公开(公告)号：EP1796156A1

公开(公告)日：2007-06-13

申请号：EP05782249.6

申请日：2005-09-07

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： KARASHIMA, Seiji c/o Matsushita Electric Industrial Co., Ltd. ,  YAMASHITA, Yoshihisa c/o Matsushita Electric Industrial Co., Ltd. ,  TOMEKAWA, Satoru c/o Matsushita Electric Industrial Co., Ltd. ,  KITAE, Takashi c/o Matsushita Electric Industrial Co., Ltd. ,  NAKATANI, Seiichi c/o Matsushita Electric Industrial Co., Ltd.

IPC分类号： H01L21/60

CPC分类号： H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1152 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/29011 ,  H01L2224/29035 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/818 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/0425 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681 ,  H01L2924/00 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/05599

摘要： There is provided a flip chip mounting process which is high in productivity and reliability, and thus can be applicable to the flip chip mounting of the next-generation LSI. This flip chip mounting process comprises the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. This heating step is carried out at a temperature higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21). Finally, the resin is cured so as to secure the semiconductor chip (20) to the wiring substrate (10).

摘要翻译： 提供了生产率和可靠性高的倒装芯片安装工艺，因此可以适用于下一代LSI的倒装芯片安装。 这种倒装芯片安装工艺包括以下步骤：将含有焊料粉末的树脂（13）和对流添加剂（12）提供到具有多个电极端子（11）的布线基板（10）上，然后将半导体芯片（20） 具有与供给的树脂（13）的表面接触的多个连接端子（11），然后将布线基板（10）加热到使焊料粉末熔化的温度。 该加热步骤在高于对流添加剂（12）的沸点的温度下进行，以使沸腾对流添加剂（12）在树脂（12）内移动。 在该加热步骤中，使熔融的焊料粉末自组装到布线基板（10）的每个电极端子（11）与半导体芯片的每个连接端子（21）之间的区域中，以形成每个 电极端子（11）和每个连接端子（21）。 最后，将树脂固化，以将半导体芯片（20）固定到布线基板（10）上。