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    OPTOELEKTRONISCHES MODUL
    4.
    发明公开
    OPTOELEKTRONISCHES MODUL 审中-公开
    光电模块

    公开(公告)号：EP2478557A1

    公开(公告)日：2012-07-25

    申请号：EP10752334.2

    申请日：2010-09-06

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： WEGLEITER, Walter ,  KALTENBACHER, Axel ,  BARCHMANN, Bernd ,  WEIDNER, Karl ,  REBHAN, Matthias

    IPC分类号： H01L25/075 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62

    CPC分类号： H01L33/44 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/24

    摘要： The invention relates to an optoelectronic module (100) having at least one carrier (1) with at least one contact location (1A); a semiconductor chip (2) emitting radiation, wherein the semiconductor chip (2) emitting radiation comprises a first contact surface (2A) and a second contact surface (2B); an electrically insulating layer (4) comprising a first (4A) and a second recess (4B); at least one electrically conductive conductor structure (8), wherein the first contact surface (2A) is disposed on the side of the semiconductor chip (2) emitting radiation facing away from the carrier (1), the electrically insulating layer (4) is applied at least in places to the carrier (1) and the semiconductor chip (2) comprises the first recess (4A) in the area of the first contact surface (2A) and the second recess (4B) in the area of the contact location (1A), the electrically conductive conductor structure (8) is disposed on the electrically insulating layer (4) and the first contact surface (2A) electrically contacts the contact location (1A) of the carrier (1), and the electrically insulating layer (4) is formed predominately of a ceramic material.

    OPTOELEKTRONISCHES BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG
    8.
    发明公开
    OPTOELEKTRONISCHES BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 审中-公开

    公开(公告)号：EP2617070A1

    公开(公告)日：2013-07-24

    申请号：EP11755034.3

    申请日：2011-08-22

    申请人： OSRAM Opto Semiconductors GmbH

    发明人： WEIDNER, Karl ,  RAMCHEN, Johann ,  KALTENBACHER, Axel ,  WEGLEITER, Walter ,  BARCHMANN, Bernd

    IPC分类号： H01L33/38 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L23/055

    CPC分类号： H01L33/60 ,  H01L23/055 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/24 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

    摘要： An optoelectronic component is specified, comprising a carrier (3), which has a first (1) and a second connection region (2), and comprising a radiation-emitting semiconductor chip (4), which has a base surface (5) and a radiation exit surface (6), opposite the base surface, wherein the semiconductor chip (4) is arranged by the base surface (5) on the carrier (3). Furthermore, the optoelectronic component comprises a housing (10) having a lower housing part (8), which adjoins side flanks (14) of the semiconductor chip (4), and an upper housing part (9), which forms a reflector (15) for the radiation (16) emitted by the semiconductor chip (4). An electrical connection layer (7) is led from the radiation exit surface (6) of the semiconductor chip (4) via a part of the interface (19) between the lower (8) and the upper housing part (9) and through the lower housing part (8) to the first connection region (1) on the carrier (3). An advantageous method for producing the optoelectronic component is furthermore specified.

    摘要翻译： 本发明涉及一种光电子器件，包括具有第一连接区域（1）和第二连接区域（2）的载体（3），并且包括发射辐射的半导体芯片（4），其具有基底表面（5）和 与底面相对的辐射出射面（6），其中半导体芯片（4）由底面（5）布置在载体（3）上。 此外，光电子器件包括具有邻接半导体芯片（4）的侧面（14）的下壳体部件（8）和形成反射器（15）的上壳体部件（9）的壳体（10） ）用于由半导体芯片（4）发射的辐射（16）。 电连接层（7）从半导体芯片（4）的辐射出射表面（6）经由下部壳体部分（8）和上部壳体部分（9）之间的界面（19）的一部分并且通过 下壳体部分（8）与载体（3）上的第一连接区域（1）连接。 此外规定了用于制造光电子器件的有利方法。