公开(公告)号：EP2474209B1

公开(公告)日：2018-10-31

申请号：EP10755076.6

申请日：2010-09-01

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： THUMSER, Christoph ,  FREYDL, Gerhard

IPC: H05K1/14

CPC classification number: H05K3/305 ,  H05K1/0269 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T156/1089

公开(公告)号：EP3076768B1

公开(公告)日：2018-10-17

申请号：EP16160133.1

申请日：2016-03-14

Applicant: BIOTRONIK SE & Co. KG

Inventor： Sporon-Fiedler, Frederik ,  Brunner, Bjoern ,  Carraway, Jana ,  Kramer, Ken

IPC: A61N1/375 ,  H05K1/02

CPC classification number: H05K1/0306 ,  A61N1/375 ,  H05K1/02 ,  H05K1/111 ,  H05K1/117 ,  H05K3/0058 ,  H05K3/0067 ,  H05K2201/0108 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2203/30

Abstract: The invention relates to an electronic device, in particular for a medical implant and a printed circuit board arrangement comprising a printed circuit board (10), wherein at least one UV-transparent element (20) is at least fixedly coupled to the printed circuit board (10), wherein the UV-transparent element (20) is intended for fixation of the printed circuit board (10) in an electronic device (100).

公开(公告)号：EP3367511A1

公开(公告)日：2018-08-29

申请号：EP17382088.7

申请日：2017-02-23

Applicant: Valeo Iluminacion

Inventor： ROLDAN, Jose-David ,  MARTINEZ-ZALDIVAR, Tomas ,  MORENO, Juan-Francisco

IPC: H01R12/72 ,  H01R13/627 ,  H01R12/79

CPC classification number: H01R12/721 ,  F21K9/20 ,  H01R12/79 ,  H01R13/6271 ,  H01R13/6272 ,  H01R2201/26 ,  H05K3/403 ,  H05K2201/09145

Abstract: The invention provides an electrical connection module for an automotive vehicle. The module comprises a printed circuit board, PCB, and a connector for connecting a wire harness to said PCB. An edge of the PCB can be inserted into the connector. The module provides retention means that are integral to the PCB. The retention means are shaped and configured to retain said edge connector, if the PCB is seated therein.

公开(公告)号：EP3278636A1

公开(公告)日：2018-02-07

申请号：EP15888002.1

申请日：2015-03-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： WYATT, Stewart R ,  SAUNDERS, Don E ,  HAHN, Scott D ,  HUTCHINGS, Cameron

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/0274 ,  G06F3/0421 ,  G06F2203/04103 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/46 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/09145 ,  H05K2201/09781

Abstract: According to an example, a device may comprise a printed circuit board. The printed circuit board may further comprise a first layer and a second layer, The first layer may comprise a first material and the second layer may comprise a second material. In some examples, the first layer may further comprise at least one mounting hole surrounded by a third material at a thickness equal to a thickness of the first layer, and the first material may be electrically isolated from the third material, In some examples, the printed circuit board may be mated to a light guide assembly for a touchscreen system.

公开(公告)号：EP3076768A2

公开(公告)日：2016-10-05

申请号：EP16160133.1

申请日：2016-03-14

Applicant: BIOTRONIK SE & Co. KG

Inventor： Sporon-Fiedler, Frederik ,  Brunner, Bjoern ,  Carraway, Jana ,  Kramer, Ken

IPC: H05K1/02

CPC classification number: H05K1/0306 ,  A61N1/375 ,  H05K1/02 ,  H05K1/111 ,  H05K1/117 ,  H05K3/0058 ,  H05K3/0067 ,  H05K2201/0108 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2203/30

Abstract: The invention relates to an electronic device, in particular for a medical implant and a printed circuit board arrangement comprising a printed circuit board (10), wherein at least one UV-transparent element (20) is at least fixedly coupled to the printed circuit board (10), wherein the UV-transparent element (20) is intended for fixation of the printed circuit board (10) in an electronic device (100).

Abstract translation: 本发明涉及一种电子设备，特别是用于医疗植入物的电子设备以及包括印刷电路板（10）的印刷电路板装置，其中至少一个UV透明元件（20）至少固定地联接到印刷电路板 （10），其中所述UV透明元件（20）旨在用于将所述印刷电路板（10）固定在电子设备（100）中。

公开(公告)号：EP2634797A4

公开(公告)日：2016-08-10

申请号：EP11836419

申请日：2011-10-27

Applicant: KYOCERA CORP

Inventor： HASHIGUCHI YURIE ,  MORIYAMA YOUSUKE

IPC: H01L23/00 ,  H01L23/12 ,  H01L23/13 ,  H01L23/36 ,  H01L23/498 ,  H01L33/48 ,  H01L33/62 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/18 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49805 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/02 ,  H05K3/0052 ,  H05K3/0061 ,  H05K2201/0769 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09845 ,  H01L2924/00011 ,  H01L2924/00

Abstract: A wiring board (10) includes an insulating substrate (1) having a side surface (1c) including a protrusion portion (1a) or a recess portion (1b) and a lower surface (1d) having a metal member (4) bonded thereto; a wiring conductor (2) embedded in the insulating substrate (1) and having an exposed portion (3) partially exposed above the protrusion portion (1a) or the recess portion (1b) from the side surface (1c) of the insulating substrate (1); and a metal member (4) bonded to the lower surface of the insulating substrate (1). It is possible to suppress occurrence of ion migration between the wiring conductor (2) and the metal member (4) by increasing a distance between the exposed portion (3) and the metal member (4) without increasing a thickness of the wiring board (10).

公开(公告)号：EP2917986A4

公开(公告)日：2016-08-03

申请号：EP13870098

申请日：2013-10-17

Applicant: SILICON IMAGE INC

Inventor： KIM KIHONG

IPC: G02B6/42 ,  G02B6/43 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K1/117 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4292 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/141 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09072 ,  H05K2201/09145 ,  H05K2201/10121 ,  Y10T29/4913

公开(公告)号：EP2572561B1

公开(公告)日：2016-07-20

申请号：EP11725894.7

申请日：2011-06-03

Applicant: Flexenable Limited

Inventor： RIEDEL, David ,  LIEHR, Stefan ,  CORTEGA-CAGARA, Rina

IPC: H05K3/28 ,  H01L23/544 ,  H05K1/18 ,  H05K3/00 ,  H05K1/02 ,  H05K3/32

CPC classification number: H05K3/0011 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2223/5448 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/06 ,  H05K3/28 ,  H05K3/323 ,  H05K2201/0108 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10681 ,  H05K2203/0126 ,  H05K2203/0228 ,  H05K2203/1147 ,  H05K2203/166 ,  Y10T29/49155 ,  Y10T29/49789 ,  H01L2924/00

公开(公告)号：EP1901397B1

公开(公告)日：2016-03-30

申请号：EP07116332.3

申请日：2007-09-13

Applicant: MAGNETI MARELLI FRANCE

Inventor： Angot, Maxime

IPC: H01R12/79 ,  H01R12/77 ,  H01R12/62 ,  H05K1/02 ,  H05K13/08 ,  H05K1/11 ,  H01R12/70 ,  H01R13/58

CPC classification number: H05K1/118 ,  H01R12/62 ,  H01R12/771 ,  H01R12/775 ,  H01R12/79 ,  H01R13/58 ,  H05K1/0269 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/10598

公开(公告)号：EP2484957A4

公开(公告)日：2015-09-30

申请号：EP10797109

申请日：2010-07-05

Applicant: TOSHIBA KK ,  TOSHIBA MATERIALS CO LTD

Inventor： FUKUDA YOSHIYUKI ,  KATO HIROMASA

IPC: F21S8/10 ,  F21W101/10 ,  F21Y101/02 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/02 ,  H05K1/0306 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2203/167 ,  Y10T428/24273