公开(公告)号：EP0661771A3

公开(公告)日：1996-06-05

申请号：EP94120745.8

申请日：1994-12-27

Applicant: NEC CORPORATION

Inventor： Suzuki, Takuya, c/o NEC Corporation ,  Minowa, Yoshio, c/o NEC Corporation

IPC: H01P1/213

CPC classification number: H01P1/2138

Abstract: A branching filter for a transmitter-receiver which is used in a microwave band comprising an orthogonal-mode transducer (waveguide branching filter), a reception filter comprising a band-eliminating filter 4 which is connected to the extension of the center axis of the waveguide of the orthogonal-mode transducer, and a transmission filter comprising a high pass filter containing a cut off waveguide which is directly and orthogonally connected to the orthogonal-mode transducer. The parts of the branching filter for the transmitter-receiver are integrally manufactured as one body by a lost wax process. Therefore, the branching filter for the transmitter-receiver can be manufactured as compact-size one body having no patch or linking portion.

公开(公告)号：EP0595346B1

公开(公告)日：1999-01-07

申请号：EP93117582.2

申请日：1993-10-29

Applicant: NEC CORPORATION

Inventor： Kosugi, Yuhei, c/o NEC Corporation ,  Yamamoto, Osamu, c/o NEC Corporation ,  Izumi, Hiroaki, c/o NEC Corporation ,  Kusamitsu, Hideki, c/o NEC Corporation ,  Omagari, Shin-ichi, c/o NEC Corporation ,  Watanabe, Hideo, c/o NEC Corporation ,  Minowa, Yoshio, c/o NEC Corporation

IPC: H01P1/00 ,  H01P5/107

CPC classification number: H01P1/00 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P5/107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A composite microwave circuit module assembly (80) has a dielectric substrate (20) which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface (40) and an upper ground surface (43), respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes (50) filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface (43) and the lower ground surface (40) so as to shield the radio frequency signal circuit. An element mounting cavity (60) is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member (33). A connection terminal (91) connected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure (81) having a contact member resiliently urged to said connection terminal.

公开(公告)号：EP0595346A1

公开(公告)日：1994-05-04

申请号：EP93117582.2

申请日：1993-10-29

Applicant: NEC CORPORATION

Inventor： Kosugi, Yuhei, c/o NEC Corporation ,  Yamamoto, Osamu, c/o NEC Corporation ,  Izumi, Hiroaki, c/o NEC Corporation ,  Kusamitsu, Hideki, c/o NEC Corporation ,  Omagari, Shin-ichi, c/o NEC Corporation ,  Watanabe, Hideo, c/o NEC Corporation ,  Minowa, Yoshio, c/o NEC Corporation

IPC: H01P1/00 ,  H01P5/107

CPC classification number: H01P1/00 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P5/107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A composite microwave circuit module assembly (80) has a dielectric substrate (20) which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface (40) and an upper ground surface (43), respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes (50) filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface (43) and the lower ground surface (40) so as to shield the radio frequency signal circuit. An element mounting cavity (60) is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member (33). A connection terminal (91) connected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure (81) having a contact member resiliently urged to said connection terminal.

Abstract translation: 复合微波电路模块组件（80）具有由下层，中间层和上层形成的电介质基板（20）。 下层和上层分别包括下地面（40）和上地面（43），中间层包括由有源电路元件和无源电路元件形成的射频信号电路。 沿着射频信号电路布置有多个填充有金属的通孔（50），以使上地表面（43）和下接地表面（40）短路以屏蔽射频信号电路。 元件安装腔（60）设置在中间层上，其中中间层上方的电介质部分被去除，并且有源电路元件安装在空腔中的元件安装台面上。 腔被导体板构件（33）覆盖。 与该射频信号电路连接的连接端子（91）设置在电介质基板的表面，而不会从其表面突出，并通过具有弹性的接触部件的微波电路连接结构（81）从外部进行外部电连接 呼吁说连接终端。

公开(公告)号：EP0661771B1

公开(公告)日：2002-06-26

申请号：EP94120745.8

申请日：1994-12-27

Applicant: NEC CORPORATION

Inventor： Suzuki, Takuya, c/o NEC Corporation ,  Minowa, Yoshio, c/o NEC Corporation

IPC: H01P1/213

CPC classification number: H01P1/2138

公开(公告)号：EP0661771A2

公开(公告)日：1995-07-05

申请号：EP94120745.8

申请日：1994-12-27

Applicant: NEC CORPORATION

Inventor： Suzuki, Takuya, c/o NEC Corporation ,  Minowa, Yoshio, c/o NEC Corporation

IPC: H01P1/213

CPC classification number: H01P1/2138

Abstract: A branching filter for a transmitter-receiver which is used in a microwave band comprising an orthogonal-mode transducer (waveguide branching filter), a reception filter comprising a band-eliminating filter 4 which is connected to the extension of the center axis of the waveguide of the orthogonal-mode transducer, and a transmission filter comprising a high pass filter containing a cut off waveguide which is directly and orthogonally connected to the orthogonal-mode transducer. The parts of the branching filter for the transmitter-receiver are integrally manufactured as one body by a lost wax process. Therefore, the branching filter for the transmitter-receiver can be manufactured as compact-size one body having no patch or linking portion.

Abstract translation: 一种在包括正交模式换能器（波导分路滤波器）的微波频带中使用的发射机 - 接收机的分路滤波器，包括与波导的中心轴的延伸连接的带除滤波器4的接收滤波器 以及包括直接和正交连接到正交模式换能器的截止波导的高通滤波器的发送滤波器。 用于发射机 - 接收机的分路滤波器的部件通过失蜡处理被整体制造为一体。 因此，用于发射机 - 接收机的分路滤波器可以制造成没有贴片或连接部分的紧凑型一体。