Patent search cpc:"H05K2201/0966320130101" Page 1

1.

发明公开
ELECTRICAL DEVICE 审中-实审

公开(公告)号：EP4383957A1

公开(公告)日：2024-06-12

申请号：EP23211084.1

申请日：2023-11-21

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： YU, Pengpeng

IPC: H05K1/02 , H05K1/11

CPC classification number: H05K2201/1001520130101 , H05K2201/1002220130101 , H05K1/0234 , H05K2201/0944520130101 , H05K1/117 , H05K2201/0966320130101 , H05K2201/0940920130101 , H05K2201/074620130101 , H05K1/0259

Abstract: Embodiments of this application provide an electrical device, including a substrate and two power terminals that are disposed at an interval on the substrate. At least one of the power terminals is partitioned into two conductive sections that are spaced along an insertion direction of the substrate and are connected in series by using a resistor; and capacitors are disposed between power circuits that are electrically connected to the two power terminals. When hot swap is performed between the electrical device and a piece of power sourcing equipment, current-limiting charging is first performed on the capacitors by using a conductive section located in the front of the insertion direction of the substrate; and then a conductive section located at the rear of the insertion direction of the substrate is connected to implement power input. In this way, even if an output voltage of the power sourcing equipment is high, phenomena such as sparking and ablation are not likely to occur at the two power terminals, and electrical connections between the electrical device and the power sourcing equipment are not easily affected.

2.

发明公开
METHOD OF MANUFACTURING LIGHT-EMITTING MODULE AND LIGHT-EMITTING MODULE 审中-公开

公开(公告)号：EP4411206A2

公开(公告)日：2024-08-07

申请号：EP24183776.4

申请日：2020-04-21

Applicant: Nichia Corporation

Inventor： MINATO, Eiko , TAGUCHI, Koji , KAMESHIMA, Yumiko , KATSUMATA, Masaaki

IPC: F21K9/90

CPC classification number: F21K9/90 , H05K1/116 , H05K3/005 , H05K3/1225 , H05K3/1233 , H05K3/281 , H05K3/321 , H05K3/4069 , H05K3/4626 , H05K2201/0942720130101 , H05K2201/0947220130101 , H05K2201/0962720130101 , H05K2201/0966320130101 , H05K2201/097920130101 , H05K2201/09920130101 , H05K2201/1010620130101 , H05K2203/022120130101 , H05K2203/027820130101 , H05K2203/110520130101 , F21K9/61 , F21Y2105/1620160801 , F21Y2115/1020160801 , F21K9/64 , G02B6/0023 , G02B6/0036 , H01L25/0753

Abstract: A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.