公开(公告)号：EP1517166B1

公开(公告)日：2015-10-21

申请号：EP04255516.9

申请日：2004-09-13

申请人： Nuvotronics, LLC

发明人： Sherrer, David W. ,  Rasnake, Larry J. ,  Fisher, John J.

IPC分类号： G02B6/42 ,  H01L33/00

CPC分类号： G02B6/4248 ,  G01B11/16 ,  G01B11/26 ,  G02B6/3692 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4271 ,  G02B6/4292 ,  H01L23/481 ,  H01L2924/0002 ,  H01S5/0014 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02469 ,  H01S5/0683 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path. Also provided are wafer or grid level optoelectronic device packages, wafer- or grid-level optoelectronic device package lid and their methods of formation, and connectorized optoelectronic devices.

公开(公告)号：EP2395598B1

公开(公告)日：2018-08-22

申请号：EP10170680.2

申请日：2004-03-04

申请人： Nuvotronics, LLC

发明人： Sherrer, David W. ,  Fisher, John J.

IPC分类号： H01P3/06 ,  H01P1/08 ,  H01P5/103 ,  H01P11/00 ,  H05K1/02 ,  H05K3/46

CPC分类号： H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

摘要： Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

公开(公告)号：EP1515364B1

公开(公告)日：2016-04-13

申请号：EP04255517.7

申请日：2004-09-13

申请人： Nuvotronics, LLC

发明人： Sherrer, David W. ,  Rasnake, Larry J. ,  Fisher, John J.

IPC分类号： H01L21/768 ,  H01L23/522 ,  G02B6/42

CPC分类号： G02B6/4248 ,  G01B11/16 ,  G01B11/26 ,  G02B6/3692 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4271 ,  G02B6/4292 ,  H01L23/481 ,  H01L2924/0002 ,  H01S5/0014 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02469 ,  H01S5/0683 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path. Also provided are wafer or grid level optoelectronic device packages, wafer- or grid-level optoelectronic device package lid and their methods of formation, and connectorized optoelectronic devices.

公开(公告)号：EP2395598A1

公开(公告)日：2011-12-14

申请号：EP10170680.2

申请日：2004-03-04

申请人： Nuvotronics, LLC

发明人： Sherrer, David W. ,  Fisher, John J.

IPC分类号： H01P3/06 ,  H01P1/08

CPC分类号： H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

摘要： Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

摘要翻译： 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外部导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过连续构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。