公开(公告)号：EP4434298A1

公开(公告)日：2024-09-25

申请号：EP22813575.2

申请日：2022-11-08

Applicant: Endress+Hauser SE+Co. KG

Inventor： BIRGEL, Dietmar ,  BURGER, Paul ,  BANNWARTH, Alexander

IPC: H05K3/28 ,  H05K3/32 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/321 ,  H05K1/181 ,  H05K1/111 ,  H05K2201/1008320130101 ,  H05K3/281 ,  H05K2201/09920130101

公开(公告)号：EP3751969B1

公开(公告)日：2024-07-24

申请号：EP20170558.9

申请日：2020-04-21

IPC: H05K3/28 ,  H05K3/46 ,  F21K9/61 ,  F21K9/64 ,  F21Y105/16 ,  F21Y115/10 ,  F21V8/00 ,  H01L25/075 ,  H05K3/12 ,  H05K3/00 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  F21K9/90

CPC classification number: F21K9/90 ,  H05K1/116 ,  H05K3/005 ,  H05K3/1225 ,  H05K3/1233 ,  H05K3/281 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4626 ,  H05K2201/0942720130101 ,  H05K2201/0947220130101 ,  H05K2201/0962720130101 ,  H05K2201/0966320130101 ,  H05K2201/097920130101 ,  H05K2201/09920130101 ,  H05K2201/1010620130101 ,  H05K2203/022120130101 ,  H05K2203/027820130101 ,  H05K2203/110520130101 ,  F21K9/61 ,  F21Y2105/1620160801 ,  F21Y2115/1020160801 ,  F21K9/64 ,  G02B6/0023 ,  G02B6/0036 ,  H01L25/0753

公开(公告)号：EP3119169B1

公开(公告)日：2024-10-02

申请号：EP15181783.0

申请日：2015-08-20

IPC: H05K3/10 ,  H05K3/24

CPC classification number: H05K3/108 ,  H05K2201/033820130101 ,  H05K2201/09820130101 ,  H05K2201/098920130101 ,  H05K2201/09920130101 ,  H05K2203/118420130101 ,  H05K3/244

公开(公告)号：EP4426077A2

公开(公告)日：2024-09-04

申请号：EP24188063.2

申请日：2015-08-20

Applicant: LG Innotek Co., Ltd.

Inventor： BAE, Yun Mi ,  KWON, Soon Gyu ,  KIM, Sang Hwa ,  LEE, Sang Young ,  LEE, Jin Hak ,  LEE, Han Su ,  JEONG, Dong Hun ,  JEONG, In Ho ,  CHOI, Dae Young ,  HWANG, Jung Ho

IPC: H05K3/24

CPC classification number: H05K3/108 ,  H05K2201/033820130101 ,  H05K2201/09820130101 ,  H05K2201/098920130101 ,  H05K2201/09920130101 ,  H05K2203/118420130101 ,  H05K3/244

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

公开(公告)号：EP4411206A2

公开(公告)日：2024-08-07

申请号：EP24183776.4

申请日：2020-04-21

Applicant: Nichia Corporation

Inventor： MINATO, Eiko ,  TAGUCHI, Koji ,  KAMESHIMA, Yumiko ,  KATSUMATA, Masaaki

IPC: F21K9/90

CPC classification number: F21K9/90 ,  H05K1/116 ,  H05K3/005 ,  H05K3/1225 ,  H05K3/1233 ,  H05K3/281 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4626 ,  H05K2201/0942720130101 ,  H05K2201/0947220130101 ,  H05K2201/0962720130101 ,  H05K2201/0966320130101 ,  H05K2201/097920130101 ,  H05K2201/09920130101 ,  H05K2201/1010620130101 ,  H05K2203/022120130101 ,  H05K2203/027820130101 ,  H05K2203/110520130101 ,  F21K9/61 ,  F21Y2105/1620160801 ,  F21Y2115/1020160801 ,  F21K9/64 ,  G02B6/0023 ,  G02B6/0036 ,  H01L25/0753

Abstract: A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.