公开(公告)号：EP3412122A1

公开(公告)日：2018-12-12

申请号：EP16825661.8

申请日：2016-12-21

申请人： Qualcomm Incorporated

发明人： KIM, Daeik Daniel ,  VELEZ, Mario Francisco ,  YUN, Changhan Hobie ,  ZUO, Chengjie ,  BERDY, David Francis ,  KIM, Jonghae ,  MUDAKATTE, Niranjan Sunil

IPC分类号： H05K3/34 ,  H01L23/31 ,  H05K3/00 ,  H05K1/11 ,  H05K1/03

CPC分类号： H01L24/11 ,  H01L23/15 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49816 ,  H01L24/14 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1148 ,  H01L2224/1405 ,  H01L2224/14104 ,  H01L2224/145 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/0052 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/09845 ,  Y02P70/611

摘要： A conductive bump assembly may include a passive substrate. The conductive bump assembly may also include a conductive bump pad supported by the passive substrate and surrounded by a first passivation layer opening. The conductive bump assembly may further include a second passivation layer opening on the passive substrate. The second passivation layer opening may be merged with the first passivation layer opening surrounding the conductive bump pad proximate an edge of the passive substrate. The conductive bump assembly may also include a conductive bump on the conductive bump pad.

公开(公告)号：EP2684434B1

公开(公告)日：2016-12-28

申请号：EP12708973.8

申请日：2012-03-06

申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives ,  3D Plus

发明人： LIMOUSIN, Olivier ,  SOUFFLET, Fabrice

IPC分类号： H05K3/32 ,  H05K3/40 ,  H01L21/60 ,  H01L23/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/12

CPC分类号： H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81191 ,  H01L2224/8185 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/12042 ,  H05K3/027 ,  H05K3/06 ,  H05K3/12 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/10674 ,  H05K2203/107 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

公开(公告)号：EP2398305B1

公开(公告)日：2016-12-28

申请号：EP10741308.0

申请日：2010-02-15

申请人： Senju Metal Industry Co., Ltd

发明人： KURAMOTO Takeo ,  TSURUTA Kaichi ,  SAITOU Takeo

IPC分类号： H01R4/04 ,  H01R12/62 ,  B23K1/00 ,  B23K3/06 ,  B23K35/26 ,  C22F1/00 ,  H05K3/34 ,  H01L21/48 ,  H01L21/683

CPC分类号： B23K1/0016 ,  B23K3/0638 ,  B23K35/262 ,  C22F1/00 ,  H01L21/4853 ,  H01L21/6835 ,  H01L2224/11003 ,  H01L2224/11332 ,  H01L2224/115 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19041 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0425 ,  Y10T428/12736 ,  Y10T428/265 ,  Y10T428/31678 ,  H01L2224/29099

公开(公告)号：EP2917931A1

公开(公告)日：2015-09-16

申请号：EP13801876.7

申请日：2013-11-08

申请人： Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO ,  IMEC vzw

发明人： SMITS, Edsger Constant Pieter ,  PERINCHERY, Sandeep Menon ,  VAN DEN BRAND, Jeroen ,  MANDAMPARAMBIL, Rajesh ,  SCHOO, Harmannus Franciscus Maria

IPC分类号： H01L21/60 ,  H01L21/48 ,  B23K3/06 ,  B23K35/26 ,  C09J9/02 ,  H01L23/00 ,  H01L33/62 ,  H01L23/498 ,  H01L23/485 ,  H01L21/683

CPC分类号： H01L24/83 ,  B23K35/02 ,  B23K35/26 ,  B23K35/262 ,  C09J5/06 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/4853 ,  H01L21/50 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L33/62 ,  H01L2021/60277 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/1133 ,  H01L2224/13005 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14131 ,  H01L2224/27001 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/29034 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/742 ,  H01L2224/75252 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/381 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/2076 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method is provided for assembly of a micro-electronic component comprising the steps of: providing a conductive die bonding material comprising of a conductive thermosettable resin material or flux based solder and a dynamic release layer adjacent to the conductive thermoplastic material die bonding material layer; and impinging a laser beam on the dynamic release layer adjacent to the die bonding material layer; in such a way that the dynamic release layer is activated to direct conductive die bonding material matter towards the pad structure to be treated to cover a selected part of the pad structure with a transferred conductive die bonding material; and wherein the laser beam is restricted in timing and energy, in such a way that the die bonding material matter remains thermosetting. Accordingly adhesive matter can be transferred while preventing that the adhesive is rendered ineffective by thermal overexposure in the transferring process.

公开(公告)号：EP2398305A4

公开(公告)日：2015-02-25

申请号：EP10741308

申请日：2010-02-15

申请人： SENJU METAL INDUSTRY CO

发明人： KURAMOTO TAKEO ,  TSURUTA KAICHI ,  SAITOU TAKEO

IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K1/20 ,  B23K3/06 ,  B23K35/26 ,  C22F1/00 ,  H01L21/48 ,  H01L21/60 ,  H01L21/683

CPC分类号： B23K1/0016 ,  B23K3/0638 ,  B23K35/262 ,  C22F1/00 ,  H01L21/4853 ,  H01L21/6835 ,  H01L2224/11003 ,  H01L2224/11332 ,  H01L2224/115 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19041 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0425 ,  Y10T428/12736 ,  Y10T428/265 ,  Y10T428/31678 ,  H01L2224/29099

公开(公告)号：EP2313919A4

公开(公告)日：2014-01-15

申请号：EP09805345

申请日：2009-07-22

申请人： IBM

发明人： DING HANYI ,  JOSEPH ALVIN ,  STAMPER ANTHONY

IPC分类号： H01L21/768 ,  H01L23/00 ,  H01L23/48 ,  H01L25/065

CPC分类号： H01L21/76898 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/481 ,  H01L25/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0405 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01068 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00

公开(公告)号：EP2073258A3

公开(公告)日：2011-10-26

申请号：EP08170698.8

申请日：2008-12-04

申请人： Shinko Electric Industries Co., Ltd.

发明人： Sunohara, Fumio c/o Shinko Electric Industries Co., Ltd. ,  Iida, Kiyoaki c/o Shinko Electric Industries Co., Ltd. ,  Kobayashi, Masakazu c/o Shinko Electric Industries Co., Ltd. ,  Maruyama, Kesami c/o Shinko Electric Industries Co., Ltd.

IPC分类号： H01L21/48 ,  B23K3/06 ,  H05K3/34

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  H01L21/4853 ,  H01L24/742 ,  H01L24/97 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/16225 ,  H01L2224/81193 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/15311 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2224/81

摘要： A conductive ball mounting method of the present invention, includes a step of, arranging a mask (40) in which an opening portion (40a) is provided, on a substrate (1) including a connection pad (C1), arranging a conductive ball (62) on the connection pad (C1) through the opening portion (40a) of the mask (40) by supplying the conductive ball (62) onto the mask (40), separating the substrate (1) and the mask (40), in the step, an extra conductive ball (62) left on the mask (40) drops through the opening portion (40a) of the mask (40), thereby a surplus ball (62a) is mounted on the substrate (1), and removing the surplus ball (62a) on the substrate (1) by making the surplus ball (62a) adhere onto an adhering head (78).

公开(公告)号：EP1651016B1

公开(公告)日：2010-01-27

申请号：EP05021273.7

申请日：2005-09-29

申请人： NITTO DENKO CORPORATION

发明人： Kanagawa, Hitoki, Nitto Denko Corporation ,  Ohsawa, Tetsuya, Nitto Denko Corporation ,  Ooyabu, Yasunari, Nitto Denko Corporation

IPC分类号： H05K1/11

CPC分类号： H05K1/112 ,  G11B5/4833 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K1/056 ,  H05K3/06 ,  H05K3/244 ,  H05K3/28 ,  H05K3/363 ,  H05K3/44 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10666 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/0455 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

公开(公告)号：EP2063466A2

公开(公告)日：2009-05-27

申请号：EP09000368.2

申请日：1996-05-24

申请人： FormFactor, Inc.

发明人： Khandros, Igor Y. ,  Eldridge, Benjamin N. ,  Mathieu, Gaetan L.

IPC分类号： H01L23/48 ,  H01L21/68 ,  H01L21/48 ,  H05K3/32 ,  H01L21/60 ,  H01L23/498

CPC分类号： H05K3/4015 ,  B23K20/004 ,  B23K2201/40 ,  C23C18/1605 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/05599

摘要： An electrical interconnection element (720, 730) comprises: a conductive interconnection component (730), including a connection region; and a conductive cantilever structure (720) formed by depositing spring material (712) in an opening of a masking layer (710) on a sacrificial substrate (702), wherein the conductive cantilever structure (720) is mounted to the connection region of the interconnection component (730).

摘要翻译： 电互连元件（720,730）包括：导电互连部件（730），包括连接区域; 以及通过在牺牲衬底（702）上的掩模层（710）的开口中沉积弹簧材料（712）而形成的导电悬臂结构（720），其中导电悬臂结构（720）安装到 互连部件（730）。

公开(公告)号：EP1736273A4

公开(公告)日：2009-05-20

申请号：EP05709373

申请日：2005-01-27

申请人： PANASONIC CORP

发明人： MAEDA TADASHI ,  SAKAI TADAHIKO

IPC分类号： B23K35/363 ,  B23K3/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34

CPC分类号： B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/36 ,  B23K35/3613 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/3489 ,  H05K2201/0215 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00

摘要： There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1 % and 9 % by volume based on a volume of the flux.