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1.发明公开Backpanel having multiple logic family signal layers 失效Rückwandplatinemit einer Vielzahl von Signalschichtenfürverschiedene Logikfamilien。
公开(公告)号：EP0414546A2
公开(公告)日：1991-02-27
申请号：EP90309266.6
申请日：1990-08-23
CPC分类号： G06F13/40 , H05K1/0216 , H05K1/0237 , H05K1/0298 , H05K9/0039 , H05K2201/0191 , H05K2201/0352 , H05K2201/044 , H05K2201/09236 , H05K2201/09327 , H05K2201/09727 , H05K2201/09972
摘要： A printed circuit board backpanel (100) uses strip-line construction to allow emitter coupled logic (ECL) signals and transistor-transistor logic (TTL) signals on the same signal layer, while providing electromagnetic interference (EMI) emission control. Disposed between ground layers (102,130), and separated bydielectric layers (104, 108, 112, 116, 120, 124, 128), are arranged signal layers (106, 114, 118, 126) and power layers (110, 122).
摘要翻译： 印刷电路板背板（100）使用带状线结构，在同一信号层上允许发射极耦合逻辑（ECL）信号和晶体管晶体管逻辑（TTL）信号，同时提供电磁干扰（EMI）发射控制。 布置在接地层（102,130）和分隔开的电介质层（104,108,112,116,120,124,128）之间的信号层（106,114,118,126）和功率层（110,122）被布置。
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公开(公告)号：EP0414546A3
公开(公告)日：1991-11-06
申请号：EP90309266.6
申请日：1990-08-23
CPC分类号： G06F13/40 , H05K1/0216 , H05K1/0237 , H05K1/0298 , H05K9/0039 , H05K2201/0191 , H05K2201/0352 , H05K2201/044 , H05K2201/09236 , H05K2201/09327 , H05K2201/09727 , H05K2201/09972
摘要： A printed circuit board backpanel (100) uses strip-line construction to allow emitter coupled logic (ECL) signals and transistor-transistor logic (TTL) signals on the same signal layer, while providing electromagnetic interference (EMI) emission control. Disposed between ground layers (102,130), and separated bydielectric layers (104, 108, 112, 116, 120, 124, 128), are arranged signal layers (106, 114, 118, 126) and power layers (110, 122).
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