公开(公告)号：EP1275682A4

公开(公告)日：2003-07-16

申请号：EP01917494

申请日：2001-03-23

申请人： MITSUI TAKEDA CHEMICALS INC ,  MATSUSHITA ELECTRIC WORKS LTD

发明人： INOUE T ,  OKUMURA H ,  HIRATA ISAO ,  OKADA S

IPC分类号： B32B5/26 ,  B32B27/04 ,  C08F283/01 ,  C08F290/06 ,  C08J5/24 ,  H05K1/03 ,  B29B11/16 ,  B32B15/08 ,  B32B17/04 ,  B32B27/20

CPC分类号： B32B5/26 ,  B32B5/022 ,  B32B5/024 ,  B32B27/04 ,  B32B27/20 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/02 ,  B32B2305/72 ,  B32B2307/734 ,  B32B2398/20 ,  B32B2605/00 ,  B32B2605/12 ,  C08F283/01 ,  C08F290/064 ,  C08J5/24 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  Y10T428/249924 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/2904 ,  Y10T428/2927 ,  Y10T428/298 ,  Y10T428/2991 ,  Y10T428/31786

摘要： A lowly heat-expandable laminate which is obtained by superposing and curing fiber-reinforced layers impregnated with a resin composition comprising a radical-polymerizable resin, a radical-polymerizable monomer, and an inorganic filler and, compounded therewith, a specific amount of a thermoplastic resin. It is excellent in heat resistance, water resistance, and toughness and has an average coefficient of linear expansion of 20x10-6/°C or lower in the temperature range of 40 to 150°C.