公开(公告)号：EP1722004A1

公开(公告)日：2006-11-15

申请号：EP06112158.8

申请日：2006-04-03

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： Eriksen, Odd Harald Steen ,  Childress, Kimiko

IPC: C23C14/02 ,  C23C14/06 ,  C23C30/00

CPC classification number: C23C14/022 ,  C23C14/021 ,  C23C14/025 ,  C23C14/0682 ,  C23C14/5806 ,  C23C14/5846 ,  C23C14/5873 ,  H01L24/13 ,  H01L2224/05171 ,  H01L2224/05181 ,  H01L2224/05186 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/0496 ,  H01L2924/01032

Abstract: A metallization layer that consists of a tantalum layer located on the component, a tantalum silicide layer located on the tantalum layer, and a platinum silicide layer located on the tantalum silicide layer. In another embodiment the invention is a component having a metallization layer on the component. In another embodiment, the metallization layer has a post-annealing adhesive strength to silicon of at least about 100 MPa as measured by a mechanical shear test after exposure to a temperature of about 600°C for about 30 minutes, and the metallization layer remains structurally intact after exposure to a temperature of about 600°C for about 1000 hours. The metallization is useful for bonding with brazing alloys.

Abstract translation: 由位于元件上的钽层，位于钽层上的钽硅化物层和位于钽硅化物层上的硅化铂层组成的金属化层。 在另一个实施例中，本发明是在部件上具有金属化层的部件。 在另一个实施例中，在暴露于约600℃的温度约30分钟后，通过机械剪切测试测量，金属化层对硅的后退火粘合强度为至少约100MPa，并且金属化层保持结构上 暴露于约600℃的温度约1000小时后完好无损。 金属化对于与钎焊合金结合是有用的。

公开(公告)号：EP1722004B1

公开(公告)日：2007-11-14

申请号：EP06112158.8

申请日：2006-04-03

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： Eriksen, Odd Harald Steen ,  Childress, Kimiko

IPC: C23C14/02 ,  C23C14/06 ,  C23C30/00

CPC classification number: C23C14/022 ,  C23C14/021 ,  C23C14/025 ,  C23C14/0682 ,  C23C14/5806 ,  C23C14/5846 ,  C23C14/5873 ,  H01L24/13 ,  H01L2224/05171 ,  H01L2224/05181 ,  H01L2224/05186 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/0496 ,  H01L2924/01032

公开(公告)号：EP1720204B1

公开(公告)日：2019-06-05

申请号：EP06112160.4

申请日：2006-04-03

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： Eriksen, Odd Harald Steen ,  Guo, Shuwen ,  Childress, Kimiko

IPC: H01L21/762

公开(公告)号：EP1720204A1

公开(公告)日：2006-11-08

申请号：EP06112160.4

申请日：2006-04-03

Applicant: ROSEMOUNT AEROSPACE INC.

Inventor： Eriksen, Odd Harald Steen ,  Guo, Shuwen ,  Childress, Kimiko

IPC: H01L21/762

CPC classification number: H01L24/83 ,  H01L21/7624 ,  H01L24/26 ,  H01L2224/83141 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8385 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1461 ,  Y10T428/13 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/83205

Abstract: A method for bonding two components together including the steps of providing a first component, providing a second component, and locating a first eutectic bonding material between the first and second component. The first eutectic bonding material includes at least one of germanium, tin, or silicon. The method further includes the step of locating a second eutectic bonding material between the first and second component and adjacent to the first eutectic bonding material. The second eutectic bonding material includes gold. The method further includes the step of heating the first and second eutectic bonding materials to a temperature above a eutectic temperature of an alloy of the first and second eutectic bonding materials to allow a hypoeutectic alloy to form out of the first and second eutectic bonding materials. The method includes the further step of cooling the hypoeutectic alloy to form a solid solution alloy bonding the first and second components together.

Abstract translation: 一种用于将两个部件结合在一起的方法，包括提供第一部件，提供第二部件以及在第一和第二部件之间定位第一共晶接合材料的步骤。 第一共晶接合材料包括锗，锡或硅中的至少一种。 该方法还包括在第一和第二部件之间并与第一共晶接合材料相邻定位第二共晶接合材料的步骤。 第二共晶接合材料包括金。 该方法还包括将第一和第二共晶接合材料加热到高于第一和第二共晶接合材料的合金的共晶温度的温度以允许亚共晶合金从第一和第二共晶接合材料形成的步骤。 该方法包括进一步冷却亚共晶合金以形成将第一和第二组分结合在一起的固溶体合金。