公开(公告)号：EP0852395A2

公开(公告)日：1998-07-08

申请号：EP97122631.1

申请日：1997-12-22

Applicant: MOTOROLA, INC.

Inventor： Greer, Stuart E. ,  Clegg, David ,  Burnette, Terry Edward

IPC: H01L21/60 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L2224/11003 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K3/3478 ,  H05K2201/035 ,  H05K2201/10674 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H01L2924/00

Abstract: Multiplexed joining of solder bumps to various substrates for assembly of an integrated circuit package includes placing a semiconductor substrate (312) having solder bump structures (314) in contact with a ceramic substrate (320 having chip pads (322, 334), and placing this structure in contact with ball grid array spheres (352) in order to form a CBGA (360) in a single flow process. The method includes the steps of providing a semiconductor device having at least one first interconnect structure connected to a surface of the semiconductor device (501), and a substrate having a plurality of metallized pads (503); placing an at least one second interconnect structure in aligned contact with one or more of the plurality of metallized pads (505); placing the at least one first interconnect structure in aligned contact with one or more of the plurality of metallized pads (507); and simultaneously reflowing the at least one first interconnect structure and the at least one second interconnect structure such that the semiconductor device and at least one second interconnect structure are connected to the metallized pads of the substrate (509).

Abstract translation: 多路复用接合焊料凸块的各种基板的集成电路封装的组件包括放置半导体衬底（312）具有焊料凸点结构（314）接触的陶瓷基板（具有芯片焊盘320（322，334）和放置该 结构中，以便在一个单一的流动过程，以形成CBGA（360）的球栅阵列的球体（352）相接触。该方法包括提供具有连接到所述半导体的表面的至少一个第一互连结构的半导体器件的步骤 设备（501），和具有金属化焊盘（503）的多个基片;将至少一个第二互连结构中的一个或多个的金属化焊盘（505），所述多个对齐的接触;将所述至少一个第一互连 结构在与一个或多个金属化焊盘（507），所述多个对齐的接触;以及同时回流所述至少一个第一互连结构和所述至少一个第二interconn ECT检查结构做了半导体器件和至少一个第二互连结构被连接到基板（509）的金属化焊盘。

公开(公告)号：EP0852395A3

公开(公告)日：1998-07-15

申请号：EP97122631.1

申请日：1997-12-22

Applicant: MOTOROLA, INC.

Inventor： Greer, Stuart E. ,  Clegg, David ,  Burnette, Terry Edward

IPC: H01L21/60 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L2224/11003 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K3/3478 ,  H05K2201/035 ,  H05K2201/10674 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H01L2924/00

Abstract: Multiplexed joining of solder bumps to various substrates for assembly of an integrated circuit package includes placing a semiconductor substrate (312) having solder bump structures (314) in contact with a ceramic substrate (320 having chip pads (322, 334), and placing this structure in contact with ball grid array spheres (352) in order to form a CBGA (360) in a single flow process. The method includes the steps of providing a semiconductor device having at least one first interconnect structure connected to a surface of the semiconductor device (501), and a substrate having a plurality of metallized pads (503); placing an at least one second interconnect structure in aligned contact with one or more of the plurality of metallized pads (505); placing the at least one first interconnect structure in aligned contact with one or more of the plurality of metallized pads (507); and simultaneously reflowing the at least one first interconnect structure and the at least one second interconnect structure such that the semiconductor device and at least one second interconnect structure are connected to the metallized pads of the substrate (509).

Abstract translation: 将焊料凸块多路连接到用于组装集成电路封装的各种基板包括将具有焊料凸块结构（314）的半导体基板（312）放置成与具有芯片焊盘（322,334）的陶瓷基板（320）接触，并将该 结构与球栅阵列球体（352）接触以便在单个流动过程中形成CBGA（360），该方法包括以下步骤：提供具有至少一个连接到半导体表面的第一互连结构的半导体器件 装置（501）和具有多个金属化焊盘（503）的衬底;将至少一个第二互连结构放置成与所述多个金属化焊盘（505）中的一个或多个对准接触;将所述至少一个第一互连 结构与所述多个金属化焊盘（507）中的一个或多个对准接触;以及同时回流所述至少一个第一互连结构和所述至少一个第二互连 使得半导体器件和至少一个第二互连结构连接到衬底（509）的金属化焊盘。

公开(公告)号：EP0852395B1

公开(公告)日：2002-03-13

申请号：EP97122631.1

申请日：1997-12-22

Applicant: MOTOROLA, INC.

Inventor： Greer, Stuart E. ,  Clegg, David ,  Burnette, Terry Edward

IPC: H01L21/60 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L2224/11003 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K3/3478 ,  H05K2201/035 ,  H05K2201/10674 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H01L2924/00