公开(公告)号：EP2149152A1

公开(公告)日：2010-02-03

申请号：EP08747007.6

申请日：2008-04-28

Applicant: ViaSat, Inc.

Inventor： WOODS, Charles E.

IPC: H01L23/552 ,  H01L23/66 ,  H01Q17/00 ,  H05K9/00 ,  H01P1/162

CPC classification number: H01L23/552 ,  H01L23/66 ,  H01L2924/0002 ,  H01P1/00 ,  H01P1/162 ,  H01Q17/008 ,  H05K9/0056 ,  H05K9/006 ,  H01L2924/00

Abstract: An exemplary embodiment of the present invention comprises a radio frequency absorber that is operative for absorbing electromagnetic energy, scattering electromagnetic signals, and/or attenuating electromagnetic signals. In accordance with certain aspects of the invention, the radio frequency absorber is substantially flat and comprises an absorbing surface. The absorbing surface is operative to absorb electromagnetic energy, scatter electromagnetic signals, and/or attenuate electromagnetic signals. In exemplary embodiments of the invention, the radio frequency absorber comprises a plurality of holes disposed within the radio frequency absorber. The radio frequency absorber, according to various embodiments of the present invention, is configured to reduce cavity oscillations and/or cavity modes and resonances within an integrated circuit device, such as a device that houses a monolithic microwave integrated circuit.

公开(公告)号：EP1342284A1

公开(公告)日：2003-09-10

申请号：EP01270918.4

申请日：2001-11-14

Applicant: Thomson Licensing S.A.

Inventor： HAQUET, Gérard ,  GUGUEN, Charline ,  NICOLAS, Corinne

IPC: H01P1/00 ,  H05K3/00

CPC classification number: H05K3/0061 ,  H01P1/00 ,  H05K1/0237 ,  H05K3/321 ,  H05K2203/0545 ,  Y10T156/1092

Abstract: The present invention relates to a process for securing to a metal support at least one microwave electronic module made on a substrate one of whose faces forms an earth plane. The process consists in depositing between the face forming the earth plane and the metal support, at least one strip of conducting adhesive (12',14',19',20') at the level of the zones of breakage of the earth plane. The invention applies to the microwave field.

公开(公告)号：EP0595346A1

公开(公告)日：1994-05-04

申请号：EP93117582.2

申请日：1993-10-29

Applicant: NEC CORPORATION

Inventor： Kosugi, Yuhei, c/o NEC Corporation ,  Yamamoto, Osamu, c/o NEC Corporation ,  Izumi, Hiroaki, c/o NEC Corporation ,  Kusamitsu, Hideki, c/o NEC Corporation ,  Omagari, Shin-ichi, c/o NEC Corporation ,  Watanabe, Hideo, c/o NEC Corporation ,  Minowa, Yoshio, c/o NEC Corporation

IPC: H01P1/00 ,  H01P5/107

CPC classification number: H01P1/00 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P5/107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A composite microwave circuit module assembly (80) has a dielectric substrate (20) which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface (40) and an upper ground surface (43), respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes (50) filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface (43) and the lower ground surface (40) so as to shield the radio frequency signal circuit. An element mounting cavity (60) is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member (33). A connection terminal (91) connected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure (81) having a contact member resiliently urged to said connection terminal.

Abstract translation: 复合微波电路模块组件（80）具有由下层，中间层和上层形成的电介质基板（20）。 下层和上层分别包括下地面（40）和上地面（43），中间层包括由有源电路元件和无源电路元件形成的射频信号电路。 沿着射频信号电路布置有多个填充有金属的通孔（50），以使上地表面（43）和下接地表面（40）短路以屏蔽射频信号电路。 元件安装腔（60）设置在中间层上，其中中间层上方的电介质部分被去除，并且有源电路元件安装在空腔中的元件安装台面上。 腔被导体板构件（33）覆盖。 与该射频信号电路连接的连接端子（91）设置在电介质基板的表面，而不会从其表面突出，并通过具有弹性的接触部件的微波电路连接结构（81）从外部进行外部电连接 呼吁说连接终端。

公开(公告)号：EP0359336A2

公开(公告)日：1990-03-21

申请号：EP89202301.1

申请日：1989-09-13

Applicant: Philips Patentverwaltung GmbH ,  Philips Electronics N.V.

Inventor： Gärtner, Georg, Dr.

IPC: H01P1/30 ,  H01P1/00

CPC classification number: H01P1/00 ,  H01P1/30

Abstract: Die Mikrowellenübertragung zwischen Hohlleiterbereichen (a, b) verschiedenen Innengasdrucks und/oder unterschiedlicher Füllgaszusammensetzung, d.h. das Ein-oder Auskoppeln von Mikrowellen von einem derartigen Hohlleiterbereich in einen anderen, wird dadurch verbessert, daß zwischen den Hohlleiterbereichen mindestens eine Pumpstufe (6, 7, 8, 9) angeordnet ist. Der Hohlleiter (1) ist vorzugsweise über die Mikrowellenleistung praktisch nicht auskoppelnde Schlitze (2, 3, 4, 5) mit den Pumpstufen verbunden.

Abstract translation: 当不同的内部气体压力和/或不同的填充气体组成的中空导体区域（a，b）之间的微波传输（即，从一个这样的中空导体区域到另一个中的耦合进入或离开微波）在至少一个泵级 （6,7,8,9）设置在中空导体区域之间。 中空导体（1）优选地通过几乎不耦合出微波功率的插槽（2,3,4,5）连接到泵级。 ... ...

公开(公告)号：EP0078486A1

公开(公告)日：1983-05-11

申请号：EP82109872.0

申请日：1982-10-26

Applicant: ALCATEL

Inventor： Boujet, Jean-Pierre ,  Gaille, Gérard ,  Jousselin, Charles

IPC: H01P1/208 ,  H01P1/30 ,  H01P1/00

CPC classification number: H01P1/208 ,  H01P1/00

Abstract: Selon l'invention, les cavités résonnantes (5) du filtre sont accordées chacune au moyen d'une tige d'accord (10) en matériau stable en température dont une extrémité débouche dans la cavité concernée, sans contact avec ses parois, et dont la seconde extrémité est bloquée, à distance de la cavité dans le corps (1-2) du filtre présentant en correspondance, au niveau de cette seconde extrémité, un alésage (13) sensiblement de même diamètre que la tige d'accord. Le blocage est assuré par une paire de vis (15) dont les tiges sont libres dans le corps du filtre d'un côté d'une fente longitudinale (21) coupant l'alésage et sont ancrées dans le corps du filtre de l'autre côté de la fente.

公开(公告)号：EP3286844A1

公开(公告)日：2018-02-28

申请号：EP16721537

申请日：2016-04-07

Applicant: AT & T IP I LP

Inventor： HENRY PAUL SHALA ,  BENNETT ROBERT ,  GERSZBERG IRWIN ,  BARZEGAR FARHAD ,  BARNICKEL DONALD J ,  WILLIS III THOMAS M

IPC: H04B3/54 ,  H04B3/56

CPC classification number: H04B5/0018 ,  G01R31/00 ,  H01P1/00 ,  H02J13/00 ,  H02J13/0031 ,  H02J50/05 ,  H02J50/10 ,  H04B3/52 ,  H04B3/56 ,  H04B5/0012 ,  H04B5/0075 ,  H04L25/028 ,  H04L25/0292

Abstract: Aspects of the subject disclosure may include, for example, a coupling device includes a circuit that receives a signal. At least one passive electrical circuit element generates an electromagnetic field in response to the signal. A portion of the electromagnetic field is guided by a surface of a transmission medium to propagate as a guided electromagnetic wave longitudinally along the transmission medium. Other embodiments are disclosed.

公开(公告)号：EP1311770A1

公开(公告)日：2003-05-21

申请号：EP01948184.5

申请日：2001-07-09

Applicant: Allgon AB

Inventor： HARALDSSON, Tony ,  ÖSTIN, Joakim ,  LÖWENBORG, Claes-Göran

IPC: F16B39/284 ,  H01P1/208

CPC classification number: F16B39/284 ,  H01P1/00 ,  H01P7/04 ,  H03J1/00

Abstract: The present invention relates to a tuning screw assembly comprising a sleeve (100) with internal threads for engaging a tuning screw (200) having external threads. The sleeve comprises a first threaded portion (32) which is axially displaced in relation to a second threaded portion (34) for frictionally locking said screw body in said sleeve. The invention also relates to a method of manufacturing said friction locking sleeve and to a resonator comprising said friction locking sleeve.

公开(公告)号：EP0595346B1

公开(公告)日：1999-01-07

申请号：EP93117582.2

申请日：1993-10-29

Applicant: NEC CORPORATION

Inventor： Kosugi, Yuhei, c/o NEC Corporation ,  Yamamoto, Osamu, c/o NEC Corporation ,  Izumi, Hiroaki, c/o NEC Corporation ,  Kusamitsu, Hideki, c/o NEC Corporation ,  Omagari, Shin-ichi, c/o NEC Corporation ,  Watanabe, Hideo, c/o NEC Corporation ,  Minowa, Yoshio, c/o NEC Corporation

IPC: H01P1/00 ,  H01P5/107

CPC classification number: H01P1/00 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P5/107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A composite microwave circuit module assembly (80) has a dielectric substrate (20) which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface (40) and an upper ground surface (43), respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes (50) filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface (43) and the lower ground surface (40) so as to shield the radio frequency signal circuit. An element mounting cavity (60) is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member (33). A connection terminal (91) connected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure (81) having a contact member resiliently urged to said connection terminal.

公开(公告)号：EP0525378A2

公开(公告)日：1993-02-03

申请号：EP92110530.0

申请日：1992-06-23

Applicant: ROBERT BOSCH GMBH

Inventor： Beis, Konstantin, Dipl.-Ing. ,  Meseck, Horst

IPC: H01P1/00 ,  F16B39/38

CPC classification number: H01P1/00

Abstract: 2.1 Es soll eine selbsthemmende, gegen Schraubkräfte sehr robuste Abgleichschraube angegeben werden.
2.2 Die Abgleichschraube ist im Bereich ihres Außengewindes (1) so geschlitzt, daß sich dadurch eine gegenseitige Verschiebung der ober- und unterhalb der Schlitze (8) liegenden Gewindegänge (4, 5) in Richtung der Schraubenlängsachse einstellt. In die Abgleichschraube ist als Eingriff für einen Schraubendreher eine Mehrkantvertiefung (6) eingelassen, die sich sowohl im Bereich der oberhalb als auch im Bereich der unterhalb der Schlitze (8) liegenden Gewindegänge (4, 5) erstreckt.

Abstract translation: 2.1规定了一个自锁调节螺钉，对螺丝拧紧力非常强大。 2.2调节螺钉在其外螺纹（1）的区域中开槽，使得位于槽（8）上方和下方的螺距（4,5）的相互位移提供螺杆纵向轴线的调节。 一个多边凹陷（6）被并入用于螺丝起子的调节螺钉中，该凹槽在位于槽（8）下方的螺距（4,5）的上方和下方的区域中都延伸。

公开(公告)号：EP0273825B1

公开(公告)日：1992-04-08

申请号：EP87402913.5

申请日：1987-12-18

Applicant: THOMSON COMPOSANTS MICROONDES

Inventor： Bitoune, Sylviane ,  Geffroy, Dominique ,  Grossier, François ,  Le Creff, Maurice ,  Ralala, Gérard

IPC: G01R31/28 ,  G01R1/24 ,  H01P1/00

CPC classification number: H01P1/00 ,  G01R1/24 ,  G01R31/2822