摘要:
An object of the present invention is to provide a semiconductor light-emitting device that reduces dislocation density and has a high light emission efficiency. A semiconductor light-emitting device 20 has an underlayer 13 made of nitride semiconductor containing Al and a dislocation density of 10 11 /cm 2 or less. The device further has an n-type conductive layer 14 and p-type conductive layer 17 each composed of nitride semiconductor having an Al content smaller than that of the nitride semiconductor constituting the underlayer and having a dislocation density of 1×10 10 /cm 2 or less. The device still further has a light emitting layer 15 composed of nitride semiconductor having an Al content smaller than that of the nitride semiconductor constituting the underlayer and having a dislocation density of 1×10 10 /cm 2 or less, as well.
摘要:
A semiconductor element includes a conductive SiC base having a resistivity of less than 1×10 5 Ωcm, an underlayer made of a semiconductor nitride including at least Al element which is formed on the SiC base, and a semiconductor nitride layer group made including at least one of Al element, Ga element and In element.
摘要:
A GaN-based light-emitting diode on a sapphire substrate has an active layer containing quantum dots, which is sandwiched between p and n-type zones. The p-type material is deposited on a AlGaN or AIN buffer before the active layer is deposited. This yields in high quality p-type material which need not be thermally activated, but can be thermally activated, however, before deposition of the active layer. This avoids the risk of destroying the quantum dot structure by the activation treatment. A group III nitride underlayer which contains at least Al, in which the dislocation density is ≤1 x 10 11 /cm 2 and whose (002) plane X-ray rocking curve half-value width is ≤200 seconds is formed on set base material. Next, a p-type semiconductor layer group which is constituted by a group III nitride in which the Ga content relative to the total group III elements is ≥50 at% and in which the carrier density is ≥1 x 10 16 /cm 3 is formed above the group III nitride underlayer. Next, a light-emitting layer which is contains plural mutually isolated insular crystals is formed on the p-type semiconductor layer group. Next, an n-type semiconductor layer group in which the Ga content relative to the total group III elements is ≥50 at% is formed on the light-emitting layer.
摘要:
A light-emitting element includes a transparent substrate, a III-V nitride semiconductor layer including rare earth metal elements which is formed on said transparent substrate, and an irradiation source of electron beam which is disposed within 5 mm from the surface of said III-V nitride semiconductor layer so as to be opposite to said III-V nitride semiconductor layer. Then, the rare earth metal elements in the III-V nitride semiconductor layer are excited by electron beams from the irradiation source and a given fluorescence inherent to the rare earth metal elements are emitted.
摘要:
A light-emitting element (10) includes a transparent substrate (1), a III-V nitride semiconductor layer (2) including rare earth metal elements which is formed on said transparent substrate (1), and an irradiation source of electron beam (3) which is disposed within 5 mm from the surface of said III-V nitride semiconductor layer (2) so as to be opposite to said III-V nitride semiconductor layer. Then, the rare earth metal elements in the III-V nitride semiconductor layer are excited by electron beams from the irradiation source (3) and a given fluorescence inherent to the rare earth metal elements are emitted.
摘要:
In a semiconductor light-emitting element, an underlayer is made of a high crystallinity Al-including semi-conducting nitride material of which the FWHM is 90 second or below in X-ray rocking curve. Then, a light-emitting layer is made of a semi-conducting nitride material including at least one element selected from the group consisting of Al, Ga and In and containing at least one element selected from rare earth metal elements and transition metal elements as an additive element.
摘要:
A III nitride buffer film including at least A1 element and having a screw-type dislocation density of 1×10 8 /cm 2 or below is formed on a base made of a sapphire single crystal, etc., to fabricate an epitaxial base substrate. Then, a III nitride underfilm is formed on the III nitride buffer film, to fabricate an epitaxial substrate.
摘要:
On a substrate (1) is epitaxially grown an AIN film (2) as an underlayer having a dislocation density of 10 11 /cm 2 or below and a crystallinity of 90 seconds or below in full width at half maximum (FWHM) of X-ray rocking curve at (002) reflection. Then, on the AlN film (2) is epitaxially grown an n-GaN film (3) as a conductive layer having a dislocation density of 10 10 /cm 2 or below and a crystallinity of 150 seconds or below in full width at half maximum (FWHM) of X-ray rocking curve at (002) reflection, to fabricate a semiconductor element.
摘要:
A light-emitting element includes a light-emitting layer including a base layer made of a first nitride semiconductor and plural island-shaped crystal portions made of a second nitride semiconductor, and an irradiation source of electron beam which is disposed so as to be opposite to the light-emitting layer. Then, electron-electron hole pairs in the light-emitting layer are excited through the irradiation of electron beam from the irradiation source, to generate and emit a light.