公开(公告)号：EP2517247B1

公开(公告)日：2018-09-26

申请号：EP10796386.0

申请日：2010-12-21

Applicant: Pyreos Ltd.

Inventor： LAIRD, Ron ,  FREEBORN, Scott ,  STEWART, Archie, Shaw

IPC: H01L27/146 ,  H01L23/00 ,  H05K3/34 ,  H01L31/101 ,  H01L31/18 ,  H01L31/0203

CPC classification number: H01L27/1465 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14649 ,  H01L27/1469 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/18 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/15312 ,  H05K3/34 ,  H05K3/341 ,  H05K2201/09036 ,  H05K2201/10318 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP2517247A1

公开(公告)日：2012-10-31

申请号：EP10796386.0

申请日：2010-12-21

Applicant: Pyreos Ltd.

Inventor： LAIRD, Ron ,  FREEBORN, Scott ,  STEWART, Archie, Shaw

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/1465 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14649 ,  H01L27/1469 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/18 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/15312 ,  H05K3/34 ,  H05K3/341 ,  H05K2201/09036 ,  H05K2201/10318 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for producing an infrared light detector (1) has the steps of: providing a plurality of connection pins (11, 12), which are kept parallel to one another and arranged with one of the longitudinal ends (17, 18) thereof in a horizontal plane, and a printed circuit board (6) with a planar underside (8), in which a recess (15, 16) of the same form in each case is provided for each of the connection pins (11, 12); filling the recesses (15, 16) with a solder paste, so that in each of the recesses (15, 16) there is a solder paste body (21) with the same amount of solder paste; positioning the printed circuit board (6) over the connection pins (11, 12), so that each of the connection pins (11, 12) extends with its longitudinal end (17, 18) in the recess (15, 16) assigned to it and dips in the solder paste body (21) located in the respective recess (15, 16); liquefying the solder paste bodies (21), so that electrically conducting connections are formed between the connection pins (11, 12) and the solder paste bodies (21) and, on account of the surface tension in the solder paste bodies (21) and the dead weight of the printed circuit board (6), the underside (8) of the printed circuit board (6) is aligned parallel to the horizontal plane; solidifying the solder paste bodies (21), so that mechanically secure connections are formed by the solder paste bodies (21) between the printed circuit board (6) and the connection pins (11, 12) and the alignment of the underside (8) of the printed circuit board (6) parallel to the horizontal plane is fixed.