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公开(公告)号：EP3846283B1
公开(公告)日：2024-05-01
申请号：EP21158778.7
申请日：2018-10-26
CPC分类号： H01Q1/2283 , H01Q1/243 , H05K1/0251 , H05K1/116 , H05K1/144 , H05K2201/04220130101 , H05K2201/0961820130101 , H05K2201/0962720130101 , H05K2201/1037820130101 , H05K1/115 , H05K1/0222
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公开(公告)号：EP4411206A2
公开(公告)日：2024-08-07
申请号：EP24183776.4
申请日：2020-04-21
申请人： Nichia Corporation
IPC分类号： F21K9/90
CPC分类号： F21K9/90 , H05K1/116 , H05K3/005 , H05K3/1225 , H05K3/1233 , H05K3/281 , H05K3/321 , H05K3/4069 , H05K3/4626 , H05K2201/0942720130101 , H05K2201/0947220130101 , H05K2201/0962720130101 , H05K2201/0966320130101 , H05K2201/097920130101 , H05K2201/09920130101 , H05K2201/1010620130101 , H05K2203/022120130101 , H05K2203/027820130101 , H05K2203/110520130101 , F21K9/61 , F21Y2105/1620160801 , F21Y2115/1020160801 , F21K9/64 , G02B6/0023 , G02B6/0036 , H01L25/0753
摘要： A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.
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公开(公告)号：EP4432788A1
公开(公告)日：2024-09-18
申请号：EP24162127.5
申请日：2024-03-07
申请人： MediaTek Inc.
发明人： YI, Tso-Ju , LEE, Chung-Fa
CPC分类号： H05K1/0206 , H05K3/429 , H05K2201/09620130101 , H05K2201/0960920130101 , H05K2201/0963620130101 , H05K2201/0985420130101 , H05K2201/0962720130101 , H05K1/181 , H05K2201/1067420130101 , H05K2201/1071920130101
摘要： An electronic system is provided. The electronic system includes a base and a semiconductor device. The base having a device-attach region includes a build-up layer structure, a vertical interconnect structure and a first through via. The vertical interconnect structure and the first through via are formed passing through the build-up layer structure and located in the device-attach region. The vertical interconnect structure includes a buried via and a blind via electrically coupled to the buried via. The first through via is a straight through via. The semiconductor device is mounted on the device-attach region of the base.
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公开(公告)号：EP3751969B1
公开(公告)日：2024-07-24
申请号：EP20170558.9
申请日：2020-04-21
IPC分类号： H05K3/28 , H05K3/46 , F21K9/61 , F21K9/64 , F21Y105/16 , F21Y115/10 , F21V8/00 , H01L25/075 , H05K3/12 , H05K3/00 , H05K1/11 , H05K3/32 , H05K3/40 , F21K9/90
CPC分类号： F21K9/90 , H05K1/116 , H05K3/005 , H05K3/1225 , H05K3/1233 , H05K3/281 , H05K3/321 , H05K3/4069 , H05K3/4626 , H05K2201/0942720130101 , H05K2201/0947220130101 , H05K2201/0962720130101 , H05K2201/0966320130101 , H05K2201/097920130101 , H05K2201/09920130101 , H05K2201/1010620130101 , H05K2203/022120130101 , H05K2203/027820130101 , H05K2203/110520130101 , F21K9/61 , F21Y2105/1620160801 , F21Y2115/1020160801 , F21K9/64 , G02B6/0023 , G02B6/0036 , H01L25/0753
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公开(公告)号：EP4353055A1
公开(公告)日：2024-04-17
申请号：EP22735092.3
申请日：2022-06-08
CPC分类号： H05K1/0206 , H05K2201/0957220130101 , H05K2201/0962720130101 , H05K2201/0954520130101 , H05K2201/0950920130101 , H05K2201/0960920130101 , H05K3/421 , H05K2201/098920130101 , H05K2203/04220130101 , H05K2203/045520130101 , H05K2203/046520130101 , H05K2201/030520130101 , H05K2203/041520130101 , H05K2203/139420130101 , H05K3/0094 , H05K2203/054520130101
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