公开(公告)号：EP1251550B1

公开(公告)日：2005-03-30

申请号：EP02013585.1

申请日：1995-04-17

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Farnworth, Warren M. ,  Folaron, Jennifer L. ,  Folaron, Robert J. ,  Hembree, David R. ,  Jacobson, John O. ,  Nelson, Jay C. ,  Warren, Lelan D.

IPC: H01L21/00 ,  H05K13/08

CPC classification number: H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  G01R31/311 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K13/08 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

公开(公告)号：EP1251550A1

公开(公告)日：2002-10-23

申请号：EP02013585.1

申请日：1995-04-17

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Farnworth, Warren M. ,  Folaron, Jennifer L. ,  Folaron, Robert J. ,  Hembree, David R. ,  Jacobson, John O. ,  Nelson, Jay C. ,  Warren, Lelan D.

IPC: H01L21/00 ,  H05K13/08

CPC classification number: H01L21/67276 ,  G01R31/2851 ,  G01R31/2886 ,  G01R31/2893 ,  G01R31/311 ,  H01L21/67126 ,  H01L21/67242 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/74 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K13/08 ,  Y10T29/49004 ,  Y10T29/49131 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: An apparatus for automatically positioning electronic die within temporary packages to enable continuity testing and the like between the die bond pads and the temporary package electrical interconnects is provided. The apparatus includes a robot having a programmable robot arm with a gripper assembly, die and lid feeder stations, a die inverter, and a plurality of cameras or image producers. The cameras take several pictures of the die and temporary packages to precisely align the die bond pads with the temporary package electrical interconnects. A predetermined assembly position is located along a conveyor that conveys a carrier between a first position, corresponding to an inlet, and a second position, corresponding to an outlet. The die, a restraining device and temporary package are assembled at the predetermined assembly position and tested for continuity therebetween. The apparatus further includes a fifth camera which locates the die at a wafer handler. The apparatus has a control mechanism including a microprocessor and associated program routines that selectively control the robot arm (i) to move the gripper assembly to the lid feeder station to pick up a lid, (ii) to move the gripper assembly along with the lid to pick up the die following photographing by the rough die camera, (iii) to move the gripper assembly along with the lid and the die to a position to be photographed by the fine die camera, and (iv) to move the lid and the die to the predetermined assembly position located along the conveyor. The method and apparatus may also be used for disassembly.

Abstract translation: 提供了一种用于临时包内自动定位电子启用连续性测试和管芯接合焊盘和所述临时封装电互连件之间的装置等。 该装置包括具有一个可编程的机器人臂与夹持器组件，该盖和馈线站，一个是逆变器，和摄像机或图像生产者的多个机器人。 相机拿爱情的几张图片和临时包精确对准与临时封装的电互连芯片焊盘。 预定的组装位置被沿着输送位于确实传达的第一位置之间的载体，在入口对应于，在所述第二位置，在出口对应。 的模具，约束装置和临时封装在组装预定位置组装并之间的连续性测试那里。 该装置包括：第五此外照相机在晶片处理程序所在的管芯。 该装置具有控制机构，其包括一微处理器和相关联的程序例程并选择性地控制所述机器人臂（i）至夹持器组件移动到盖子喂入器站拿起盖，（ii）向移动夹持器组件地连同盖 拿起由粗相机下面拍摄，（ⅲ）到夹持器组件地连同所述盖和所述模具移动到由细，相机被拍摄的位置，以及（iv）来移动盖子和 预定到沿着输送机位于装配位置。 因此，可以使用用于拆装的方法和装置。