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1.发明公开Protecting device for protecting an electronic equipment in order to use the electronic equipment under a hostile environment 失效用于保护电子设备，以确保在外部影响使用这种电子设备的保护装置。
公开(公告)号：EP0677886A2
公开(公告)日：1995-10-18
申请号：EP95105523.5
申请日：1995-04-12
Applicant: NEC CORPORATION
Inventor： Kosugi, Yuhei, c/o NEC Corporation
Abstract: A protecting device is for use in protecting a radio communication device (15) under high and low temperature. The protecting device comprises a cover member (31) of a heat insulator that defines a room therein. The radio communication device is located in the room. First and second opening portions (31a, 31b) are formed at the cover member. The first opening portion may be opposite to the second opening portion. Each of the first and the second opening portions has a predetermined opening area. The protecting device further comprises first and second damper members (32a, 32b) and has first and second driving sections (33a, 33b, 34a, 34b). The first driving section drives the first damper member in accordance with a room temperature to make the first damper member vary the predetermined opening area into a variable opening area in the first opening portion. The variable opening area is smaller than the predetermined opening area. Similarly, the second driving section drives the second damper member in accordance with the room temperature to make the second damper member vary the predetermined opening area into the variable opening area in the second opening area.
Abstract translation: 所述的保护装置是用于在高温和低温下保护的无线电通信设备（15）使用。 该保护装置包括一个热绝缘体的盖构件（31）那样定义的房间在其中。 的无线通信装置位于室内。 第一以及第二开口部（31A，31B）在盖构件上形成。 第一开口部分可以是相对于第二开口部。 每个第一和第二开口部分的具有预定的开口面积。 该装置保护还包括第一和第二调节部件（32A，32B）和具有第一和第二驱动部（33A，33B，34A，34B）。 所述第一驱动部驱动在雅舞蹈第一阻尼器构件与室温到使第一调节部件改变所述予定开口区到第一开口部分的可变开口区。 所述可变开口区小于预定开口面积小。 类似地，第二驱动部驱动与室温雅舞蹈第二阻尼器构件以使所述第二减震构件改变所述予定开口区到第二开口面积可变开口区。
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Patent Agency Ranking2.发明公开Protecting device for protecting an electronic equipment in order to use the electronic equipment under a hostile environment 失效用于保护电子设备，以确保在外部影响使用这种电子设备的保护装置。
公开(公告)号：EP0677886A3
公开(公告)日：1997-01-29
申请号：EP95105523.5
申请日：1995-04-12
Applicant: NEC CORPORATION
Inventor： Kosugi, Yuhei, c/o NEC Corporation
Abstract: A protecting device is for use in protecting a radio communication device (15) under high and low temperature. The protecting device comprises a cover member (31) of a heat insulator that defines a room therein. The radio communication device is located in the room. First and second opening portions (31a, 31b) are formed at the cover member. The first opening portion may be opposite to the second opening portion. Each of the first and the second opening portions has a predetermined opening area. The protecting device further comprises first and second damper members (32a, 32b) and has first and second driving sections (33a, 33b, 34a, 34b). The first driving section drives the first damper member in accordance with a room temperature to make the first damper member vary the predetermined opening area into a variable opening area in the first opening portion. The variable opening area is smaller than the predetermined opening area. Similarly, the second driving section drives the second damper member in accordance with the room temperature to make the second damper member vary the predetermined opening area into the variable opening area in the second opening area.
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公开(公告)号：EP0595346B1
公开(公告)日：1999-01-07
申请号：EP93117582.2
申请日：1993-10-29
Applicant: NEC CORPORATION
Inventor： Kosugi, Yuhei, c/o NEC Corporation , Yamamoto, Osamu, c/o NEC Corporation , Izumi, Hiroaki, c/o NEC Corporation , Kusamitsu, Hideki, c/o NEC Corporation , Omagari, Shin-ichi, c/o NEC Corporation , Watanabe, Hideo, c/o NEC Corporation , Minowa, Yoshio, c/o NEC Corporation
CPC classification number: H01P1/00 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/49111 , H01L2924/00014 , H01L2924/01014 , H01L2924/01068 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01P5/107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
Abstract: A composite microwave circuit module assembly (80) has a dielectric substrate (20) which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface (40) and an upper ground surface (43), respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes (50) filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface (43) and the lower ground surface (40) so as to shield the radio frequency signal circuit. An element mounting cavity (60) is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member (33). A connection terminal (91) connected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure (81) having a contact member resiliently urged to said connection terminal.
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4.发明授权
公开(公告)号：EP0517276B1
公开(公告)日：1995-11-29
申请号：EP92109658.2
申请日：1992-06-09
Applicant: NEC CORPORATION
Inventor： Kosugi, Yuhei, c/o NEC Corporation
CPC classification number: H05K7/1061 , H01P1/04 , H01R12/714
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5.发明公开Composite microwave module assembly and its connection structure 失效Modulare Mikrowellen-Anordnungseinheit und seine Verbindungsstruktur。
公开(公告)号：EP0595346A1
公开(公告)日：1994-05-04
申请号：EP93117582.2
申请日：1993-10-29
Applicant: NEC CORPORATION
Inventor： Kosugi, Yuhei, c/o NEC Corporation , Yamamoto, Osamu, c/o NEC Corporation , Izumi, Hiroaki, c/o NEC Corporation , Kusamitsu, Hideki, c/o NEC Corporation , Omagari, Shin-ichi, c/o NEC Corporation , Watanabe, Hideo, c/o NEC Corporation , Minowa, Yoshio, c/o NEC Corporation
CPC classification number: H01P1/00 , H01L23/552 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48227 , H01L2224/49111 , H01L2924/00014 , H01L2924/01014 , H01L2924/01068 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/16195 , H01L2924/19041 , H01L2924/3011 , H01L2924/3025 , H01P5/107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
Abstract: A composite microwave circuit module assembly (80) has a dielectric substrate (20) which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface (40) and an upper ground surface (43), respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes (50) filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface (43) and the lower ground surface (40) so as to shield the radio frequency signal circuit. An element mounting cavity (60) is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member (33). A connection terminal (91) connected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure (81) having a contact member resiliently urged to said connection terminal.
Abstract translation: 复合微波电路模块组件（80）具有由下层，中间层和上层形成的电介质基板（20）。 下层和上层分别包括下地面（40）和上地面（43），中间层包括由有源电路元件和无源电路元件形成的射频信号电路。 沿着射频信号电路布置有多个填充有金属的通孔（50），以使上地表面（43）和下接地表面（40）短路以屏蔽射频信号电路。 元件安装腔（60）设置在中间层上，其中中间层上方的电介质部分被去除，并且有源电路元件安装在空腔中的元件安装台面上。 腔被导体板构件（33）覆盖。 与该射频信号电路连接的连接端子（91）设置在电介质基板的表面，而不会从其表面突出，并通过具有弹性的接触部件的微波电路连接结构（81）从外部进行外部电连接 呼吁说连接终端。
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6.发明公开Microwave connector assembly connected easily to microwave circuit components 失效Mikrowellenverbinderanordnung mit einfachem Anschluss a Mikrowellenschaltelemente。
公开(公告)号：EP0517276A1
公开(公告)日：1992-12-09
申请号：EP92109658.2
申请日：1992-06-09
Applicant: NEC CORPORATION
Inventor： Kosugi, Yuhei, c/o NEC Corporation
CPC classification number: H05K7/1061 , H01P1/04 , H01R12/714
Abstract: A microwave circuit component (40) has terminals and is mounted on a principal surface (38) of a substrate (34) received in a cavity (45) of a housing (35) with a back surface (39) brought into contact with a bottom surface (44) of the cavity. With a part projected outwardly of the cavity for connection to an external conductor, a contact pin (36) is movably received in an insulator support member (37) placed in the cavity and is urged to one of the terminals. It is possible to bring the principal surface into contact with the bottom surface. In this event, the contact pin may be urged to the back surface with the terminal extended from the principal surface to the back surface.
Abstract translation: 微波电路部件（40）具有端子并且安装在容纳在壳体（35）的空腔（45）中的基板（34）的主表面（38）上，其中背面（39）与壳体 空腔的底面（44）。 通过向外突出的部分，用于连接到外部导体，接触销（36）可移动地容纳在放置在空腔中的绝缘体支撑构件（37）中并且被推动到其中一个端子。 可以使主面与底面接触。 在这种情况下，接触销可以被推到背面，端子从主表面延伸到后表面。
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