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    SYSTEMS AND METHODS FOR PASSIVE COOLING OF COMPONENTS WITHIN ELECTRICAL DEVICES
    5.
    发明授权
    SYSTEMS AND METHODS FOR PASSIVE COOLING OF COMPONENTS WITHIN ELECTRICAL DEVICES 有权
    用于被动冷却电子设备中的部件的系统和方法

    公开(公告)号：EP2961252B1

    公开(公告)日：2018-02-28

    申请号：EP15172718.7

    申请日：2015-06-18

    申请人： General Electric Company

    发明人： Tatta, Anthony Dominic ,  Vilagy, Jonathan ,  Peterson, Craig

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20409 ,  H05K7/20509 ,  H05K7/20545

    摘要： A system includes an electrical enclosure, a first electrical unit (12), a first electrical module (14), a first heat spreader (76), and a heat sink (44). The first electrical unit (12) is removably disposed within the electrical enclosure, and the first electrical unit (12) includes a first surface opposite to a second surface. The first electrical module is removably disposed within the first electrical unit (12), and the first electrical module is inserted into the first electrical unit (12) in a first direction (36) from the first surface to the second surface. The first heat spreader (76) is coupled to the first electrical module, and the first heat spreader (76) comprises a first tapered coupling. The heat sink (44) includes a second tapered coupling (102). The second tapered coupling (102) is couples with the first tapered coupling of the first heat spreader (76) to form a physical thermal connection that facilitates heat transfer between the first electrical module and the heat sink (44).

    POWER CONVERSION DEVICE AND VEHICLE CONTROL DEVICE
    7.
    发明公开
    POWER CONVERSION DEVICE AND VEHICLE CONTROL DEVICE 审中-公开
    新疆维吾尔自治区新疆维吾尔族自治区

    公开(公告)号：EP3163728A1

    公开(公告)日：2017-05-03

    申请号：EP15812308.3

    申请日：2015-01-14

    申请人： Kabushiki Kaisha Toshiba

    发明人： UCHIDA Toshiyuki ,  MAKINO Tomoyuki

    IPC分类号： H02M1/00 ,  B60L3/00 ,  B60L9/24 ,  H02M7/12 ,  H02M7/48

    CPC分类号： H05K7/20409 ,  B60L3/00 ,  B60L9/24 ,  B60L9/28 ,  B61C3/00 ,  B61C17/00 ,  H02M1/00 ,  H02M7/12 ,  H02M7/48 ,  H02P27/06 ,  H05K7/20918

    摘要： [Problem] To provide a power conversion device and a car control device capable of reducing the influence of heat generated in the devices.
    [Solving Means] A power conversion device according to an embodiment includes a converter unit including a plurality of semiconductor switching devices and configured to convert AC power to DC power, and an inverter unit disposed to be adjacent to the converter unit in a railroad car running direction and including a plurality of semiconductor switching devices, the inverter unit being configured to convert the DC power outputted from the converter unit to AC power. First radiation fins are attached to a surface of a first heat receiving plate opposite to a surface on which the semiconductor switching devices are attached, and second radiation fins are attached to a surface of a second heat receiving plate opposite to a surface on which the semiconductor switching devices are attached. The first radiation fins and the second radiation fins facing one another are attached to the first heat receiving plate and the second heat receiving plate so that recessed portions of the first radiation fins and recessed portions the second radiation fins are aligned with one another.

    摘要翻译： [问题]提供能够减少在装置中产生的热的影响的电力转换装置和汽车控制装置。 具体实施方式根据实施方式的电力变换装置包括：转换器单元，包括多个半导体开关器件，其被配置为将AC电力转换为DC电力;以及逆变器单元，其配置为与所述转换器单元相邻， 方向并且包括多个半导体开关装置，所述逆变器单元被配置为将从所述转换器单元输出的DC电力转换为AC电力。 第一辐射翅片附接到第一受热板的与安装有半导体开关装置的表面相对的表面，并且第二散热片附接到第二受热板的与半导体开关器件的表面相反的表面上 连接开关设备。 第一辐射翅片和第二辐射翅片彼此面对，附接到第一受热板和第二热接收板，使得第一辐射翅片的凹部和第二辐射翅片的凹部彼此对准。

    A capacitor module for a mobile working machine
    8.
    发明授权
    A capacitor module for a mobile working machine 有权
    Kondensatormodulfüreine mobile Arbeitsmaschine

    公开(公告)号：EP2990253B1

    公开(公告)日：2017-03-29

    申请号：EP14182266.8

    申请日：2014-08-26

    申请人： Visedo Oy

    发明人： Iskantius, Matti ,  Järveläinen, Tero ,  Piispanen, Mikko

    IPC分类号： B60L11/00 ,  H01G9/00 ,  H01G11/12 ,  H01G2/08

    CPC分类号： H05K7/20409 ,  B60K6/28 ,  B60L11/005 ,  B60Y2200/92 ,  B60Y2306/05 ,  H01G2/02 ,  H01G2/08 ,  H01G4/228 ,  H01G4/38 ,  H01G9/0003 ,  H01G11/12 ,  H01G11/74 ,  H01G11/78 ,  Y02E60/13 ,  Y02T10/7022 ,  Y10S903/907

    摘要： A capacitor module comprises at least one capacitor element (101) and a cooling structure (103) for cooling the capacitor element. The electrical terminals (102a, 102b) of the capacitor element are mechanically connected to the cooling structure to be in heat-conductive relations with the cooling structure so that at least one of the electrical terminals of the capacitor element is mechanically connected to the cooling structure via a flexible connection element (104a, 104b) made of electrically conductive material. The flexible connection element allows the corresponding electrical terminal to move with respect to the cooling structure when the distance (D) between the electrical terminals is changing because of changes in load and/or temperature, and/or because of ageing.

    摘要翻译： 电容器模块包括用于冷却电容器元件的至少一个电容器元件（101）和冷却结构（103）。 电容器元件的电端子（102a，102b）机械地连接到冷却结构以与冷却结构导热关系，使得电容器元件的至少一个电端子机械地连接到冷却结构 通过由导电材料制成的柔性连接元件（104a，104b）。 当电气端子之间的距离（D）由于负载和/或温度的变化和/或老化而变化时，柔性连接元件允许相应的电端子相对于冷却结构移动。

    ELECTRONIC TERMINAL DEVICE AND METHOD FOR ASSEMBLING SAME
    9.
    发明公开
    ELECTRONIC TERMINAL DEVICE AND METHOD FOR ASSEMBLING SAME 审中-公开
    VERFAHREN ZUR MONTAGE DAVON ELEKTRONISCHEENDGERÄTEVORRICHTUNG

    公开(公告)号：EP3119172A1

    公开(公告)日：2017-01-18

    申请号：EP15761980.0

    申请日：2015-03-06

    申请人： Kaneka Corporation

    发明人： KOUKAMI, Aki ,  NISHIURA, Koichi ,  NAKAGAKI, Takeshi

    IPC分类号： H05K9/00 ,  H05K7/20

    CPC分类号： G06F1/203 ,  G06F1/20 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/284 ,  H05K3/285 ,  H05K7/20409 ,  H05K7/20463 ,  H05K9/0024 ,  H05K2201/10371 ,  H05K2203/1316 ,  H05K2203/1322 ,  H01L2924/00

    摘要： The electronic terminal equipment comprising an electronic substrate on which a heat-generating electronic component is mounted and an electromagnetic shield member attached in proximity to the heat-generating electronic component, the electronic substrate being filled with a cured product of a thermally-conductive curable liquid resin between the electromagnetic shield member and the electronic substrate, and a thermally-conductive film being disposed in contact with an upper surface of the electromagnetic shield member or facing the upper surface thereof so as to diffuse heat that came up through the cured thermally-conductive curable liquid resin.

    摘要翻译： 该电子终端设备包括安装有发热电子部件的电子基板和安装在发热电子部件附近的电磁屏蔽部件，该电子基板填充有导热性固化液的固化物 电磁屏蔽构件和电子基板之间的树脂，以及设置成与电磁屏蔽构件的上表面接触或面向其上表面的导热膜，以便扩散通过固化的导热 可固化液体树脂。