公开(公告)号：EP3932989A1

公开(公告)日：2022-01-05

申请号：EP21179645.3

申请日：2021-06-15

申请人： Rohm and Haas Electronic Materials LLC

发明人： GALLAGHER, Michael K. ,  KONDOH, Masaki ,  JOO, Jake ,  SHEN, Yi ,  ZHANG, Zhebin

IPC分类号： C08L45/00 ,  G02B6/122

摘要： Compositions for forming polymer layers useful in the manufacture of optical devices, particularly optical waveguides, and methods of forming such devices are provided.

公开(公告)号：EP3065166A1

公开(公告)日：2016-09-07

申请号：EP16150925.2

申请日：2016-01-12

申请人： Rohm and Haas Electronic Materials LLC ,  Dow Global Technologies LLC

发明人： OLIVER, Mark S. ,  BAI, Zhifeng ,  GALLAGHER, Michael K.

IPC分类号： H01L21/683 ,  H01L23/00

CPC分类号： C09J11/06 ,  C09J4/00 ,  H01L21/6835 ,  H01L24/10 ,  H01L24/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/13147 ,  H01L2224/13647

摘要： Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.

摘要翻译： 含有粘合剂材料，脱模添加剂和铜钝化剂的组合物适合于暂时粘合两个表面，例如半导体衬底活性侧和载体衬底。 这些组合物可用于制造电子器件，其中期望将组分临时粘合到具有铜表面的基底上。

公开(公告)号：EP3078697A1

公开(公告)日：2016-10-12

申请号：EP16150654.8

申请日：2016-01-08

申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC

发明人： BAI, Zhifeng ,  GALLAGHER, Michael K. ,  WANG, Zidong ,  TUCKER, Christopher J ,  BISHOP, Matthew T. ,  LAGODKINE, Elissei ,  OLIVER, Mark S.

IPC分类号： C08G61/02 ,  C08G61/12 ,  C08L65/00 ,  C08L71/02 ,  C09J165/00

CPC分类号： C09D143/04 ,  B05D3/007 ,  B05D3/10 ,  C08G61/02 ,  C08G61/12 ,  C08G2261/3424 ,  C08G2261/344 ,  C08G2261/65 ,  C08L25/10 ,  C08L25/16 ,  C08L27/06 ,  C08L51/04 ,  C08L51/06 ,  C08L51/08 ,  C08L63/00 ,  C08L71/02 ,  C09D5/00 ,  C09D7/65 ,  C09J165/00 ,  H01L21/6835 ,  H01L2221/68318 ,  H05K3/285 ,  C08L65/00

摘要： Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

摘要翻译： 提供了具有改善的韧性的芳基环丁烯聚合物。 还提供了用于涂覆具有改善的韧性的芳基环丁烯聚合物的组合物和方法。

公开(公告)号：EP2942668A1

公开(公告)日：2015-11-11

申请号：EP15171505.9

申请日：2007-03-09

申请人： Rohm and Haas Electronic Materials LLC

发明人： GALLAGHER, Michael K. ,  WANG, Deyan

IPC分类号： G03F7/11 ,  G03F7/20 ,  G03F7/095 ,  G03F7/039 ,  G03F7/004

CPC分类号： G03F7/2041 ,  G03F7/0046 ,  G03F7/0392 ,  G03F7/095 ,  G03F7/11

摘要： Overcoating layer compositions are provided that are applied above a photoresist composition including for immersion lithography processing as well as non-immersion imaging.

摘要翻译： 提供覆盖层组合物，其被涂覆在包括用于浸没式光刻处理以及非浸没成像的光致抗蚀剂组合物上。

公开(公告)号：EP3961277A1

公开(公告)日：2022-03-02

申请号：EP21192464.2

申请日：2021-08-20

申请人： Rohm and Haas Electronic Materials LLC ,  DuPont Electronics, Inc.

发明人： GALLAGHER, Michael K. ,  KONDO, Masaki ,  JOO, Jake ,  RYLEY, James F. ,  SHEN, Yi ,  WILLIAMSON, Curtis ,  ZHANG, Zhebin

IPC分类号： G02B6/122 ,  G02B6/136 ,  G02B6/138 ,  G02B6/12

摘要： Provided is an optical waveguide comprising a core surrounded by a cladding, wherein the core is in the shape of a trapezoid with sidewall angles between 60° and 85° and an optoelectronic circuit comprising the optical waveguide. Operational characteristics of the optical waveguide are shown to be superior to those of incumbent devices.

公开(公告)号：EP3492444B1

公开(公告)日：2020-07-08

申请号：EP18209684.2

申请日：2018-11-30

申请人： Rohm and Haas Electronic Materials LLC

发明人： HAYES, Colin ,  GALLAGHER, Michael K. ,  RIENER, Michelle

IPC分类号： C08F12/32 ,  C08F12/22 ,  C07C41/01 ,  C07C43/243 ,  C08F212/08

公开(公告)号：EP3144359A1

公开(公告)日：2017-03-22

申请号：EP16187630.5

申请日：2016-09-07

申请人： Dow Global Technologies LLC ,  Rohm and Haas Electronic Materials LLC ,  Rohm and Haas Company

发明人： ROMER, Duane R. ,  YONKEY, Matthew M. ,  GALLAGHER, Michael K. ,  WANG, Kevin Y. ,  LIU, Xiang Qian ,  THIBAULT, Raymond J. ,  HO, Kim S. ,  PROKOPOWICZ, Gregory D. ,  O'CONNOR, Corey ,  IAGODKINE, Elissei ,  BARR, Robert K.

IPC分类号： C09D165/00 ,  C09D4/06 ,  C08F283/00

CPC分类号： C09D171/02 ,  B05D7/26 ,  B32B27/281 ,  B32B27/36 ,  B32B37/14 ,  B32B38/10 ,  C07C43/1788 ,  C07C69/618 ,  C07C69/734 ,  C07C233/22 ,  C07C2602/06 ,  C08F16/32 ,  C08F20/28 ,  C08F22/20 ,  C08F22/26 ,  C08F22/38 ,  C08G2261/135 ,  C08G2261/344 ,  C08G2261/76 ,  C08J5/2256 ,  C09D4/06 ,  C09D133/14 ,  C09D133/24 ,  C09D135/00 ,  C09D135/02 ,  C09D165/00 ,  C08F283/00

摘要： Arylclobutene-containing multi-functional monomers are useful in the preparation of arylcyclobutene-based polymer coatings. Compositions comprising one or more arylclobutene-containing multi-functional monomers and one or more oligomers comprising as polymerized units one or more arylcyclobutene monomer provide arylcyclobutene-based polymer coatings having reduced stress. Such compositions are useful in the manufacture of electronic devices.

摘要翻译： 含芳基环丁烯的多官能单体可用于制备芳基环丁烯基聚合物涂料。 包含一种或多种含芳基环丁烯的多官能单体和一种或多种包含一种或多种芳基环丁烯单体作为聚合单元的低聚物的组合物提供了具有降低的应力的基于芳基环丁烯的聚合物涂层。 这种组合物可用于制造电子器件。

公开(公告)号：EP3808877A3

公开(公告)日：2021-07-21

申请号：EP20199122.1

申请日：2020-09-29

申请人： Rohm and Haas Electronic Materials LLC

发明人： LIFSCHITZ ARRIBIO, Alejo M. ,  PRANGE, Jonathan D. ,  GALLAGHER, Michael K. ,  ZIELINSKI, Alexander ,  GOMEZ, Luis A. ,  LACHOWSKI, Joseph F.

IPC分类号： C25D5/34 ,  C25D3/38 ,  C25D7/12 ,  C23F1/00 ,  C25D5/00

摘要： Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

公开(公告)号：EP3825342A1

公开(公告)日：2021-05-26

申请号：EP20206558.7

申请日：2020-11-09

申请人： Rohm and Haas Electronic Materials LLC

发明人： RACHFORD, Aaron A. ,  KINZIE, Charles R. ,  GALLAGHER, Michael K. ,  GILMORE, Christopher ,  KIM, Young-Seok

IPC分类号： C08G61/12

摘要： Disclosed is a bis-imide compound comprising two or more aryl moieties substituted with ethynyl moieties and the two or more aryl moieties each having one or more polar substituents. Further disclosed is a polymer composition comprising a copolymer polymerized from a monomer mixture of (a) one or more first monomers comprising a bis-imide compound comprising two or more aryl moieties substituted with ethynyl moieties and the two or more aryl moieties each having one or more polar substituents; and (b) one or more second monomers comprising two or more cyclopentadienone moieties. The polymer compositions exhibit favorable properties for use in electronics and displays applications.

公开(公告)号：EP3480223A1

公开(公告)日：2019-05-08

申请号：EP18204009.7

申请日：2018-11-01

申请人： Rohm and Haas Electronic Materials LLC

发明人： HAYES, Colin ,  AOUDE, Tina ,  BARR, Robert K. ,  FLEMING, David ,  GALLAGHER, Michael K. ,  PROKOPOWICZ, Gregory D. ,  RIENER, Michelle

IPC分类号： C08F212/32 ,  C08F212/08 ,  C08F220/18 ,  C08F226/06 ,  C09D125/02

摘要： The present invention provides a low temperature polymerizing and curing polymer composition comprising, in copolymerized form, one or more addition polymerizable arylcyclobutene monomers A having as a cyclobutene ring substituent one or more groups chosen from alkyl; heteroatom containing alkyl; aryl; heteroatom containing aryl; or heteroatom containing aryloxy, one or more aromatic addition polymerizable second monomers, and one or more other addition polymerizable monomers chosen from an addition polymerizable nitrogen heterocycle containing third monomer, an addition polymerizable fourth monomer, or, preferably, both of the one or more third monomers and the one or more fourth monomers. The polymer compositions find use in making films or coatings for use in electronics applications.