公开(公告)号：EP2571032A4

公开(公告)日：2017-09-06

申请号：EP11780639

申请日：2011-05-11

Applicant: LINTEC CORP ,  KOCHI UNIV OF TECH

Inventor： NAGAMOTO KOICHI ,  KONDO TAKESHI ,  AMINO YUMIKO ,  NAGANAWA SATOSHI ,  YAMAMOTO TETSUYA ,  YAMADA TAKAHIRO

IPC: H01B5/14 ,  B32B7/02 ,  B32B9/00 ,  C23C14/02 ,  C23C14/08 ,  H01B13/00

CPC classification number: C23C14/086 ,  C08J7/045 ,  C08J2367/02 ,  C08J2433/08 ,  C23C14/024 ,  G06F3/041 ,  G06F2203/04103 ,  Y10T428/265

公开(公告)号：EP2927295A4

公开(公告)日：2016-08-03

申请号：EP13858328

申请日：2013-11-29

Applicant: LINTEC CORP

Inventor： NISHIJIMA KENTA ,  NAGANAWA SATOSHI ,  FUCHI EMI

IPC: C09J109/00 ,  C09J7/00 ,  C09J7/02 ,  C09J11/06 ,  C09J121/00 ,  H01L21/56 ,  H01L23/29 ,  H01L51/50 ,  H01L51/52 ,  H05B33/04

CPC classification number: C09J7/0214 ,  C09J7/383 ,  C09J109/00 ,  C09J2201/622 ,  C09J2409/00 ,  C09J2413/00 ,  C09J2413/003 ,  H01L23/296 ,  H01L51/5246 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: The present invention provides: an adhesive composition comprising a diene-based rubber (A) that includes a radiation-curable functional group, a cured adhesive layer having a thickness of 60 µm that is formed by curing the adhesive composition having a water vapor transmission rate at a temperature of 40°C and a relative humidity of 90% of 30 g/(m 2 ·day) or less; an adhesive sheet comprising a curable adhesive layer that is formed using the adhesive composition; and an electronic device comprising a sealing material, the sealing material being formed using the adhesive composition. According to the present invention, provided are: an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability and sufficient cohesive strength, and exhibits adhesion and holding power in a well-balanced manner, an adhesive sheet that includes an adhesive layer that is formed using the adhesive composition, and an electronic device that includes a sealing material that is formed using the adhesive composition.

公开(公告)号：EP2692522A4

公开(公告)日：2015-04-29

申请号：EP12763091

申请日：2012-02-27

Applicant: LINTEC CORP

Inventor： NAGANAWA SATOSHI

IPC: B32B9/00 ,  C23C14/04 ,  C23C16/30 ,  C23C16/40 ,  C23C16/42 ,  C23C16/56 ,  H05K5/02 ,  H05K13/00

CPC classification number: H05K5/0213 ,  C23C14/48 ,  C23C16/30 ,  C23C16/56 ,  H01J37/32412 ,  H05K13/00 ,  Y10T428/265

Abstract: Provided is a gas barrier laminate that can be produced inexpensively as compared with the case of using an inorganic film without requiring a complex production process, and exhibits an excellent gas barrier capability and excellent flexibility, and also provided are a method for producing the gas barrier laminate, an electronic device member that includes the gas barrier laminate, and an electronic device that includes the electronic device member. A gas barrier laminate including a base and a gas barrier layer, the gas barrier layer being provided on the base, the gas barrier layer being obtained by implanting ions into an organosilicon compound thin film formed by a CVD method that utilizes an organosilicon compound as a deposition raw material, a method for producing the gas barrier laminate, an electronic device member that includes the gas barrier laminate, and an electronic device that includes the electronic device member are provided.

Abstract translation: 本发明提供一种阻气性叠层也可以被廉价地生产与使用无机电影的，而不需要复杂的生产过程的情况相比，并表现出优异的阻气性和柔软性优异，因此，提供了用于制备阻气性的方法 电子装置元件的层压板那样包括气体阻隔性层压体，和给电子设备没有包括电子设备部件。 设置在底座上的阻气性叠层体包括基底和气体阻隔层，气体阻隔层，气体阻隔层由在有机硅化合物薄膜，通过CVD方法形成将离子注入获得并利用在有机硅化合物作为 沉积原料，其制造的电子设备部件的气体阻隔性层合体的方法没有包括气体阻隔性层压体，和给电子设备确实包括设置在电子装置元件。

公开(公告)号：EP2551893A4

公开(公告)日：2014-05-21

申请号：EP11759047

申请日：2011-01-05

Applicant: LINTEC CORP

Inventor： NAGANAWA SATOSHI ,  KONDO TAKESHI

IPC: H01L21/3065 ,  H01L51/44

CPC classification number: H01L31/02366 ,  C01G3/02 ,  C01G5/00 ,  C01G9/02 ,  C01G11/00 ,  C01G13/02 ,  C01G15/00 ,  C01G19/02 ,  C01G21/02 ,  C01G31/02 ,  C01G45/02 ,  C01G53/04 ,  C01P2002/85 ,  C01P2004/03 ,  C01P2006/40 ,  H01L51/0037 ,  H01L51/0096 ,  H01L51/441 ,  H01L51/447 ,  Y02E10/549

公开(公告)号：EP2538417A4

公开(公告)日：2017-03-22

申请号：EP11744487

申请日：2011-01-26

Applicant: LINTEC CORP

Inventor： NAGAMOTO KOICHI ,  KONDO TAKESHI ,  SUZUKI YUTA ,  NAGANAWA SATOSHI

IPC: H01B5/14 ,  B32B9/00 ,  C08J7/12 ,  C23C14/02 ,  C23C14/08 ,  C23C14/48 ,  H01B13/00

CPC classification number: C23C14/086 ,  C08J7/045 ,  C08J7/123 ,  C08J2367/02 ,  C08J2483/04 ,  C23C14/027 ,  C23C14/48 ,  C23C14/562 ,  Y10T428/265 ,  Y10T428/31663

公开(公告)号：EP2927296A4

公开(公告)日：2016-08-17

申请号：EP13858271

申请日：2013-11-29

Applicant: LINTEC CORP

Inventor： NISHIJIMA KENTA ,  NAGANAWA SATOSHI ,  FUCHI EMI

IPC: C09J113/00 ,  C09J7/02 ,  C09J123/20 ,  H01L21/56 ,  H01L51/50 ,  H05B33/04

CPC classification number: C09J7/02 ,  C09J7/383 ,  C09J109/00 ,  C09J113/00 ,  C09J115/00 ,  C09J123/20 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2400/22 ,  C09J2409/00 ,  C09J2413/00 ,  C09J2421/00 ,  C09J2423/00 ,  H01L51/5246 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: The present invention provides an adhesive composition comprising a diene-based rubber (A) that includes a carboxylic acid-based functional group, and a crosslinking agent (B), an adhesive layer having a thickness of 60 µm that is obtained by crosslinking the adhesive composition having a water vapor transmission rate at a temperature of 40°C and a relative humidity of 90% of 60 g/(m 2 ·day) or less; an adhesive sheet comprising an adhesive layer that is formed using the adhesive composition; and an electronic device comprising a sealing material, the sealing material being formed using the adhesive composition, or the adhesive sheet. According to the present invention, provided are; an adhesive composition that is useful as a material for forming an adhesive layer that exhibits an excellent water barrier capability, and exhibits adhesion and holding power in a well-balanced manner; an adhesive sheet that includes an adhesive layer that is formed using the adhesive composition; and an electronic device that includes a sealing material that is formed using the adhesive composition or the adhesive sheet.

公开(公告)号：EP2554582A4

公开(公告)日：2014-03-05

申请号：EP11762771

申请日：2011-03-28

Applicant: LINTEC CORP

Inventor： IWAYA WATARU ,  KONDO TAKESHI ,  NAGANAWA SATOSHI

IPC: C08J7/00 ,  C09D7/80 ,  C23C14/48 ,  G02F1/1333

CPC classification number: H01B1/124 ,  B05D1/60 ,  B05D7/04 ,  B05D7/52 ,  B05D2252/02 ,  C08J7/123 ,  C23C14/345 ,  C23C14/35 ,  C23C14/48 ,  C23C14/562

公开(公告)号：EP2496055A4

公开(公告)日：2013-11-20

申请号：EP10826564

申请日：2010-10-19

Applicant: LINTEC CORP

Inventor： NAGANAWA SATOSHI ,  AMINO YUMIKO ,  ONO YOSHITOMO

IPC: H05B33/10 ,  H05B33/20

CPC classification number: H05B33/10 ,  H05B33/20

Abstract: A light-emitting composition comprising (A) a compound having a cyanoethyl group, (B) an adhesive resin material and (C) an electroluminescent material, wherein an amount of the component (B) is from 1 to 1,000 parts by mass per 100 parts by mass of the component (A); an electroluminescent sheet comprising at least a first electrode, an electroluminescent layer and a second electrode, laminated in this order, wherein at least one of the first electrode and the second electrode is transparent, and the electroluminescent layer contains the light-emitting composition; and a method for producing thereof are provided. Specifically, an electroluminescent sheet that can be produced at ambient temperature without heating, has high productivity, and can be mass produced at low cost, a method for producing thereof, and a light-emitting composition used therein are provided.

公开(公告)号：EP2556954A4

公开(公告)日：2013-09-04

申请号：EP11762728

申请日：2011-03-25

Applicant: LINTEC CORP

Inventor： NAGAMOTO KOICHI ,  KONDO TAKESHI ,  SUZUKI YUTA ,  IWAYA WATARU ,  NAGANAWA SATOSHI

IPC: B32B9/00 ,  C23C14/48 ,  C23C14/56 ,  C23C14/58 ,  H01B5/14 ,  H01B13/00

CPC classification number: C23C14/48 ,  C08J7/047 ,  C08J7/123 ,  C08J2367/02 ,  C08J2369/00 ,  C08J2483/14 ,  C23C14/562 ,  Y10T428/31663

公开(公告)号：EP3153314A4

公开(公告)日：2018-03-28

申请号：EP15802604

申请日：2015-06-02

Applicant: LINTEC CORP

Inventor： MIMURA TOSHIFUMI ,  SUZUKI YUUTA ,  NAGANAWA SATOSHI

IPC: B32B9/00 ,  B32B7/02

CPC classification number: C08J7/047 ,  B05D1/60 ,  B05D1/62 ,  B05D5/00 ,  B05D7/04 ,  B05D7/51 ,  C08J2383/16 ,  C23C14/0036 ,  C23C14/086

Abstract: The present invention is a gas barrier laminate comprising a base unit that comprises a base and a modification-promoting layer, and a gas barrier layer that is formed on a side of the modification-promoting layer with respect to the base unit, the modification-promoting layer having a modulus of elasticity at 23°C of less than 30 GPa, the base unit having a water vapor transmission rate at a temperature of 40°C and a relative humidity of 90% of 1.0 g/(m 2 ·day) or less, and the gas barrier layer being a layer formed by applying a modification treatment to a surface of a layer that comprises a polysilazane-based compound and is formed on the side of the modification-promoting layer with respect to the base unit, and a method for producing the gas barrier laminat, and an electronic device member comprising the gas barrier laminate, and an electronic device comprising the electronic device member.