the width direction. An electronic device according to the present invention is provided with this wiring board (1) and an electronic component (2) that is mounted to the upper surface of this wiring board (1).

Abstract translation: 该布线基板1具有：绝缘性基体11，其具有具有切口部12的侧面; 设置在所述切口部（12）的内表面上的电极（13）; 以及设置在绝缘基体（11）内或绝缘基体（11）的表面上并经由连接导体（14）与电极（13）电连接的布线导体（15）。 切口部12的宽度大于其深度，连接导体14在切口部12的宽度方向的一端与电极13连接。 本发明的电子设备具备该布线基板（1）和安装于该布线基板（1）的上表面的电子部件（2）。