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公开(公告)号：EP2291444B1
公开(公告)日：2014-03-05
申请号：EP09740754.8
申请日：2009-05-21
Applicant: SABIC Innovative Plastics IP B.V.
Inventor： LI, Frank , MENG, Jiru , ZOU, David Xiangping
CPC classification number: C23C18/204 , B41M5/267 , C08K3/01 , C08K3/34 , C23C18/1641 , H05K1/0373 , H05K3/185 , H05K2201/0129 , H05K2201/0209 , H05K2201/0236 , H05K2203/107
Abstract: High dielectric constant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic base resin, a laser direct structuring additive, and at least one ceramic filler. The compositions provide a high dielectric constant, low loss tangent thermoplastic composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.
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2.发明公开IMPROVED ELECTROLESS PLATING PERFORMANCE OF LASER DIRECT STRUCTURING MATERIALS 审中-公开VERBESSERTE STROLLOSE PLATTIERUNGSLEISTUNG VON LDS-MATERIALIEN
公开(公告)号：EP2632978A1
公开(公告)日：2013-09-04
申请号：EP11785793.8
申请日：2011-10-21
Applicant: SABIC Innovative Plastics IP B.V.
Inventor： JIANG, Siguang , MENG, Jiru , ZOU, David Xiangping
IPC: C08K3/22
CPC classification number: C08K3/22 , C08K3/26 , C08K3/30 , C08K2003/2237 , C08K2003/2296 , C08K2003/265 , C08K2003/3045 , C08K2201/014
Abstract: Thermoplastic compositions that are capable of being used in a laser direct structuring process to provide enhanced plating performance and good mechanical properties. The compositions of the present invention include a thermoplastic base resin, a laser direct structuring additive and a white pigment. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.
Abstract translation: 能够用于激光直接结构化工艺以提供增强的电镀性能和良好机械性能的热塑性组合物。 本发明的组合物包括热塑性基础树脂，激光直接结构化添加剂和白色颜料。 组合物可以用于各种应用，例如个人计算机，笔记本和便携式计算机，蜂窝电话天线和其它这样的通信设备，医疗应用，RFID应用和汽车应用。
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公开(公告)号：EP2291290A1
公开(公告)日：2011-03-09
申请号：EP09750255.3
申请日：2009-05-21
Applicant: SABIC Innovative Plastics IP B.V.
Inventor： LI, Frank , MENG, Jiru , ZOU, David Xiangping
CPC classification number: C08L55/02 , B41M5/24 , B41M5/267 , C08K3/22 , C08K5/5399 , C08L69/00 , C08L2666/14 , C08L2666/02 , C08L2666/24
Abstract: Flame retardant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic resin, a laser direct structuring additive, and a flame retardant. The compositions offer flame retardant characteristics while also substantially maintaining the mechanical properties of the base thermoplastic resin, such as the impact strength and/or HDT of the composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone and other such communications equipment.
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Patent Agency Ranking
公开(公告)号：EP2046892A2
公开(公告)日：2009-04-15
申请号：EP07871004.3
申请日：2007-07-09
Applicant: Sabic Innovative Plastics IP B.V.
Inventor： LI, Gang , LIN, Ye-Gang , MIYAKE, Hiroshi , ZOU, David Xiangping
IPC: C08L69/00
CPC classification number: C08L51/04 , C08F279/02 , C08F279/04 , C08K3/22 , C08K3/32 , C08K5/13 , C08K5/49 , C08K5/523 , C08K7/06 , C08L53/025 , C08L55/02 , C08L69/00 , C08L83/10 , C08L2666/14 , C08L2666/02 , C08L2666/24
Abstract: A flame retardant thermoplastic composition having excellent physical properties that includes 30 to 90 wt. % of a polycarbonate resin; from 1 to 35 wt. % of an impact modifier; from 0.1 to 15 wt. % of a phosphorus-containing flame retardant, from 1 to 30 wt. % of metal fiber, and from 0.002 to 5 wt. % of a processing additive, each based on the total combined weight of the thermoplastic composition, exclusive of any filler. The processing additive permits flame retardant characteristics to be maintained despite lower levels of flame retardant while the lower levels of flame retardant permit the compositions, and molded samples of these compositions, to have higher HDT and/or impact strengths as compared to compositions having higher levels of flame retardants. A molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.5 mm (±10%). The compositions are useful in forming flame retardant articles having EMI shielding characteristics.
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5.发明公开POLYCARBONATE/POLYOLEFIN BASED RESIN COMPOSITIONS AND THEIR PRODUCTION PROCESSES AND USES 有权的树脂组合物聚碳酸酯/聚烯烃BASIS和工艺体和用途PRODUCING
公开(公告)号：EP2121840A1
公开(公告)日：2009-11-25
申请号：EP07799681.7
申请日：2007-07-18
Applicant: SABIC Innovative Plastics IP B.V.
Inventor： LIN, Ye-Gang , SUN, Donghai , ZOU, David Xiangping
CPC classification number: C08F255/00 , C08F255/02 , C08F287/00 , C08L23/00 , C08L23/04 , C08L23/0869 , C08L23/0892 , C08L23/10 , C08L51/006 , C08L51/06 , C08L69/00 , C08L2666/18 , C08L2666/04 , C08L2666/02 , C08L2666/14 , C08L2666/06 , C08L23/26
Abstract: A method of making resin composition having excellent wear properties that includes 50 to 99 wt.% of a polycarbonate resin and from 1 to 50 wt.% of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.
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6.发明授权POLYCARBONATE/POLYOLEFIN BASED RESIN COMPOSITIONS AND THEIR PRODUCTION PROCESSES AND USES 有权的树脂组合物聚碳酸酯/聚烯烃BASIS和工艺体和用途PRODUCING
公开(公告)号：EP2121840B1
公开(公告)日：2014-05-28
申请号：EP07799681.7
申请日：2007-07-18
Applicant: SABIC Innovative Plastics IP B.V.
Inventor： LIN, Ye-Gang , SUN, Donghai , ZOU, David Xiangping
CPC classification number: C08F255/00 , C08F255/02 , C08F287/00 , C08L23/00 , C08L23/04 , C08L23/0869 , C08L23/0892 , C08L23/10 , C08L51/006 , C08L51/06 , C08L69/00 , C08L2666/18 , C08L2666/04 , C08L2666/02 , C08L2666/14 , C08L2666/06 , C08L23/26
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公开(公告)号：EP2291290B1
公开(公告)日：2012-03-21
申请号：EP09750255.3
申请日：2009-05-21
Applicant: SABIC Innovative Plastics IP B.V.
Inventor： LI, Frank , MENG, Jiru , ZOU, David Xiangping
CPC classification number: C08L55/02 , B41M5/24 , B41M5/267 , C08K3/22 , C08K5/5399 , C08L69/00 , C08L2666/14 , C08L2666/02 , C08L2666/24
Abstract: Flame retardant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic resin, a laser direct structuring additive, and a flame retardant. The compositions offer flame retardant characteristics while also substantially maintaining the mechanical properties of the base thermoplastic resin, such as the impact strength and/or HDT of the composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone and other such communications equipment.
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公开(公告)号：EP2291444A2
公开(公告)日：2011-03-09
申请号：EP09740754.8
申请日：2009-05-21
Applicant: SABIC Innovative Plastics IP B.V.
Inventor： LI, Frank , MENG, Jiru , ZOU, David Xiangping
CPC classification number: C23C18/204 , B41M5/267 , C08K3/01 , C08K3/34 , C23C18/1641 , H05K1/0373 , H05K3/185 , H05K2201/0129 , H05K2201/0209 , H05K2201/0236 , H05K2203/107
Abstract: High dielectric constant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic base resin, a laser direct structuring additive, and at least one ceramic filler. The compositions provide a high dielectric constant, low loss tangent thermoplastic composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.
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