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    PHOTOELECTRIC SENSOR
    1.
    发明公开
    PHOTOELECTRIC SENSOR 审中-公开

    公开(公告)号：EP3467858A1

    公开(公告)日：2019-04-10

    申请号：EP18193584.2

    申请日：2018-09-11

    申请人： OMRON CORPORATION

    发明人： NAKASHIMA, Hirotaka ,  KOMAI, Kazunari

    IPC分类号： H01H1/00 ,  G01S17/02 ,  G01S17/46 ,  G01B11/00

    摘要： The photoelectric sensor (10) includes a light projecting part (14) emitting light, a light receiving part (16) receiving light, a housing (12) housing the light projecting part (14) and the light receiving part (16), a setting part (18), and an adjustment part (20). The housing (12) includes a front surface (31) having a light projecting/receiving surface (31a) allowing light from the light projecting part (14) and light to the light receiving part (16) to pass, a rear surface (32) located on a side opposite to the front surface (31), a top surface (33) adjacent to the front surface (31) and extending in a direction orthogonal to the front surface (31) and the rear surface (32), and an inclined surface (37) inclined with respect to and connecting the top surface (33) and the rear surface (32). The adjustment part (20) is provided on the inclined surface (37).

    OPTICAL FIBER AND MANUFACTURING METHOD THEREOF
    3.
    发明公开
    OPTICAL FIBER AND MANUFACTURING METHOD THEREOF 审中-公开
    光纤及其制造方法

    公开(公告)号：EP2687882A1

    公开(公告)日：2014-01-22

    申请号：EP11860920.5

    申请日：2011-03-22

    申请人： Omron Corporation

    发明人： HIRONO, Satoshi ,  INOUE, Naoto ,  IKOMA, Manabu ,  GONDO, Kiyohiko ,  MIYATA, Tsuyoshi ,  KOMAI, Kazunari

    IPC分类号： G02B6/02

    CPC分类号： G02B6/262 ,  B23K26/386 ,  B23K26/389 ,  G02B6/02052 ,  G02B6/02061 ,  G02B6/02123 ,  G02B6/032 ,  G02B6/25

    摘要： This optical fiber (1A) is provided with an incident end to which light is incident and an emitting end from which light is emitted, and also provided with an aperture formed by the irradiating the core (4) at or near the emitting end with an ultrashort pulsed laser having a pulse width of 10 -15 to 10 -11 seconds. This aperture is configured from a light scattering region formed by inducing damage change in a portion of the aforementioned core through irradiation with the ultrashort pulsed laser, a light absorption region formed by inducing blackening in a portion of the aforementioned core through irradiation with the ultrashort pulsed laser, or a volume diffractive optical element formed by inducing a refractive index change in a portion of the aforementioned core through irradiation with the ultrashort pulsed laser. The beam control properties of the light emitted from the emitting end are improved by means of adding this aperture function to the aforementioned optical fiber.

    摘要翻译： 该光纤（1A）具有入射光的入射端和出射光的出射端，并且还设置有通过在出射端处或其附近照射芯（4）而形成的孔径 脉冲宽度为10-15秒至10-11秒的超短脉冲激光器。 该开口由通过超短脉冲激光的照射而在上述芯的一部分中引起损伤变化而形成的光散射区域构成，该光吸收区域通过用超短脉冲照射在上述芯部的一部分中引起黑化而形成 激光或通过用超短脉冲激光照射在前述核的一部分中引起折射率变化而形成的体积衍射光学元件。 通过将该孔径功能添加到前述光纤中来改善从发射端发射的光的光束控制特性。

    OPTICAL SEMICONDUCTOR PACKAGE, OPTICAL SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF THESE
    4.
    发明公开
    OPTICAL SEMICONDUCTOR PACKAGE, OPTICAL SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD OF THESE 审中-公开
    光学半导体住房，生产光学半导体模块和方法

    公开(公告)号：EP2688115A1

    公开(公告)日：2014-01-22

    申请号：EP11860925.4

    申请日：2011-03-22

    申请人： Omron Corporation

    发明人： HIRONO, Satoshi ,  IKOMA, Manabu ,  INOUE, Naoto ,  MIYATA, Tsuyoshi ,  KOMAI, Kazunari

    IPC分类号： H01L33/60 ,  H01L31/02

    CPC分类号： H01L33/54 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/60 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00014

    摘要： This optical semiconductor package (1A) is provided with an interposer (10), an LED chip (20) arranged on a principal surface (10a) of the interposer (10) and emitting light, and an optical transparency sealing layer (30) which covers the principal surface (10a) of the interposer (10) and seals the LED chip (20). Inside of the optical transparency sealing layer (30), a cylindrical air gap (31) surrounding the optical axis of the LED chip (20) is formed by a laser processing using an ultrashort pulsed laser having a pulse width of 10 -15 to 10 -11 seconds. By this means, of the interface formed by the air gap (31) and the optical transparency sealing layer (30), the light emitted from the LED chip (20) is reflected at the part of the interface corresponding to the inner circumferential surface of the air gap (31).

    摘要翻译： 这种光半导体封装（1A）设置有内插器（10）布置在所述内插器（10）的主面（10a）的LED芯片（20）和发射光，并且光学透明性的密封层（30），其 覆盖所述内插器（10）的主面（10a）和密封所述LED芯片（20）。 内部的光学透明性的密封层（30），包围LED芯片的光学轴的圆柱形空气间隙（31）的（20）由激光加工用超短脉冲激光的具有10 -15〜10的脉冲宽度而形成 -11秒。 通过这种方式，由所述空气间隙（31）和所述光学透明的密封层（30），从所述LED芯片发射的光形成的界面（20）是在界面处反射的对应于内周面的一部分 气隙（31）。

    PHOTOELECTRIC SENSOR AND METHOD FOR MANUFACTURING SAME
    5.
    发明公开
    PHOTOELECTRIC SENSOR AND METHOD FOR MANUFACTURING SAME 审中-公开

    公开(公告)号：EP3933872A1

    公开(公告)日：2022-01-05

    申请号：EP20762210.1

    申请日：2020-02-28

    申请人： OMRON Corporation

    发明人： NAKAMURA, Jumpei ,  NAKASHIMA, Hirotaka ,  KOMAI, Kazunari ,  OIKAWA, Takahiro

    IPC分类号： H01H35/00 ,  H01H11/00

    摘要： Provided is a photoelectric sensor capable of being securely joined to a housing while being sufficiently resistant to dirt. A housing 12 of a photoelectric sensor 10 has an opening 121 which allows passage of at least one of light from a light projecting unit 14 and light to a light receiving unit 16, and is provided with a cover lens 50 which covers the opening 121 and is optically transmissive. The cover lens 50 is joined to an edge portion 121a of the housing 12 defining the opening 121. An outer surface 51 of the cover lens 50 is provided with antifouling coating 61. An inner surface 52 of the cover lens 50 has a joint portion 52a which is in contact with the edge portion 121a and is not provided with the antifouling coating 61.

    PHOTOELECTRIC SENSOR
    7.
    发明公开
    PHOTOELECTRIC SENSOR 审中-公开

    公开(公告)号：EP3467859A1

    公开(公告)日：2019-04-10

    申请号：EP18193635.2

    申请日：2018-09-11

    申请人： OMRON CORPORATION

    发明人： NAKASHIMA, Hirotaka ,  KOMAI, Kazunari

    IPC分类号： H01H1/00 ,  G01S17/02 ,  G01S17/46 ,  G01B11/00

    摘要： A housing of a photoelectric sensor has a front surface having a light projecting/receiving surface, a rear surface, a top surface adjacent to the front surface and extending in a direction orthogonal to the front surface and the rear surface, and an inclined surface inclined with respect to and connecting the top surface and the rear surface. On the top surface, a teach button that receives an input operation from outside to set a threshold value and an indicator that displays a detection result of the object being detected are provided in order from the side of the inclined surface. On the inclined surface, an adjustment button that receives an input operation from outside to finely adjust the threshold value is provided. A distance between the teach button and the adjustment button is larger than a distance between the teach button and the indicator.

    BONDING METHOD, BONDED STRUCTURE, METHOD FOR PRODUCING OPTICAL MODULE, AND OPTICAL MODULE
    8.
    发明公开
    BONDING METHOD, BONDED STRUCTURE, METHOD FOR PRODUCING OPTICAL MODULE, AND OPTICAL MODULE 审中-公开
    接合方法中，接合结构，方法用于生产光模块和光模块

    公开(公告)号：EP2360218A1

    公开(公告)日：2011-08-24

    申请号：EP09820586.7

    申请日：2009-10-14

    申请人： Omron Corporation

    发明人： USHIRO, Yuki ,  KAMEDA, Takamasa ,  KOMAI, Kazunari ,  MIYATA, Tsuyoshi ,  OKUNO, Motoharu ,  KASUYA, Makoto

    IPC分类号： C09J5/00 ,  B32B7/02 ,  G02B6/122 ,  G02B6/42 ,  H01L23/29 ,  H01L23/31 ,  H01L31/02 ,  H01L33/00

    CPC分类号： B32B7/02 ,  B32B7/04 ,  B32B7/12 ,  B32B27/08 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2264/00 ,  B32B2307/40 ,  B32B2307/412 ,  B32B2307/416 ,  B32B2307/71 ,  B32B2307/732 ,  B32B2551/00 ,  H01L33/483 ,  H01L2933/0091

    摘要： A first light-blocking member (10) and a second light-blocking member (30) are adhered to each other by forming a light-transmitting layer having a light-transmitting composition (21) serving as a base material and a light-transmitting filler (22) different in index of refraction from this light-transmitting composition (21) on a front surface of the first light-blocking member (10), applying a liquid light curing adhesive to a front surface (20a) of the light-transmitting layer (20), arranging the second light-blocking member (30) on the front surface (20a) of the light-transmitting layer (20) to which the liquid light curing adhesive has been applied, curing the liquid light curing adhesive by irradiating the light-transmitting layer (20) with light having a prescribed wavelength laterally from a side of the light-transmitting layer (20) so as to adhere the light-transmitting layer (20) and the second light-blocking member (30) to each other. By doing so, in adhering the light-blocking members to each other by using a light curing adhesive, an adhesion operation can easily and quickly be performed while ensuring sufficient adhesion strength.

    摘要翻译： 第一遮光构件（10）和第二遮光部件（30）通过形成具有作为母材的光透过性组成物（21）和光透过性的光透射层相互粘接 填料（22）在从所述第一遮光构件（10）的前表面上该光透过性组成物（21），施加液体光固化型粘合剂的光的前表面（20a）的折射率不同的 发射层（20）中，向其中液体光固化型粘合剂已应用在透光层（20）的前表面（20A）上设置第二遮光构件（30），固化由液体光固化型粘合剂 照射从透光层（20）的一侧具有规定波长尾盘反弹光以便粘附在透光层（20）和第二遮光构件的透光层（20）（30） 海誓山盟。 通过这样做，在遮光通过使用光固化型粘合剂来粘附手术坚持成员海誓山盟可以容易且迅速地确保足够的粘合强度来进行。