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公开(公告)号:EP1898468A4
公开(公告)日:2011-03-02
申请号:EP06767440
申请日:2006-06-27
IPC分类号: H01L31/0224 , H01L31/068
CPC分类号: H01L31/022425 , H01L31/0224 , H01L31/022433 , H01L31/0508 , Y02E10/50
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2.SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MOUNTING STRUCTURE 有权
标题翻译: MONTAGESTRUKTURHILLBLEITERGEHÄUSEFÜREINHALBLEITERGEHÄUSE公开(公告)号:EP2447989A4
公开(公告)日:2013-01-23
申请号:EP09846434
申请日:2009-06-22
发明人: HAMAGUCHI TSUNEO , SUGIURA IKIO , SAKAMOTO HIROO , IWATA MASAKI , SHIRASE TAKASHI , OKAMURO TAKASHI
IPC分类号: H01L23/12 , H01L23/055 , H01L23/08 , H01L23/13 , H01L23/14 , H01L23/24 , H01L23/28 , H01L23/498 , H05K1/03 , H05K1/18 , H05K3/34
CPC分类号: H01L23/24 , H01L23/055 , H01L23/13 , H01L23/145 , H01L23/49805 , H01L23/562 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/12042 , H01L2924/15153 , H01L2924/15162 , H01L2924/15165 , H01L2924/16195 , H05K3/3442 , H05K2201/10727 , Y02P70/613 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
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