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公开(公告)号：EP4411206A2
公开(公告)日：2024-08-07
申请号：EP24183776.4
申请日：2020-04-21
申请人： Nichia Corporation
IPC分类号： F21K9/90
CPC分类号： F21K9/90 , H05K1/116 , H05K3/005 , H05K3/1225 , H05K3/1233 , H05K3/281 , H05K3/321 , H05K3/4069 , H05K3/4626 , H05K2201/0942720130101 , H05K2201/0947220130101 , H05K2201/0962720130101 , H05K2201/0966320130101 , H05K2201/097920130101 , H05K2201/09920130101 , H05K2201/1010620130101 , H05K2203/022120130101 , H05K2203/027820130101 , H05K2203/110520130101 , F21K9/61 , F21Y2105/1620160801 , F21Y2115/1020160801 , F21K9/64 , G02B6/0023 , G02B6/0036 , H01L25/0753
摘要： A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.
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公开(公告)号：EP4411206A3
公开(公告)日：2024-11-06
申请号：EP24183776.4
申请日：2020-04-21
申请人： Nichia Corporation
IPC分类号： H05K3/12 , H05K3/34 , H05K3/00 , H05K3/40 , H05K3/32 , H05K1/11 , F21K9/90 , F21K9/61 , F21K9/64 , F21Y105/16 , F21Y115/10 , F21V8/00 , H01L25/075 , H05K3/46 , H05K3/28
摘要： A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.
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公开(公告)号：EP3869573A1
公开(公告)日：2021-08-25
申请号：EP21161001.9
申请日：2020-01-28
申请人： NICHIA CORPORATION
发明人： SATO, Yoshiki , KATSUMATA, Masaaki , DAIKOKU, Shinichi , MATSUDA, Yoshikazu , MARUME, Ryuma , MINATO, Eiko
摘要： A method for manufacturing a light-emitting device includes preparing an intermediate product; the product includes a light-emitting element provided with pairedelectrodes at a first surface and a first covering member covering the light-emitting element such that portions of surfaces of the paired electrodes are exposed. A a metal paste layer is formed, continuously covering the exposed portion of the paired electrodes and the first covering member. Paired wirings are formed, for preventing the paired electrodes from being short-circuited. The metal paste layer on the paired electrodes and the metal paste layer on the first covering member are irradiated with laser light to remove the metal paste layer between the paired electrodes and a portion of the metal paste layer on the first covering member.
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公开(公告)号：EP3751969A3
公开(公告)日：2021-03-03
申请号：EP20170558.9
申请日：2020-04-21
申请人： Nichia Corporation
摘要： A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.
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