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公开(公告)号：EP1762640A2
公开(公告)日：2007-03-14
申请号：EP06254660.1
申请日：2006-09-07
发明人： Lau, Danny , Kwok, Raymund W.M.
CPC分类号： C25D5/505 , C23C18/1651 , C23C18/1653 , C23C18/32 , C23C28/021 , C23C28/023 , C23C28/028 , C25D5/14 , H01L23/49582 , H01L23/498 , H01L24/10 , H01L24/13 , H01L24/45 , H01L2224/13 , H01L2224/13099 , H01L2224/2919 , H01L2224/29339 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01R13/03 , H05K3/244 , Y10S428/929 , Y10S428/939 , Y10T428/12722 , Y10T428/1291 , Y10T428/24917 , H01L2924/0665 , H01L2224/48 , H01L2924/00
摘要： Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates.
摘要翻译： 披露了方法和文章。 这些方法旨在在衬底上沉积镍双相层以抑制锡和锡合金的表面氧化并提高衬底的可焊性。
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公开(公告)号：EP1762641A3
公开(公告)日：2008-05-07
申请号：EP06254661.9
申请日：2006-09-07
发明人： Lau, Danny , Kwok, Raymund W. M.
CPC分类号： C25D5/505 , C23C18/1651 , C23C18/1653 , C23C18/32 , C23C28/021 , C23C28/023 , C23C28/028 , C25D5/14 , H01L23/49582 , H01L23/498 , H01L24/10 , H01L24/13 , H01L24/45 , H01L2224/13 , H01L2224/13099 , H01L2224/2919 , H01L2224/29339 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01R13/03 , H05K3/244 , Y10S428/929 , Y10S428/939 , Y10T428/12722 , Y10T428/1291 , Y10T428/24917 , H01L2924/0665 , H01L2224/48 , H01L2924/00
摘要： Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit corrosion and improve solderability of the substrates. The substrates have a gold or gold alloy finish.
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公开(公告)号：EP1762640A3
公开(公告)日：2008-05-21
申请号：EP06254660.1
申请日：2006-09-07
发明人： Lau, Danny , Kwok, Raymund W.M.
CPC分类号： C25D5/505 , C23C18/1651 , C23C18/1653 , C23C18/32 , C23C28/021 , C23C28/023 , C23C28/028 , C25D5/14 , H01L23/49582 , H01L23/498 , H01L24/10 , H01L24/13 , H01L24/45 , H01L2224/13 , H01L2224/13099 , H01L2224/2919 , H01L2224/29339 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01R13/03 , H05K3/244 , Y10S428/929 , Y10S428/939 , Y10T428/12722 , Y10T428/1291 , Y10T428/24917 , H01L2924/0665 , H01L2224/48 , H01L2924/00
摘要： Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates.
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公开(公告)号：EP1762641A2
公开(公告)日：2007-03-14
申请号：EP06254661.9
申请日：2006-09-07
发明人： Lau, Danny , Kwok, Raymund W. M.
CPC分类号： C25D5/505 , C23C18/1651 , C23C18/1653 , C23C18/32 , C23C28/021 , C23C28/023 , C23C28/028 , C25D5/14 , H01L23/49582 , H01L23/498 , H01L24/10 , H01L24/13 , H01L24/45 , H01L2224/13 , H01L2224/13099 , H01L2224/2919 , H01L2224/29339 , H01L2224/45124 , H01L2224/45144 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01R13/03 , H05K3/244 , Y10S428/929 , Y10S428/939 , Y10T428/12722 , Y10T428/1291 , Y10T428/24917 , H01L2924/0665 , H01L2224/48 , H01L2924/00
摘要： Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit corrosion and improve solderability of the substrates. The substrates have a gold or gold alloy finish.
摘要翻译： 披露方法和文章。 该方法涉及在基底上沉积镍双相层以抑制腐蚀并改善基底的可焊性。 基材有金或金合金。
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