摘要:
A semiconductor device (100) is provided with an undoped GaN electron transport layer (105); an AlGaN electron supply layer (106) arranged in contact with the undoped GaN electron transport layer (105); an undoped GaN layer (107) arranged on the AlGaN electron supply layer (106); a source electrode (101) and a drain electrode (103) arranged on the undoped GaN layer (107), being separated from one another; a recessed section (111), which is arranged in a region between the source electrode (101) and the drain electrode (103) and penetrating the undoped GaN layer (107); a gate electrode (102) which is embedded in the recessed section (111) and being brought into contact with the AlGaN electron supply layer (106) at the bottom plane; and a SiN film (108) arranged on the undoped GaN layer (107) in the region between the gate electrode (102) and the drain electrode (103).
摘要:
In a group III nitride-type field effect transistor, the present invention reduces a leak current component by conduction of residual carriers in a buffer layer, and achieves improvement in a break-down voltage, and enhances a carrier confinement effect (carrier confinement) of a channel to improve pinch-off characteristics (to suppress a short channel effect). For example, when applying the present invention to a GaN-type field effect transistor, besides GaN of a channel layer, a composition-modulated (composition-gradient) AlGaN layer in which aluminum composition reduces toward a top gradually or stepwise is used as a buffer layer (hetero buffer). To gate length Lg of a FET to be prepared, a sum a of layer thicknesses of an electron supply layer and a channel layer is selected so as to fulfill Lg/a ‰¥ 5, and in such a case, the layer thickness of the channel layer is selected in a range of not exceeding 5 times (about 500 A) as long as a de Broglie wavelength of two-dimensional electron gas accumulated in the channel layer in room temperature.