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公开(公告)号：EP1694105A1
公开(公告)日：2006-08-23
申请号：EP04818363.6
申请日：2004-11-30
CPC分类号： H05K3/022 , B32B3/266 , B32B5/022 , B32B15/14 , B32B15/20 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/0261 , B32B2307/202 , B32B2457/08 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0116 , H05K2201/0355 , H05K2203/068 , H05K2203/1461 , H05K2203/1476 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A pre-preg sheet including a substrate and a resin impregnated in the substrate is provided. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filling a through-hole in the pre-preg sheet to be compressed at a small rate.
摘要翻译： 提供了包括基材和浸渍在基材中的树脂的预浸片。 将第一金属箔放置在预浸片上以提供层压体。 将层叠体放入温度保持在接近树脂的软化温度的温度的加热装置中。 层压体在预定压力的温度下被压缩。 将第一金属箔接合到层压体的预浸片材上并硬化树脂，从而提供电路板。 该方法提供了一种导电浆料的稳定电阻，该导电浆料填充预压片中的通孔以以较小的速率被压缩。
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2.发明公开CIRCUIT FORMED SUBSTRATE AND METHOD OF MANUFACTURING CIRCUIT FORMED SUBSTRATE 审中-公开电路的衬底经过培训及其制造方法受过训练的电路基板
公开(公告)号：EP1408724A1
公开(公告)日：2004-04-14
申请号：EP02746094.8
申请日：2002-07-16
发明人： NISHII, Toshihiro , FUKUI, Yasuharu , TATSUMI, Kiyohide , KAWAKITA, Yoshihiro , NAKAMURA, Shinji , KOMODA, Hideaki
CPC分类号： H05K3/4069 , H05K1/0366 , H05K3/4614 , H05K3/4652 , H05K2201/0278 , H05K2201/029 , H05K2201/0355 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T428/24917
摘要： A circuit board ensuring electrical connections is provided. An insulated board material, having connecting means for connecting a layer to another layer, includes a reinforcing member. A thickness of the entire insulated board material is at least equal to or not more than 1.5 times of a thickness of the reinforcing member.
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3.发明公开CIRCUIT FORMATION SUBSTRATE MANUFACTURING METHOD AND CIRCUIT FORMATION SUBSTRATE MATERIAL 审中-公开SCHALTUNGSAUSBILDUNGSSUBSTRATHERSTELLUNGSVERFAHREN UND SCHALTUNGSAUSBILDUNGSSUBSTRATMATERIAL
公开(公告)号：EP1551210A1
公开(公告)日：2005-07-06
申请号：EP04733120.2
申请日：2004-05-14
CPC分类号： B32B37/22 , B32B37/226 , B32B38/18 , B32B2309/105 , B32B2457/08 , H05K1/0366 , H05K3/0052 , H05K3/022 , H05K3/4069 , H05K2201/0355 , H05K2203/0191 , H05K2203/068 , H05K2203/1461 , H05K2203/1545 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T29/53865
摘要： In a method of manufacturing a circuit forming board, a first sheet having a first direction is transferred in a second direction, so that the first direction of the first sheet is parallel to the second direction. Films are stuck onto both surfaces of the first sheet while transferring the first sheet in a third direction orthogonal to the first direction of the first sheet. This method allows connecting member, such as conductive paste, to electrically coupling between layers of the circuit forming board.
摘要翻译： 在制造电路形成板的方法中，具有第一方向的第一片在第二方向上传送，使得第一片的第一方向平行于第二方向。 在与第一片的第一方向正交的第三方向上转印第一片时，将膜粘附在第一片的两个表面上。 该方法允许诸如导电浆料的连接构件在电路形成板的层之间电耦合。
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公开(公告)号：EP1487245A1
公开(公告)日：2004-12-15
申请号：EP03782953.8
申请日：2003-12-26
IPC分类号： H05K3/00
CPC分类号： H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , H05K2203/068 , H05K2203/1461 , H05K2203/1476 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.
摘要翻译： 将金属箔配置在导电性填充有导电性糊剂的导电性填充剂的低压缩性预浸片材的任一面上后，在保持较低的温度的状态下进行压缩，然后升温至 熔融并固化半固化片中的树脂，从而稳定连接电阻，并且可以获得高质量的电路板。
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