摘要:
A thin film transistor (10) in an electronic device such as an active matrix display panel having an intrinsic amorphous silicon semiconductor layer (22) providing a channel region (23) between source and drain electrodes (14, 16) includes directly adjacent to the side of the semiconductor layer (22) remote from the gate electrode (25) at the channel region (23) a layer (20) of amorphous semiconductor material which has a high defect density and low conductivity that serves to provide recombination centres for photogenerated carriers. Leakage problems due to the photoconductive properties of the intrinsic semiconductor material are then reduced. Conveniently, an hydrogenated silicon rich amorphous silicon alloy (e.g. nitride etc) can be used for the recombination centre layer (20).
摘要:
In a flat panel display or other large-area electronics device, each cell of a matrix comprises a thin-film switching transistor (T1) connected between a respective column conductor (CC) and a respective cell electrode (CLC). Each cell also has a storage capacitor (CS) formed with the row conductor (RR (n-1); 14b) of a neighbouring cell by a lower conductive film part (11c). In order to reduce the effect of parasitic thin-film transistors (T2, T3) formed by these row conductors (RR) between said lower conductive film part (11c) and neighbouring column conductors (CC), the parasitic transistor channel regions are dimensioned to have a length (L) greater than their respective width (W; W1), and their width (W; W1) is preferably made smaller than the width (W2) of the row conductor (RR; 14b) and its semiconductor film pattern (12) in the area of its storage capacitor (CS).
摘要:
A thin-film circuit element such as a top-gate TFT has good quality electrical contacts formed between an electrode (151, 152, 155) of chromium nitride and the semiconductor film (50) of the circuit element and/or another conductive film such as a connection track (37,39,40) of, for example, aluminium. Chromium nitride has a particularly advantageous combination of propertied for use as such an electrode material, including, for example, low affinity for oxide growth even during deposition thereon of semiconductor, insulating and/or metal films, a doping potential to enhance ohmic contact to semiconductors, a barrier function against potential impurities, good thin-film processing compatibility, and hillock prevention in an underlying aluminium conductor.
摘要:
In an electronic device, such as an active matrix display device or the like, comprising a top gate amorphous silicon thin film transistor (10) in which one or both of the source and drain electrodes (15, 16) are of transparent conductive material such as ITO, the PECVD deposited semiconductor layer (18) extending over and between the source and drain electrodes of the TFT is formed as first and second sub-layers (18A, 18B), using different source gas compositions. A noble inert gas such as helium is used as dilutant in forming the first sub-layer adjacent the source and drain electrodes to avoid reduction problems while hydrogen is used as the dilutant in forming the second sub-layer to achieve high stability and mobility characteristics in the completed transistor.
摘要:
Thin-film switching elements (20, 21) of a display device or the like include a first electrode (22, 23) on a substrate (11) and a layer of switching material (24, 25) on the first electrode. These switching elements may be semiconductor pin or Schottky diodes, or MIMs, or TFTs. The switching material is typically α-Si:H in the case of the semiconductor diodes and TFTs, and tantalum oxide or silicon nitride in the case of the MIMs. An auxiliary layer (28, 29) of insulating material is provided between the first electrode (22, 23) and the layer of switching material (24, 25), leaving an edge (30, 31) of the first electrode uncovered, so that the layer of switching material is connected to this edge only. The switching elements with this construction can be patterned using an inexpensive proximity printer, and have a low capacitance value, so counter-acting kickback and crosstalk which can occur in a switching matrix, e.g. in the display of television pictures.
摘要:
A thin-film circuit element such as a top-gate TFT has good quality electrical contacts formed between an electrode (151, 152, 155) of chromium nitride and the semiconductor film (50) of the circuit element and/or another conductive film such as a connection track (37,39,40) of, for example, aluminium. Chromium nitride has a particularly advantageous combination of propertied for use as such an electrode material, including, for example, low affinity for oxide growth even during deposition thereon of semiconductor, insulating and/or metal films, a doping potential to enhance ohmic contact to semiconductors, a barrier function against potential impurities, good thin-film processing compatibility, and hillock prevention in an underlying aluminium conductor.
摘要:
In a flat panel display or other large-area electronics device, each cell of a matrix comprises a thin-film switching transistor (T1) connected between a respective column conductor (CC) and a respective cell electrode (CLC). Each cell also has a storage capacitor (CS) formed with the row conductor (RR (n-1); 14b) of a neighbouring cell by a lower conductive film part (11c). In order to reduce the effect of parasitic thin-film transistors (T2, T3) formed by these row conductors (RR) between said lower conductive film part (11c) and neighbouring column conductors (CC), the parasitic transistor channel regions are dimensioned to have a length (L) greater than their respective width (W; W1), and their width (W; W1) is preferably made smaller than the width (W2) of the row conductor (RR; 14b) and its semiconductor film pattern (12) in the area of its storage capacitor (CS).
摘要:
A light-weight substrate (10) for thin film, large area electronic devices such as active matrix display devices, image sensing arrays and the like comprises a layer of rigid, cellular material (12) bonded to a comparatively thin glass sheet (11) on whose surface thin film circuit elements are provided. An aerogel material of higher than usual density can be used for the cellular layer. An array of microlenses may be provided between the cellular layer and the thin glass sheet.