公开(公告)号：EP0626124A4

公开(公告)日：1995-11-15

申请号：EP93906970

申请日：1993-02-10

Applicant: ROCK LP

Inventor： ROBERTS JOSEPH A

IPC: H05K1/09 ,  H01R12/04 ,  H01R31/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/04 ,  H05K3/06 ,  H05K3/20 ,  H05K3/28 ,  H05K3/32 ,  H05K3/38 ,  H05K3/46 ,  H05K7/14 ,  H05K9/00 ,  H05K1/00

CPC classification number: H05K7/1451 ,  H01R31/00 ,  H05K1/036 ,  H05K3/045 ,  H05K3/281 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4647 ,  H05K9/0039 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0715 ,  H05K2203/025 ,  H05K2203/063 ,  Y10T29/49083 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49217 ,  Y10T29/49222 ,  Y10T29/49906

Abstract: A supported conductive network (SCN), which can be flexible or rigid, can have self-aligning conductors (14) which connect with corresponding conductors (6) of other networks. The conductive network (10) can be fabricated into densely packed contact clusters for use as electrical interconnectors or circuits. The method and apparatus for making the conductive network (10) involve forming a sheet of conduct material (22) into ridges (24) and troughs (26) one of which defines the conductive network and the other of which is waste material and then mechanically removing the waste material. The conductive network thus formed is supported by a dielectric layer (12).