公开(公告)号：EP3258459A1

公开(公告)日：2017-12-20

申请号：EP17160072.9

申请日：2017-03-09

Applicant: Revolution Display, LLC

Inventor： Hochman, Jeremy

IPC: G09F9/30 ,  G09F9/302 ,  G09F9/33 ,  G09F19/22 ,  G06F3/14 ,  H01R12/70

CPC classification number: H05K7/1458 ,  F21S2/005 ,  F21V21/02 ,  F21V33/006 ,  G06F3/1446 ,  G06F3/16 ,  G09F9/30 ,  G09F9/3026 ,  G09F9/33 ,  G09F19/22 ,  H01R12/7076 ,  H04R1/028 ,  H05K7/1401 ,  H05K7/1451 ,  H05K7/1452

Abstract: Architectural tiled panel systems (100) composed of at least one sensory output tile module (120) and a plurality of non-sensory-output tile modules (124). Each sensory output tile module (120) includes any one or more of a variety of electronic devices, such as a video display device (104), an audio speaker (208), and an illumination device (304), e.g., an LED or light bulb, among others. Each non-sensory-output module (124) includes a presentation face that is visually appealing. The non-sensory-output tile modules (124) can be used to provide aesthetic surrounds for each of one or more sensory output tile modules (120) and/or groups of sensory output tile modules (120). In some embodiments, a plurality of video display type sensory output tile modules (104) are grouped together and controlled to provide a larger mosaicked video display (104). In some embodiments, abutting tile modules are secured together using connectors (1500) having a latch mechanism (1508) for each tile module connected thereby.

Abstract translation: 由至少一个传感输出瓦片模块（120）和多个非感官输出瓦片模块（124）组成的建筑瓦片面板系统（100）。 每个传感输出瓦片模块（120）包括诸如视频显示装置（104），音频扬声器（208）和照明装置（304）等各种电子装置中的任何一个或多个，例如LED或 灯泡，等等。 每个非感官输出模块（124）包括视觉上吸引人的呈现面。 非感官输出瓦片模块（124）可用于为一个或多个感官输出瓦片模块（120）和/或感觉输出瓦片模块（120）组中的每一个提供美学环绕。 在一些实施例中，多个视频显示器类型感测输出瓦片模块（104）被组合在一起并被控制以提供更大的马赛克视频显示器（104）。 在一些实施例中，邻接瓦片模块使用具有用于由其连接的每个瓦片模块的闩锁机构（1508）的连接器（1500）固定在一起。

公开(公告)号：EP1597949A1

公开(公告)日：2005-11-23

申请号：EP04709859.5

申请日：2004-02-10

Applicant: Honeywell International Inc.

Inventor： HOCKETT, John, E.

IPC: H05K7/14

CPC classification number: G06F1/185 ,  G06F1/181 ,  G06F1/184 ,  G06F1/186 ,  H05K1/144 ,  H05K1/147 ,  H05K1/148 ,  H05K7/1451 ,  H05K7/1454 ,  H05K2201/042 ,  H05K2201/10189

Abstract: An electronics chassis box includes a pair of opposing sidewalls, a pair of opposing end walls, a bottom surface, a top cover, and ring connectors assemblies (44, 46, 48, 50, 52) mounted in selective ones of the walls of the electronic box. Boss members (24, 26, 28, 30, 32, 34) extend from the bottom surface at different heights upon which circuit cards (36, 36, 40, 42) are mounted in spatial relationship to each other. A flex interconnect substantially reduces and generally eliminates the need of a motherboard by interconnecting the circuit cards to one another and to external connectors mounted within the ring connector assemblies.

公开(公告)号：EP0806127B1

公开(公告)日：2002-06-05

申请号：EP95943682.5

申请日：1995-12-07

Applicant: RESEARCH ORGANIZATION FOR CIRCUIT KNOWLEDGE

Inventor： ROBERTS, Joseph, A.

IPC: H05K3/04

CPC classification number: H01R31/00 ,  H05K1/036 ,  H05K3/045 ,  H05K3/281 ,  H05K3/328 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4647 ,  H05K7/1451 ,  H05K9/0039 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0715 ,  H05K2203/025 ,  H05K2203/063 ,  Y10T29/49155

Abstract: A process and apparatus for producing supported conductive networks (1) which can be flexible or rigid, having densely packed circuits (3). The process and apparatus for making the conductive network (1) involves forming a conductive material (8) supported on a 'dynamic pressure cushion' into a non-planar pattern defining the desired conductive circuits (3) in relation to a fixed reference plane (32). The 'dynamic pressure cushion' is a material having suitable viscosity and flow characteristics to flow out from under the conductive material (8) as it is being formed and fill up any voids. To ensure that the 'dynamic pressure cushion' properly flows without deforming the desired circuits (3), the die (6) used to form the conductive material (8) is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane (32) leaving the desired conductive circuits (3).

公开(公告)号：EP0279906A3

公开(公告)日：1988-12-28

申请号：EP87115180

申请日：1987-10-16

Applicant: International Business Machines Corporation

Inventor： Ansell, Daniel Frederick ,  Harris, James Coleman ,  Howell, Steven Ernest ,  Miller, Michael Sven ,  Wysong, Robert D.

IPC: H05K07/14 ,  G06F13/40

CPC classification number: G06F13/409 ,  H05K7/1451

Abstract: In a low profile microcomputer, adapter cards are mounted hori­zontally in order to be able to use adapter cards designed for earlier, higher, machines. The cards are coupled to the microcomputer planar board by an extender card which extends vertically from the planar and has sockets extending horizontally when the card is in position. The adapter cards have edge connections which couple to these sockets. A removable bridge device is coupled between the top of the extender card and a vertical wall of the microcomputer to minimize horizontal movement of the extender card. For adapter cards which do not extend fully between the front and rear walls of the microcomputer, a channelled support arm, which fits over an end of a card, and is removably mounted on a vertical wall of the computer for slidable engagement with the card.

公开(公告)号：EP0213205A1

公开(公告)日：1987-03-11

申请号：EP86900263.4

申请日：1985-12-24

Applicant: MICRO CO., LTD.

Inventor： NAKANO, Tsuyoshi

IPC: H05K7/06 ,  H05K1/14 ,  H01R23/68

CPC classification number: H05K1/144 ,  H01R12/523 ,  H05K7/1451 ,  Y10T29/49126

Abstract: A method in which printed circuit boards of a number of N (N is an integer not less than 3), each formed in the same size and shape of a regular polygon with N sides, are plurally stacked in a high density on a mother board. The mother board has a first connector which corresponds to a side of the regular N-gonal printed circuit board, and has N second connectors for selecting the printed circuit board for every 360°/N turn with the center of the regular N-gon as a center of rotation. In a first connector are arranged terminals for a data bus signal line, an address bus signal line, and a data readings writing timing signal line. Each of the N printed circuit boards has a third connector on one side of the regular N-gon on one surface of the circuit board, has a fourth connector on a side next to the side of the third connector on the opposite surface of the circuit board, and further has N fifth connectors on both surfaces thereof penetrating therethrough for coupling to the second connectors at positions corresponding to N second connectors of the mother board. The terminals of the fourth connector are respectively connected to the corresponding terminals of the third connector on the circuit board. The N printed circuit boards are stacked and mounted on the mother board each being turned by one side. The fourth connector is coupled to the first connector of the mother board via the third connector of the printed circuit board. To the fourth connector is further coupled the third connector of the next printed circuit board. A select signal from the second connector of the mother board is transmitted via the fifth connector to select a predetermined circuit board among the N printed circuit boards that are stacked.

公开(公告)号：EP2741594A1

公开(公告)日：2014-06-11

申请号：EP13770617.2

申请日：2013-04-07

Applicant: Huawei Technologies Co., Ltd.

Inventor： BAI, Lei ,  AO, Feng ,  LUO, Fei

IPC: H05K7/14

CPC classification number: H05K7/1451 ,  H05K7/1441 ,  H05K7/1445

Abstract: Embodiments of the present invention disclose a backplane, a cabinet-level communication device, and a method for replacing a backplane, relate to the field of mobile communication technologies, and can greatly reduce difficulty in replacing a backplane while ensuring stability of a connection between the backplane and a front board or a rear board. The backplane includes: a base plate of a stripe structure; one or more first connectors arranged on a first face of the base plate and configured to connect a corresponding connector on a front board; and one or more second connectors arranged on a second face of the base plate opposite to the first face and configured to connect a corresponding connector on a rear board. The backplane is fixed and arranged in a detachable manner on the rear board or the front board and can be plugged or unplugged along with the rear board that fixes the backplane or the front board that fixes the backplane. The rear board is connected to the front board in an orthogonal connection manner through the backplane.

Abstract translation: 本发明的实施例公开了背板，机柜级通信装置和用于替换背板的方法，涉及移动通信技术领域，并且可以极大地降低更换背板的难度，同时确保在背板之间的连接的稳定性 背板和前板或后板。 背板包括：条状结构的基板; 一个或多个第一连接器，其布置在所述基板的第一面上并且被配置为连接前板上的对应连接器; 以及一个或多个第二连接器，其布置在所述基板的与所述第一面相对的第二面上并且被配置为连接后板上的相应连接器。 背板固定并可拆卸地布置在后板或前板上，并且可以与固定背板或固定背板的前板的后板一起插拔。 后板通过背板以正交连接的方式连接到前板。

公开(公告)号：EP1039583A3

公开(公告)日：2001-04-11

申请号：EP00104036.9

申请日：2000-02-26

Applicant: STN ATLAS Elektronik GmbH

Inventor： Renken, Klaus ,  Schröder, Rainer

IPC: H01R12/08 ,  H05K7/14

CPC classification number: H01R12/79 ,  H05K7/1451

Abstract: Eine Signalverarbeitungseinheit weist eine Busplatine (10) mit standardisiertem Datenbus und Steckplätzen (11, 12) zum Aufstecken von Baugruppenträgern und für die Bereitstellung zusätzlicher Transferleistung eine Zusatzplatine (13) auf, die eine integrierte Sonderverdrahtung und eine Mehrzahl von in Steckplätze (12) der Busplatine (10) einsteckbaren, voneinander beabstandet aufgereihten Steckerleisten (14) trägt. Zwecks Gestaltung der Zusatzplatine (13) derart, daß sie ohne Beschädigungsgefahr mit relativ geringem Kraftaufwand auf die Busplatine (10) aufgesteckt und von der Busplatine (10) wieder abgelöst werden kann, sind zumindest die zwischen den Steckerleisten (14) sich befindlichen Abschnitte (15) der Zusatzplatine (13) flexibel ausgebildet. Dadurch kann die Zusatzplatine (13) über die Busplatine (10) quasi gerollt werden, und die Steckerleisten (14) können einzeln gesteckt werden.

公开(公告)号：EP0704112B1

公开(公告)日：2000-11-29

申请号：EP94919358.5

申请日：1994-06-03

Applicant: BERG ELECTRONICS MANUFACTURING B.V.

Inventor： YODOGAWA, Akihiro

IPC: H01R13/627 ,  H01R12/18 ,  H01R12/20 ,  H01R12/22

CPC classification number: H05K7/1451 ,  H01R12/707 ,  H01R12/712

Abstract: An electrical connector (2) for interconnecting a plurality of printed circuit boards or the like. A circuit board (6) is disposed in a recess (22) in the connector housing such that the circuit board is electrically interconnected to another circuit board (4) on which the connector is mounted. A latch (28) provides a retentive force for maintaining the circuit board in the recess of the connector housing. Actuation of a lever (48) coupled with the latch provides an effective force to disengage the latch from the circuit board such that the circuit board can be removed from the connector housing. A projection (42) can be provided on a latch-forming member for securing the connector on a circuit board or thelike.

Abstract translation: 一种用于互连多个印刷电路板或类似物的电连接器（2）。 电路板（6）设置在连接器壳体中的凹槽（22）中，使得电路板电互连到安装有连接器的另一电路板（4）。 闩锁（28）提供用于将电路板保持在连接器壳体的凹部中的保持力。 与闩锁耦合的杠杆（48）的致动提供有效力以使闩锁与电路板脱离，使得电路板可从连接器壳体移除。 突起（42）可以设置在闩锁形成构件上，用于将连接器固定在电路板等上。

公开(公告)号：EP0617851B1

公开(公告)日：1995-11-22

申请号：EP93902017.8

申请日：1993-01-28

Applicant: MELCHER AG

Inventor： GAMMENTHALER, Peter

IPC: H01R9/00

CPC classification number: H05K7/1451 ,  H01R12/707 ,  H01R12/722

Abstract: Proposed is a socket (1) which forms part of a flat-pin connector designed for 19' racks. Mounted on it by means of soldering tabs (3) is a standard circuit board (2) which is fitted in a housing (9). The housing (9) has two parallel walls (13, 14) and is closed off from the socket by a half-frame (16). The part of the socket (1) facing towards the circuit board (2) has a central section (6) which not only carries the soldering tabs (3) but also acts as a stop for the circuit board (2). The dimensions and position of this central section (6) are such that the housing wall (13) which covers the solder side of the circuit board does not extend out more than a distance R^- defined by the distance between the pin array and the side of the socket (1), so that the whole of the rest of the width comprising n^- distances R^- is available for components and the other wall (14). The space available for components can be further increased by providing over the shoulder (10) as recess (12) which allows the circuit board (2) to be mechanically fixed in place by means of rivets or bolts passing through a hole (11).

公开(公告)号：EP0279906B1

公开(公告)日：1992-05-06

申请号：EP87115180.9

申请日：1987-10-16

Applicant: International Business Machines Corporation

Inventor： Ansell, Daniel Frederick ,  Harris, James Coleman ,  Howell, Steven Ernest ,  Miller, Michael Sven ,  Wysong, Robert D.

IPC: H05K7/14 ,  G06F13/40

CPC classification number: G06F13/409 ,  H05K7/1451