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    High temperature pressure sensor
    2.
    发明公开
    High temperature pressure sensor 有权
    Hochtemperaturdrucksensor

    公开(公告)号：EP2899524A1

    公开(公告)日：2015-07-29

    申请号：EP14199793.2

    申请日：2014-12-22

    Applicant: ROSEMOUNT AEROSPACE INC.

    Inventor： Fahimi, Saeed ,  Eriksen, Odd Harald Steen ,  Little, Charles ,  Fink, Anita

    IPC: G01L19/00

    CPC classification number: G01L19/0681 ,  B81B2201/0264 ,  G01L19/0069 ,  G01L19/0084

    Abstract: A pressure sensor assembly (100) includes a pressure sensor (101) having a pressure sensing transducer connected to a plurality of electrode pins (103) via a plurality of electrode pads (105) disposed on the transducer, an inner casing (107) configured to hold the pressure sensing transducer including a plurality of inner casing electrode pin channels (111) having the electrode pins disposed therein. The pressure sensor further includes an outer casing (115) holding the inner casing therein having a capsule header (117) with a plurality of capsule header electrode pin channels (119) defined therein which can include a ceramic seal (133) disposed therein such that the capsule header electrode pin channels engage the electrode pins in an insulating sealed relationship. The outer casing further includes an isolator plate (127) including an isolator plate fluid port (129) defined therein and a pressure isolator (131) disposed on the isolator plate and configured to deflect in response to a change in ambient pressure. The pressure sensor includes a pressure transmitting fluid disposed in the fluid volume.

    Abstract translation: 压力传感器组件（100）包括压力传感器（101），压力传感器（101）具有通过设置在换能器上的多个电极焊盘（105）连接到多个电极引脚（103）的压力感测传感器，内部壳体（107） 以保持包括多个内壳电极引脚通道（111）的压力感测传感器，其中设置有电极引脚。 该压力传感器还包括一个外壳（115），其内部容纳有内壳，该壳体具有胶囊集管（117），胶囊集管（117）具有限定在其中的多个胶囊集管电极销通道（119），其中可包括设置在其中的陶瓷密封件（133） 胶囊头电极针通道以绝缘密封的关系接合电极销。 外壳还包括隔离板（127），隔离板包括限定在其中的隔离板流体端口（129）和设置在隔离板上的压力隔离器（131），并被配置为响应于环境压力的变化而偏转。 压力传感器包括设置在流体体积中的压力传递流体。

    Capacitive sensors for monitoring load bearing on pins
    3.
    发明公开
    Capacitive sensors for monitoring load bearing on pins 有权
    用于监测对销的承载能力的电容式传感器

    公开(公告)号：EP2420447A3

    公开(公告)日：2015-02-25

    申请号：EP11250729.8

    申请日：2011-08-16

    Applicant: Rosemount Aerospace Inc.

    Inventor： Eriksen, Odd Harald Steen ,  Spivak, Alexander ,  Sanden, Christopher

    IPC: B64D29/06 ,  E05B41/00 ,  E05B51/02 ,  G01L1/14

    CPC classification number: B64D29/06 ,  E05B41/00 ,  E05B2047/0069 ,  E05C19/14 ,  G01L1/142 ,  G01L5/0004 ,  Y10T292/0949

    Abstract: A sensor (100) for monitoring external loads acting on a pin assembly includes a pin (24) having an axial interior bore defined therein and having a length defined from a first end to an opposed second end thereof. A core pin is mounted axially within the interior bore of the pin spaced radially inwardly from the interior bore for relative displacement with respect to the pin. A capacitor (108) is provided having an inner capacitor plate (118) mounted to the core pin (106), and an outer capacitor plate (114) mounted to the pin (24), such that relative displacement of the core and the pin (24) due to external loading on the pin (24) results in relative displacement of the inner and outer capacitor plates (118,114). The capacitor (108) is configured and adapted to be connected to an electrical circuit (110) to produce signals indicative of external loading on the pin based on relative displacement of the inner and outer capacitor plates (118,114).

    Substrate with a metallization bonding layer
    4.
    发明公开
    Substrate with a metallization bonding layer 有权
    具有金属化粘合层的基板

    公开(公告)号：EP1722004A1

    公开(公告)日：2006-11-15

    申请号：EP06112158.8

    申请日：2006-04-03

    Applicant: ROSEMOUNT AEROSPACE INC.

    Inventor： Eriksen, Odd Harald Steen ,  Childress, Kimiko

    IPC: C23C14/02 ,  C23C14/06 ,  C23C30/00

    CPC classification number: C23C14/022 ,  C23C14/021 ,  C23C14/025 ,  C23C14/0682 ,  C23C14/5806 ,  C23C14/5846 ,  C23C14/5873 ,  H01L24/13 ,  H01L2224/05171 ,  H01L2224/05181 ,  H01L2224/05186 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/0496 ,  H01L2924/01032

    Abstract: A metallization layer that consists of a tantalum layer located on the component, a tantalum silicide layer located on the tantalum layer, and a platinum silicide layer located on the tantalum silicide layer. In another embodiment the invention is a component having a metallization layer on the component. In another embodiment, the metallization layer has a post-annealing adhesive strength to silicon of at least about 100 MPa as measured by a mechanical shear test after exposure to a temperature of about 600°C for about 30 minutes, and the metallization layer remains structurally intact after exposure to a temperature of about 600°C for about 1000 hours. The metallization is useful for bonding with brazing alloys.

    Abstract translation: 由位于元件上的钽层，位于钽层上的钽硅化物层和位于钽硅化物层上的硅化铂层组成的金属化层。 在另一个实施例中，本发明是在部件上具有金属化层的部件。 在另一个实施例中，在暴露于约600℃的温度约30分钟后，通过机械剪切测试测量，金属化层对硅的后退火粘合强度为至少约100MPa，并且金属化层保持结构上 暴露于约600℃的温度约1000小时后完好无损。 金属化对于与钎焊合金结合是有用的。

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