公开(公告)号：EP2395598B1

公开(公告)日：2018-08-22

申请号：EP10170680.2

申请日：2004-03-04

申请人： Nuvotronics, LLC

发明人： Sherrer, David W. ,  Fisher, John J.

IPC分类号： H01P3/06 ,  H01P1/08 ,  H01P5/103 ,  H01P11/00 ,  H05K1/02 ,  H05K3/46

CPC分类号： H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

摘要： Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

公开(公告)号：EP2701471B8

公开(公告)日：2017-09-27

申请号：EP13193556.1

申请日：2011-04-26

申请人： Tyco Electronics Belgium EC bvba ,  TE Connectivity Nederland B.V.

发明人： Smink, Rutger ,  Decrock, Lieven

IPC分类号： H05K1/02 ,  H01R107/00 ,  H01R13/6461 ,  H01R13/6476

CPC分类号： H01R13/6461 ,  H01R9/032 ,  H01R12/62 ,  H01R13/6466 ,  H01R13/6585 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0219 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09236 ,  H05K2201/0969 ,  H05K2201/10287

公开(公告)号：EP3200572A1

公开(公告)日：2017-08-02

申请号：EP15843513.1

申请日：2015-09-15

申请人： Fujikura, Ltd. ,  DDK Ltd.

发明人： ISHIDA, Yuki ,  SUZUKI, Masayuki ,  URAI, Harunori ,  KOJIMA, Isao

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/111 ,  H05K1/0221 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/117 ,  H05K1/118 ,  H05K3/22 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09363

摘要： A printed wiring board including at least a first substrate (11) is provided. The first substrate (11) is formed with pads (2) and a ground layer (3) at any one of main surfaces of the first substrate (11). The pads (2) are to be electrically connected to a connector as another component. The ground layer (3) has inner edges at locations separated from outer edges of the pads (2) with a predetermined distance and is to be grounded to a ground contact. Grooves (4) are formed between the pads (2) and the ground layer (3).

摘要翻译： 提供至少包括第一基板（11）的印刷线路板。 第一衬底（11）在第一衬底（11）的任一主表面上形成有焊盘（2）和接地层（3）。 焊盘（2）将作为另一个组件电连接到连接器。 接地层（3）具有在与焊盘（2）的外边缘隔开预定距离的位置处的内边缘，并且将接地到接地触点。 凹槽（4）形成在焊盘（2）和接地层（3）之间。

公开(公告)号：EP3178132A1

公开(公告)日：2017-06-14

申请号：EP15750152.9

申请日：2015-07-01

申请人： General Electric Company

发明人： LUSTIG, James, Michael

IPC分类号： H01R4/64 ,  H01R13/6592 ,  F23N5/08

CPC分类号： H05K1/0221 ,  F23N5/082 ,  H01B7/282 ,  H01B7/29 ,  H01R13/6592 ,  H05K9/00 ,  H05K9/0084

摘要： A seal assembly includes a first shield tube surrounding a signal wire and a second shield tube surrounding the signal wire. The seal assembly includes an electrically insulating barrier positioned between the first shield tube and the second shield tube and through which the signal wire extends. The insulating barrier includes a first conductive layer on a first side of the insulating barrier and a second conductive layer on an opposing second side of the insulating barrier. The first shield tube is electrically connected to the first conductive layer and the second shield tube is electrically connected to the second conductive layer such that the first shield tube, first conductive layer, second shield tube, and second conductive layer are electrically insulated from the signal wire.

摘要翻译： 用于连接传感器组件和电缆组件的布置。 该装置包括信号线。 该装置包括横向延伸的绝缘屏障。 信号线延伸穿过绝缘屏障。 该装置包括配置成提供接地路径的至少一部分的屏蔽线。 屏蔽线在与信号线隔开的位置处延伸穿过绝缘屏障。 该装置包括位于绝缘屏障上的至少一个导电层。 该至少一个导电层与信号线隔开并且与屏蔽线电接触。 绝缘屏障的至少一部分具有非线性轮廓。 位于绝缘屏障的至少一部分上的至少一个导电层的至少一部分具有非线性轮廓。

公开(公告)号：EP2831954A4

公开(公告)日：2015-07-08

申请号：EP13769813

申请日：2013-03-28

申请人： LEXMARK INT INC

发明人： HARDIN KEITH BRYAN

IPC分类号： H01G4/30 ,  H05K1/02 ,  H05K1/18

CPC分类号： H05K1/184 ,  H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0221 ,  H05K1/0231 ,  H05K1/0251 ,  H05K1/0298 ,  H05K3/4046 ,  H05K2201/10053 ,  H05K2201/10984

公开(公告)号：EP2772124A1

公开(公告)日：2014-09-03

申请号：EP12844428.8

申请日：2012-10-22

申请人： Lexmark International, Inc.

发明人： HARDIN, Keith, Bryan ,  KRATZER, Zachary Charles, Nathan ,  ZHANG, Qing

IPC分类号： H05K3/00

CPC分类号： B29C47/0066 ,  B28B3/20 ,  B28B11/16 ,  B29C47/0004 ,  B29C47/0035 ,  B29K2995/0005 ,  B29K2995/0007 ,  B29L2031/3425 ,  H01G4/33 ,  H01G4/35 ,  H05K1/0221 ,  H05K1/0231 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/30 ,  H05K3/306 ,  H05K3/4046 ,  H05K2201/10015 ,  H05K2201/10053 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49135

摘要： A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials according to the structure of the Z-directed component to form an extruded object and forming the Z-directed component from the extruded object. In one embodiment, the extruded object is divided into individual Z-directed components. In one embodiment, the timing of extrusion between predetermined sections of one of the materials is varied in order to stagger the sections in the extruded object.

摘要翻译： 一种用于在印刷电路板雅丁一个示例实施例的制造用于插入一个Z向部件到安装孔方法包括同时挤出的材料的多层雅丁于Z向部件的结构，以形成挤出物，并形成所述 从挤压的物体Z取向的部件。 在一个中，实施例挤压的物体被分成单独的Z向分量。 在一个，该材料中的一个的预定部分之间的实施方式挤出的定时，以错开的部分在挤出的对象而变化。

公开(公告)号：EP2701471A1

公开(公告)日：2014-02-26

申请号：EP13193556.1

申请日：2011-04-26

申请人： Tyco Electronics Belgium EC BVBA ,  Tyco Electronics Nederland B.V.

发明人： Smink, Rutger ,  Decrock, Lieven

IPC分类号： H05K1/02 ,  H01R107/00 ,  H01R13/6461 ,  H01R13/6476

CPC分类号： H01R13/6461 ,  H01R9/032 ,  H01R12/62 ,  H01R13/6466 ,  H01R13/6585 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0219 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09236 ,  H05K2201/0969 ,  H05K2201/10287

摘要： The present invention relates to a high speed input/output (I/O) connection interface element, to a cable assembly comprising such an interface element and to an interconnection system comprising such a cable assembly and a belonging jack connector for contacting the cable assembly. The I/O connection interface element comprises a substrate (102) carrying a plurality of electrically conductive leads (106), each of said conductive leads having an I/O transition interface to be connected to at least one I/O conductor. The electrically conductive leads comprise input leads and output leads which are arranged on opposing faces of said substrate, and wherein at least one electrically conductive ground plane layer (116) is arranged at least partially within said substrate, being electrically insulated from said plurality of conductive leads. At least one ground plane layer is provided with at least one clearance (118) in a region adjacent to the transition interface.

摘要翻译： 本发明涉及一种高速输入/输出（I / O）连接接口元件，包括这种接口元件的电缆组件以及包括这种电缆组件和用于接触电缆组件的归属插座连接器的互连系统。 I / O连接接口元件包括承载多个导电引线（106）的衬底（102），每个所述导电引线具有要连接到至少一个I / O导体的I / O过渡接口。 导电引线包括布置在所述衬底的相对表面上的输入引线和输出引线，并且其中至少一个导电接地平面层（116）至少部分地布置在所述衬底内，与所述多个导电 线索。 至少一个接地平面层在与过渡界面相邻的区域中设置有至少一个间隙（118）。

公开(公告)号：EP2268110A1

公开(公告)日：2010-12-29

申请号：EP09171657.1

申请日：2009-09-29

申请人： HTC Corporation

发明人： Wu, Chung-Lun ,  Chu, Fu-An ,  Li, Ja-Ee

IPC分类号： H05K1/02 ,  H05K3/46

CPC分类号： H05K1/0221 ,  H05K1/0245 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/0715 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49124

摘要： ] A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.

摘要翻译： 提供了一种柔性印刷电路及其制造方法。 至少一根信号线设置在塑料基板上。 两条接地线平行设置在信号线的两侧。 提供屏蔽层，与塑料基板接触以形成室，其中信号线和接地线被包裹在其中。 在信号线和屏蔽层之间实现柔性介电层以提供电隔离。

公开(公告)号：EP1472914A2

公开(公告)日：2004-11-03

申请号：EP03705923.5

申请日：2003-01-23

申请人： INTEL CORPORATION

发明人： SATO, Daryl ,  BRIST, Gary ,  LONG, Gary

IPC分类号： H05K1/02

CPC分类号： H05K1/0265 ,  H05K1/0206 ,  H05K1/0219 ,  H05K1/0221 ,  H05K3/005 ,  H05K3/4644 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： An apparatus that includes a plurality of metalized planes (202, 204), one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches (218, 220, 222) connecting to at least one of the plurality of metalized planes.

公开(公告)号：EP1307078A3

公开(公告)日：2004-01-28

申请号：EP02003265.2

申请日：2002-02-21

申请人： Hitachi, Ltd.

发明人： Nagaishi, Hideyuki, Hitachi Ltd.,Intell.Prop.Grp. ,  Kondoh, Hiroshi, Hitachi Ltd.,Intell.Prop.Grp.

IPC分类号： H01Q1/32 ,  H01Q9/04 ,  H01Q23/00 ,  H01Q21/00 ,  H01P3/08 ,  H01P5/02

CPC分类号： H05K1/0222 ,  G01S7/032 ,  G01S13/931 ,  G01S2007/028 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/047 ,  H01Q1/3233 ,  H01Q9/0407 ,  H01Q21/0087 ,  H01Q23/00 ,  H05K1/0221 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4629 ,  H05K2201/09618 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts (5, 13, 14) are mounted on both sides of a hard multilayer dielectric substrate (2), and a transmission line (16, 18, 19, 20) connecting the RF circuit parts provided on both sides is constructed by a via group (20) including a periodical structure or a via (18, 19) having a coaxial structure perpendicular to faces of the multilayer dielectric substrate. As the multi-layer dielectric subtrate, a hard multilayer substrate using metallic layers as a microstrip line wiring layer, a DC/IF signal line layer, and grounding metal layers for shielding which are disposed on and under the DC/IF signal line is employed. By using the transmission line achieved by a through via having the periodical structure or the through via having the coaxial structure, an electromagnetic wave propagating in parallel between the grounding conductors is confined.