公开(公告)号：EP3248047A1

公开(公告)日：2017-11-29

申请号：EP16705319.8

申请日：2016-01-04

申请人： Microsoft Technology Licensing, LLC

发明人： NIKKHOO, Michael ,  HEIRICH, Doug ,  RICCOMINI, Roy ,  YE, Maosheng ,  BEERMAN, Michael ,  TAYLOR, Joseph, Daniel

IPC分类号： G02B27/01 ,  F28D15/00 ,  F28F21/00 ,  H05K7/20 ,  F28F3/02

CPC分类号： H05K7/20963 ,  F28D15/00 ,  F28D15/02 ,  F28D15/0241 ,  F28F3/02 ,  F28F3/08 ,  F28F21/00 ,  F28F21/02 ,  F28F21/08 ,  F28F21/085 ,  F28F2255/02 ,  G02B27/0176 ,  G02B2027/0178 ,  G06F1/163 ,  G06F1/1681 ,  G06F1/203 ,  G06F3/011 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2023/4068 ,  H05K1/0201 ,  H05K5/0226 ,  H05K7/20127 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20454

摘要： A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.

公开(公告)号：EP3247961A1

公开(公告)日：2017-11-29

申请号：EP16704086.4

申请日：2016-01-14

申请人： Microsoft Technology Licensing, LLC

发明人： NIKKHOO, Michael ,  HEIRICH, Doug ,  RICCOMINI, Roy ,  YE, Maosheng ,  BEERMAN, Michael ,  HODGE, Andrew

IPC分类号： F28D15/00 ,  G02B27/01 ,  H05K7/20 ,  F28F3/02 ,  F28F21/00

CPC分类号： H05K7/20963 ,  F28D15/00 ,  F28D15/02 ,  F28D15/0241 ,  F28F3/02 ,  F28F3/08 ,  F28F21/00 ,  F28F21/02 ,  F28F21/08 ,  F28F21/085 ,  F28F2255/02 ,  G02B27/0176 ,  G02B2027/0178 ,  G06F1/163 ,  G06F1/1681 ,  G06F1/203 ,  G06F3/011 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2023/4068 ,  H05K1/0201 ,  H05K5/0226 ,  H05K7/20127 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20454

摘要： A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.

公开(公告)号：EP3876023A1

公开(公告)日：2021-09-08

申请号：EP21169613.3

申请日：2016-01-04

申请人： Microsoft Technology Licensing, LLC

发明人： NIKKHOO, Michael ,  HEIRICH, Doug ,  RICCOMINI, Roy ,  YE, Maosheng ,  BEERMAN, Michael ,  TAYLOR, Joseph, Daniel

IPC分类号： G02B27/01

摘要： A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.

公开(公告)号：EP3927517A1

公开(公告)日：2021-12-29

申请号：EP20709961.5

申请日：2020-02-10

申请人： Microsoft Technology Licensing, LLC

发明人： YE, Maosheng ,  YANEZ, Javier ,  HOLLOWAY, Frank, C. ,  BEERMAN, Michael ,  RICCOMINI, Roy, Joseph

IPC分类号： B29C45/00 ,  G02B27/01 ,  G02C5/00 ,  G02C5/02 ,  B29L11/00 ,  B29K69/00 ,  B29C45/16 ,  B29L12/00 ,  G01S7/481