公开(公告)号：EP2773169A1

公开(公告)日：2014-09-03

申请号：EP12842736.6

申请日：2012-09-28

Applicant: Kyocera Corporation

Inventor： NAKAMURA,Kiyotaka ,  OHASHI,Yoshio ,  SHIKATA,Kunihide

IPC: H05K1/09 ,  H05K3/24

CPC classification number: H05K1/09 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/1126 ,  C04B35/00 ,  C04B35/10 ,  C04B35/185 ,  C04B35/48 ,  C04B35/581 ,  C04B35/584 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5127 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/5155 ,  H01L2924/00

Abstract: [Object] To provide a circuit board having good heat dissipation characteristics capable of promptly dissipating the heat generated by a metal wiring layer on the basis of operations of an electronic component and exhibiting high reliability enabling a long term of use by improving the adhesion strength between a ceramic sintered body and a metal wiring layer and, thereby, reducing peeling of the metal wiring layer due to cooling/heating cycles when operation and non-operation of the electronic component are repeated, and an electronic apparatus in which an electronic component is mounted on the circuit board.
[Solution] A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12b is smaller than the average grain size in the second region 12b.

Abstract translation: 本发明提供一种具有良好的散热特性的电路板，其能够基于电子部件的操作迅速地消散由金属布线层产生的热量，并且具有高的可靠性，能够长期使用，从而提高第 陶瓷烧结体和金属布线层，并且由此在电子部件的操作和不操作被重复时由于冷却/加热循环而减少金属布线层的剥离;以及电子装置，其中安装电子部件 在电路板上。 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主面接触的第一区域12a， 包含位于第一区域12a上并且不含有玻璃成分的玻璃成分和第二区域12b，第一区域12a的厚度为金属布线的厚度的35％以上且70％以下 层12，第一区域12b的平均粒径小于第二区域12b的平均粒径。

公开(公告)号：EP2234466A4

公开(公告)日：2013-07-10

申请号：EP08865333

申请日：2008-12-24

Applicant: FUJIKURA LTD

Inventor： SAGAWA TOMOHARU ,  KUME ATSUSHI

IPC: H05K3/34 ,  H05K1/09 ,  H05K1/11 ,  H05K3/24 ,  H05K3/30

CPC classification number: H05K3/3442 ,  H05K1/095 ,  H05K1/111 ,  H05K3/247 ,  H05K3/305 ,  H05K2201/035 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A mounting board of the invention includes: an insulative base; a plurality of first conductive elements provided on the insulative base and having lands; a plurality of second conductive elements disposed on the lands; a plurality of solder pieces each disposed on each of the second conductive elements; and an electronic component which includes electrode sections each contacting each of the solder pieces, wherein the first conductive elements are made from a first element that contains at least silver; the second conductive elements are made from a second element that contains at least copper; and the solder pieces are made from a third element that contains at least tin.

公开(公告)号：EP2009968A4

公开(公告)日：2012-12-05

申请号：EP08720606

申请日：2008-03-26

Applicant: PANASONIC CORP

Inventor： ASAHI TOSHIYUKI ,  SHIMASAKI YUKIHIRO ,  ECHIGO FUMIO

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/202 ,  H05K3/28 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/035 ,  H01L2224/0401

Abstract: A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength » = 0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component.

公开(公告)号：EP2023697A4

公开(公告)日：2012-11-14

申请号：EP07744278

申请日：2007-05-28

Applicant: FUJIKURA LTD

Inventor： HIRATA SHUZO ,  ONO AKINOBU

IPC: H05K1/11 ,  H01R12/50

CPC classification number: H05K1/117 ,  H05K1/095 ,  H05K3/247 ,  H05K3/28 ,  H05K2201/035 ,  H05K2201/0769 ,  H05K2201/09436 ,  H05K2201/09709

公开(公告)号：EP1377141B1

公开(公告)日：2011-11-30

申请号：EP03014334.1

申请日：2003-06-26

Applicant: NEC TOPPAN CIRCUIT SOLUTIONS, INC. ,  NEC TOKIN Corporation

Inventor： Nakamura, Hirofumi ,  Arai, Satoshi

IPC: H05K1/16 ,  H01L23/64

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/642 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K1/162 ,  H05K3/382 ,  H05K2201/0329 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2203/0315 ,  Y10T428/24917 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/0401

公开(公告)号：EP2099068A4

公开(公告)日：2011-01-26

申请号：EP07851092

申请日：2007-12-21

Applicant: TOKUYAMA CORP

Inventor： YAMAMOTO YASUYUKI ,  MAEDA MASAKATSU ,  YATABE OSAMU

IPC: H01L23/12 ,  C04B35/581 ,  H01B5/14 ,  H01L23/15

CPC classification number: H05K3/38 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  H01L21/4867 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/248 ,  H05K2201/0347 ,  H05K2201/035 ,  Y10T428/12576 ,  C04B35/581 ,  C04B41/4517 ,  C04B41/4539 ,  C04B41/5133 ,  C04B41/4541 ,  C04B41/5144 ,  C04B41/5127 ,  C04B41/522 ,  C04B41/5116 ,  H01L2924/00

公开(公告)号：EP0804056B1

公开(公告)日：2009-06-17

申请号：EP97106924.0

申请日：1997-04-25

Applicant: NGK Spark Plug Co. Ltd.

Inventor： Yamasaki, Kozo, c/o NGK Spark Plug Co.,Ltd ,  Saiki, Hajime, c/o NGK Spark Plug Co.,Ltd

IPC: H05K3/34 ,  H01R43/02

CPC classification number: H01R12/52 ,  H01R43/0235 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/035 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49149 ,  Y10T29/49165

公开(公告)号：EP2001069A2

公开(公告)日：2008-12-10

申请号：EP08251797.0

申请日：2008-05-23

Applicant: Nitto Denko Corporation

Inventor： Yamazaki, Taiki, c/o Nitto Denko Corporation ,  Sueyoshi, Taiki, c/o Nitto Denko Corporation

IPC: H01M8/02

CPC classification number: H05K3/249 ,  H01M8/0206 ,  H01M8/0221 ,  H01M8/0228 ,  H01M8/04201 ,  H01M8/1011 ,  H01M8/1097 ,  H05K1/0272 ,  H05K1/16 ,  H05K3/06 ,  H05K2201/035 ,  H05K2201/056 ,  Y02E60/523

Abstract: An FPC board includes a base insulating layer made of polyimide, for example. A conductor layer made of copper, for example, is formed on one surface of the base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and extraction conductor portions extending in long-sized shapes from the collector portions. A coating layer is formed on the base insulating layer so as to coat the conductor layer. The coating layer is formed so as to coat the collector portions and the extraction conductor portions of the conductor layer. The coating layer is made of a resin composition containing carbon.

Abstract translation: FPC基板包括例如由聚酰亚胺制成的基底绝缘层。 例如，由铜制成的导体层形成在基底绝缘层的一个表面上。 导体层由一对矩形集电器部分和从集电部分延伸成长尺寸形状的引出导体部分组成。 在基底绝缘层上形成涂层以涂覆导体层。 涂层形成为涂覆导体层的集电体部分和引出导体部分。 涂层由含有碳的树脂组合物制成。

公开(公告)号：EP1364220A4

公开(公告)日：2007-06-27

申请号：EP02709401

申请日：2002-02-07

Applicant: INTERLINK ELECTRONICS INC

Inventor： BAKER JEFFREY R ,  SANCHEZ CARLOS S

IPC: G01R27/08 ,  G01L1/20 ,  H01H13/702 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/16 ,  H05K3/24 ,  H05K3/30 ,  H05K3/36

CPC classification number: H01H13/702 ,  G01L1/20 ,  G01L1/205 ,  H01H2201/036 ,  H01H2203/02 ,  H01H2239/01 ,  H05K1/0268 ,  H05K1/11 ,  H05K1/141 ,  H05K1/167 ,  H05K3/249 ,  H05K3/305 ,  H05K3/365 ,  H05K2201/035 ,  H05K2201/09663 ,  H05K2201/10151 ,  H05K2201/2036 ,  H05K2203/0278 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: The cost and complexity of an electronic pressure sensitive transducer (20) are decreased by constructing such a transducer directly on a printed circuit board (22) containing support electronics. Conductive traces (24) are formed on the printed circuit board (22) to define a contact area (26). A flexible substrate (28) having an inner surface is positioned over the contact area (26). An adhesive spacer (34), substantially surrounding the contact area (26), attaches the flexible substrate to the printed circuit board (22). At least one resistive layer (32) is deposited on the flexible substrate (28) inner surface. In use, the resistive layer (32) contacts at least two conductive traces (24) in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.

公开(公告)号：EP1772876A2

公开(公告)日：2007-04-11

申请号：EP06018840.6

申请日：2006-09-08

Applicant: E.I. du Pont de Nemours and Company

Inventor： Akimoto, Hideki

IPC: H01C17/242

CPC classification number: H01C17/24 ,  H05K1/095 ,  H05K1/167 ,  H05K3/125 ,  H05K3/247 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2203/013 ,  H05K2203/0361 ,  H05K2203/171

Abstract: Described herein is a resistor (11) to which a trimming process is applied (hereinafter, also called a trimming resistor), a method for manufacturing a trimming resistor (11) and a circuit substrate (30a) using the trimming resistor (11).

Abstract translation: 这里描述的是施加微调处理的电阻器（11）（以下也称为微调电阻器），使用微调电阻器（11）制造微调电阻器（11）和电路基板（30a）的方法。