THERMALLY CONDUCTIVE POLYMER COMPOSTIONS TO REDUCE MOLDING CYCLE TIME
    1.
    发明公开
    THERMALLY CONDUCTIVE POLYMER COMPOSTIONS TO REDUCE MOLDING CYCLE TIME 审中-公开
    热传导性聚合物组合物可降低成型周期

    公开(公告)号:EP2839507A1

    公开(公告)日:2015-02-25

    申请号:EP13777901.3

    申请日:2013-04-17

    Abstract: A thermally conductive polymer composition comprising (1) a polymer material, and (2) a thermally conductive filler. The thermally conductive filler can be boron nitride. The thermally conductive polymer composition can be used in a molding operation to form a molded article and can reduce the molding cycle time of a molding process. In one embodiment, increasing the thermal conductivity of a polymer material (as compared to the thermal conductivity of the material in the absence of a thermally conductive filler) increases the thermal diffusivity and reduces the cooling time of the article. The present invention also provides methods of forming molded articles from such compositions.

    Abstract translation: 一种导热聚合物组合物,其包含(1)聚合物材料和(2)导热填料。 导热填料可以是氮化硼。 导热聚合物组合物可以用于模塑操作中以形成模塑制品并且可以缩短模塑工艺的模塑周期时间。 在一个实施例中,增加聚合物材料的热导率(与不存在导热填料时的材料的导热率相比)增加了热扩散率并减少了制品的冷却时间。 本发明还提供了由这种组合物形成模制品的方法。

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