Epitaxial substrate for semiconductor device, semiconductor device, and method of manufacturing epitaxial substrate for semiconductor device
    3.
    发明公开
    Epitaxial substrate for semiconductor device, semiconductor device, and method of manufacturing epitaxial substrate for semiconductor device 审中-公开
    用于半导体器件的外延衬底,半导体器件和用于半导体器件的外延衬底的制造方法

    公开(公告)号:EP2290696A3

    公开(公告)日:2012-09-12

    申请号:EP10172363.3

    申请日:2010-08-10

    IPC分类号: H01L29/778 H01L29/201

    摘要: Provided is an epitaxial substrate capable of achieving a semiconductor device that has excellent ohmic contact characteristics as well as satisfactory device characteristics. On a base substrate, a channel layer formed of a first group III nitride that contains at least Al and Ga and has a composition of In x1 Al y1 Ga z1 N (x1+y1+z1=1) is formed. On the channel layer, a barrier layer formed of a second group III nitride that contains at least In and Al and has a composition of In x2 Al y2 Ga z2 N (x2+y2+z2=1) is formed such that an In composition ratio of a near-surface portion is larger than an In composition ratio of a portion other than the near-surface portion.

    摘要翻译: 提供一种能够实现具有优异的欧姆接触特性以及令人满意的器件特性的半导体器件的外延衬底。 在基底基板上,形成由至少含有Al和Ga且组成为Inx1Aly1Gaz1N(x1 + y1 + z1 = 1)的第一III族氮化物形成的沟道层。 在沟道层上,形成由至少包含In和Al且具有In x2 Al y2 Ga z2 N(x2 + y2 + z2 = 1)的组成的第二III族氮化物形成的势垒层,使得近表面 部分比近表面部分以外的部分的In组成比大。

    Epitaxial substrate for semiconductor device, semiconductor device, and method of manufacturing epitaxial substrate for semiconductor device
    4.
    发明公开
    Epitaxial substrate for semiconductor device, semiconductor device, and method of manufacturing epitaxial substrate for semiconductor device 审中-公开
    外延基板为半导体装置,半导体装置和方法,用于制造外延衬底的半导体装置

    公开(公告)号:EP2290696A2

    公开(公告)日:2011-03-02

    申请号:EP10172363.3

    申请日:2010-08-10

    IPC分类号: H01L29/778 H01L29/201

    摘要: Provided is an epitaxial substrate capable of achieving a semiconductor device that has excellent ohmic contact characteristics as well as satisfactory device characteristics. On a base substrate, a channel layer formed of a first group III nitride that contains at least Al and Ga and has a composition of In x1 Al y1 Ga z1 N (x1+y1+z1=1) is formed. On the channel layer, a barrier layer formed of a second group III nitride that contains at least In and Al and has a composition of In x2 Al y2 Ga z2 N (x2+y2+z2=1) is formed such that an In composition ratio of a near-surface portion is larger than an In composition ratio of a portion other than the near-surface portion.

    摘要翻译: 本发明提供一种能够实现半导体器件的外延衬底确实具有优良的欧姆接触特性以及满意的器件特性。 上的基底基板,形成在第一III族氮化物制成的沟道层那样至少含有Al和Ga,具有在X1的Al Y1 Z1镓N中的一个组合物(X1 + Y1 + Z1 = 1)形成。 在沟道层,形成的第二III族氮化物构成的势垒层做至少包含In和Al,并具有在X2的Al Y2镓Z2 N中的一个组合物(X2 + Y 2 + Z 2 = 1)形成搜索的确在In组成 的近表面部分的比大于在除表面附近部以外的部分的In组成比。