公开(公告)号：EP4149095B1

公开(公告)日：2024-06-05

申请号：EP22741414.1

申请日：2022-04-29

IPC: H04M1/02 ,  H05K1/02 ,  H05K3/36 ,  H05K1/18

CPC classification number: H04M1/0264 ,  H04M1/0277 ,  H04N23/57 ,  H05K1/0216 ,  H05K2201/097920130101 ,  H05K2201/0935420130101 ,  H05K1/0215 ,  H05K1/189 ,  H05K3/368 ,  H05K2201/1018920130101

公开(公告)号：EP4118940B1

公开(公告)日：2024-07-03

申请号：EP21712467.6

申请日：2021-03-12

IPC: H05K1/11 ,  H05K3/32 ,  H05K1/18 ,  H05K3/40 ,  H05K1/09 ,  H05K3/12

CPC classification number: H05K1/115 ,  H05K1/113 ,  H05K3/321 ,  H05K2201/1003720130101 ,  H05K2201/05620130101 ,  H05K1/189 ,  H05K2201/05320130101 ,  H05K2201/0906320130101 ,  H05K2201/097920130101 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/1283 ,  Y02E60/10

公开(公告)号：EP4432791A2

公开(公告)日：2024-09-18

申请号：EP24183664.2

申请日：2021-03-12

Applicant: Ascensia Diabetes Care Holdings AG

Inventor： Gofman, Igor Y.

IPC: H05K3/40

CPC classification number: H05K1/115 ,  H05K1/113 ,  H05K3/321 ,  H05K2201/1003720130101 ,  H05K2201/05620130101 ,  H05K1/189 ,  H05K2201/05320130101 ,  H05K2201/0906320130101 ,  H05K2201/097920130101 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/1283 ,  Y02E60/10

Abstract: A flexible printed circuit board (PCB) may have one or more coin cell batteries mounted thereto such that the flexibility of the flexible PCB is maintained. The flexible PCB has one or more battery contact pads fabricated thereon. Each battery contact pad includes a pattern of metalized vias each extending from a top surface to a bottom surface of the flexible PCB. A coin cell battery may be positioned over or under the battery contact pad. Conductive light curable epoxy is applied to and in each metalized via to contact and adhere to the coin cell battery to form a conductive path from the battery through the battery contact pad to printed conductors on the flexible PCB. Methods of mounting one or more coin cell batteries to a flexible PCB are also provided, as are other aspects.

公开(公告)号：EP3469861B1

公开(公告)日：2024-05-08

申请号：EP17733030.5

申请日：2017-06-09

IPC: H05K1/11 ,  H01P5/02 ,  H01R12/72 ,  H01R13/11 ,  H05K1/02

CPC classification number: H01R13/112 ,  H01P5/028 ,  H05K1/025 ,  H05K2201/0938120130101 ,  H05K2201/0948120130101 ,  H05K2201/0961820130101 ,  H05K2201/0967220130101 ,  H05K2201/0972720130101 ,  H05K2201/097920130101 ,  H01R12/721 ,  H05K1/117

公开(公告)号：EP4411206A2

公开(公告)日：2024-08-07

申请号：EP24183776.4

申请日：2020-04-21

Applicant: Nichia Corporation

Inventor： MINATO, Eiko ,  TAGUCHI, Koji ,  KAMESHIMA, Yumiko ,  KATSUMATA, Masaaki

IPC: F21K9/90

CPC classification number: F21K9/90 ,  H05K1/116 ,  H05K3/005 ,  H05K3/1225 ,  H05K3/1233 ,  H05K3/281 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4626 ,  H05K2201/0942720130101 ,  H05K2201/0947220130101 ,  H05K2201/0962720130101 ,  H05K2201/0966320130101 ,  H05K2201/097920130101 ,  H05K2201/09920130101 ,  H05K2201/1010620130101 ,  H05K2203/022120130101 ,  H05K2203/027820130101 ,  H05K2203/110520130101 ,  F21K9/61 ,  F21Y2105/1620160801 ,  F21Y2115/1020160801 ,  F21K9/64 ,  G02B6/0023 ,  G02B6/0036 ,  H01L25/0753

Abstract: A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.

公开(公告)号：EP4402994A1

公开(公告)日：2024-07-24

申请号：EP22870887.1

申请日：2022-08-31

Applicant: Inventus Power, Inc.

Inventor： ZHANG, Michael M. ,  REINKE, Christopher Michael ,  AYUB, Ilyas ,  BATTS, William Mark ,  VALLARO, Timothy James ,  GOLDIN, Elijah Brett ,  MANADAN, Anvin Joe ,  KUDRNA, Paul John ,  LUNDEEN, John ,  ROSE, Daniel Paul ,  REED, Stewart George

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/18 ,  H01M50/502 ,  H01M50/209

CPC classification number: Y02E60/10 ,  H01M50/502 ,  H05K2201/1003720130101 ,  H05K1/189 ,  H05K1/0293 ,  H05K2201/097920130101 ,  H01M50/211 ,  H01M2220/3020130101 ,  H01M50/519 ,  H01M50/583

公开(公告)号：EP3598856B1

公开(公告)日：2024-09-18

申请号：EP19187319.9

申请日：2019-07-19

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K1/116 ,  H05K2201/097920130101 ,  H05K2201/0970920130101 ,  H05K3/4629

公开(公告)号：EP4278242B1

公开(公告)日：2024-08-21

申请号：EP21723825.2

申请日：2021-04-14

IPC: G06F1/16 ,  H05K1/14 ,  H05K1/02 ,  H04M1/02 ,  H05K1/11

CPC classification number: H04M1/0214 ,  H04M1/0216 ,  H04M1/0268 ,  H04M1/0277 ,  G06F1/1616 ,  G06F1/1652 ,  G06F1/1683 ,  H05K1/148 ,  H05K1/028 ,  H05K1/0283 ,  H05K2201/097920130101 ,  H05K1/118

公开(公告)号：EP3751969B1

公开(公告)日：2024-07-24

申请号：EP20170558.9

申请日：2020-04-21

IPC: H05K3/28 ,  H05K3/46 ,  F21K9/61 ,  F21K9/64 ,  F21Y105/16 ,  F21Y115/10 ,  F21V8/00 ,  H01L25/075 ,  H05K3/12 ,  H05K3/00 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  F21K9/90

CPC classification number: F21K9/90 ,  H05K1/116 ,  H05K3/005 ,  H05K3/1225 ,  H05K3/1233 ,  H05K3/281 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4626 ,  H05K2201/0942720130101 ,  H05K2201/0947220130101 ,  H05K2201/0962720130101 ,  H05K2201/0966320130101 ,  H05K2201/097920130101 ,  H05K2201/09920130101 ,  H05K2201/1010620130101 ,  H05K2203/022120130101 ,  H05K2203/027820130101 ,  H05K2203/110520130101 ,  F21K9/61 ,  F21Y2105/1620160801 ,  F21Y2115/1020160801 ,  F21K9/64 ,  G02B6/0023 ,  G02B6/0036 ,  H01L25/0753